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1M7804-20DLG4

Texas Instruments

1M7804-20DLG4 by Texas Instruments

1M7804-20DLG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 50MHz clock frequency. It has a small outline package and is suitable for commercial applications requiring synchronous operation and 15ns max access time.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,143 parts In-Stock

1+ parts

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2,143

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Vyrian

USA . 2,075 parts In-Stock

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2,075

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,815 parts In-Stock

1+ parts

$4.493

100+ parts

-

1k+ parts

$4.933

10k+ parts

-

1,815

$4.493

-

$4.933

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DigiPath Technology Company

USA . 2,013 parts In-Stock

1+ parts

$4.947

100+ parts

$4.551

1k+ parts

-

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2,013

$4.947

$4.551

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IDEA Electronic Components Group

UK . 1,933 parts In-Stock

1+ parts

$5.048

100+ parts

-

1k+ parts

$4.543

10k+ parts

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1,933

$5.048

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$4.543

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ChromeModa Solutions

Germany . 1,640 parts In-Stock

1+ parts

$5.048

100+ parts

$4.139

1k+ parts

-

10k+ parts

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1,640

$5.048

$4.139

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One Stop Electronics

USA . 350 parts In-Stock

1+ parts

$8.000

100+ parts

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350

$8.000

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AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$18.918

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846

$18.918

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Corphita

USA . 2,682 parts In-Stock

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2,682

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Northwest PG Solutions

USA . 2,266 parts In-Stock

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2,266

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Native Components

USA . 515 parts In-Stock

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515

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Overview

Experience seamless data management with the 1M7804-20DLG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This FIFO device is perfect for various applications, offering customers a high-value solution for efficient data storage and retrieval. With its advanced technology and optimal performance, the 1M7804-20DLG4 is a game-changer in the world of data management. Trust Texas Instruments to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and consistent data transfer, enhancing overall performance and reliability.

Maximum Clock Frequency (fCLK): 50 MHz

High clock frequency allows for fast data processing and efficient operation, making the product suitable for high-speed applications.

Memory Density: 9216 bit

High memory density allows for storage of a large amount of data, making the product suitable for applications requiring extensive data processing.

Output Enable: YES

Output enable feature provides flexibility in controlling data output, allowing for easy integration with other components in the system.

Technical Specifications

FIFO 1M7804-20DLG4 attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

50 MHz

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

1M7804-20DLG4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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