Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1M7804-20DLG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 50MHz clock frequency. It has a small outline package and is suitable for commercial applications requiring synchronous operation and 15ns max access time.
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The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.
Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.
Synchronous operation ensures precise and consistent data transfer, enhancing overall performance and reliability.
High clock frequency allows for fast data processing and efficient operation, making the product suitable for high-speed applications.
High memory density allows for storage of a large amount of data, making the product suitable for applications requiring extensive data processing.
Output enable feature provides flexibility in controlling data output, allowing for easy integration with other components in the system.
FIFO 1M7804-20DLG4 attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Maximum Clock Frequency (fCLK):
JESD-30 Code:
JESD-609 Code:
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Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
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No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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1M7804-20DLG4 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hitano Enterprise
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Rectron
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
SN74ACT7204-40N
Texas Instruments
SN74ACT7204-40N by Texas Instruments is a 4Kx9 FIFO memory IC with 36864-bit memory density and 20 MHz max clock frequency. It operates asynchronously at a nominal voltage of 5V, making it ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V255LA15PFI8
Integrated Device Technology
IDT72V255LA15PFI8 by Integrated Device Technology is a FIFO memory with 8Kx18 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for industrial applications requiring fast synchronous data storage and retrieval in a compact flatpack package style.
SN74ACT3632-30PCB
SN74ACT3632-30PCB by Texas Instruments is a FIFO memory with 512x36 organization, operating at 30 ns cycle time and 33.4 MHz clock frequency. It is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ACT7201LA20NP
SN74ACT7201LA20NP by Texas Instruments is a FIFO with 512x9 organization, operating at 5V. It features an asynchronous mode, CMOS technology, and parallel interface. This device is ideal for applications requiring high-speed data transfer and memory management in commercial temperature environments.
SN74ACT72211L-20RJ
SN74ACT72211L-20RJ by Texas Instruments is a FIFO chip with 512x9 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V and has a max access time of 12ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CY7C4275V-15ASXC
Infineon Technologies
Infineon's CY7C4275V-15ASXC FIFO operates synchronously at 66.7MHz with 32Kx18 organization. Ideal for applications requiring fast data processing, it features a cycle time of 15ns and memory density of 589824 bits. The device supports parallel operation and has a low profile flatpack package style.
7202LA25SOI8
7202LA25SOI8 by Integrated Device Technology is a FIFO with 1KX9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is ideal for industrial applications requiring fast data processing and storage in a compact small outline package.
72V291L10TFG8
Renesas Electronics
The Renesas Electronics 72V291L10TFG8 FIFO operates synchronously with a cycle time of 10 ns and a clock frequency of up to 100 MHz. With a memory density of 1179648 bit, it is ideal for applications requiring fast data processing such as networking equipment and telecommunications devices. The device features parallel operation, low profile flatpack packaging, and a max operating temperature of 70°C.
SN74ABT7819A-12PH
SN74ABT7819A-12PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO memory IC with 80 terminals. It operates at a cycle time of 12ns and max clock frequency of 80MHz, suitable for synchronous applications. This PLASTIC/EPOXY package has a rectangular shape, GULL WING terminal form, and can be surface mounted.
SN74ACT72235-30PAG
SN74ACT72235-30PAG by Texas Instruments is a FIFO with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It operates in synchronous mode and has a memory density of 9216 bit. This device is suitable for applications requiring fast data transfer and reliable memory storage in commercial temperature environments.
7203L12J8
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V265LA10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
CD74HC40105E
General Electric Solid State
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
7283L12PAG
Renesas Electronics' 7283L12PAG FIFO operates at 50 MHz with a cycle time of 20 ns. It has a memory density of 18432 bit and is suitable for commercial applications requiring a small outline, thin profile package with dual terminal position.
72V2113L6PFG8
The Renesas Electronics 72V2113L6PFG8 is a FIFO memory with 256Kx18 organization, operating at 3.3V. It features a cycle time of 6ns and synchronous operation, suitable for applications requiring fast data processing such as networking equipment and telecommunications devices. The memory IC type is Other FIFO with parallel access mode and Gull Wing terminal form.
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
SN74ACT7200L-15NP
SN74ACT7200L-15NP by Texas Instruments is a FIFO memory IC with 256x9 organization, 25ns cycle time, and 40MHz clock frequency. It operates asynchronously at a supply voltage of 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7200L15SOGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
SN74ACT7201A-35N
SN74ACT7201A-35N by Texas Instruments is a FIFO with 512x9 organization, 45ns cycle time, and 22.2MHz max clock frequency. It operates synchronously at 5V and is ideal for parallel memory applications requiring fast access times in commercial temperature environments.
IDT7202LA35JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
1M7802-60PNG4
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
1M7804-20DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
1M7805-15DLG4
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SSOP56,.4;
1M7806-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
1M7807-15PAGG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Length: 10 mm;
1M7813-25DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
1M7814-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Access Time: 20 ns;
1M7881-20PNG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: NICKEL PALLADIUM GOLD;
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