Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1M7804-20DLG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 50MHz clock frequency. It has a small outline package and is suitable for commercial applications requiring synchronous operation and 15ns max access time.
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Native Components
The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.
Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.
Synchronous operation ensures precise and consistent data transfer, enhancing overall performance and reliability.
High clock frequency allows for fast data processing and efficient operation, making the product suitable for high-speed applications.
High memory density allows for storage of a large amount of data, making the product suitable for applications requiring extensive data processing.
Output enable feature provides flexibility in controlling data output, allowing for easy integration with other components in the system.
FIFO 1M7804-20DLG4 attributes and parameters. Explore more FIFO devices from Texas Instruments
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1M7804-20DLG4 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1554216002
Molex
WIRE AND CABLE;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Diodes Incorporated
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
CD40105BE
Texas Instruments
CD40105BE by Texas Instruments is a FIFO IC with 16X4 organization, operating at 5V. It features 3-STATE output characteristics and can handle clock frequencies up to 1.5 MHz. Ideal for military-grade applications requiring asynchronous operation and a memory width of 4 bits.
IDT72V235L10TFG8
Renesas Electronics
IDT72V235L10TFG8 by Renesas Electronics is a 2Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. Ideal for applications requiring fast data transfer and memory management in commercial temperature environments.
CD74HCT40105EE4
CD74HCT40105EE4 by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density. It operates at a max clock frequency of 10 MHz and has an access time of 2250 ns. Ideal for military applications due to its temperature grade and synchronous operation mode.
72V235L10TFG8
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
72V263L6BCG8
Renesas Electronics 72V263L6BCG8 FIFO operates at 3.3V with 8Kx18 organization and 6ns cycle time. Suitable for commercial applications, it features a low profile grid array package with synchronous operation and parallel interface.
SN74ACT7201A-35N
SN74ACT7201A-35N by Texas Instruments is a FIFO with 512x9 organization, 45ns cycle time, and 22.2MHz max clock frequency. It operates synchronously at 5V and is ideal for parallel memory applications requiring fast access times in commercial temperature environments.
SN74ACT3622-15PQG4
SN74ACT3622-15PQG4 by Texas Instruments is a FIFO memory with 256x36 organization, operating at 66.7MHz cycle time of 15ns. It features a CMOS technology, suitable for parallel applications in commercial temperature range. The device has a package style of flatpack and bumper, with terminal finish in nickel palladium gold.
SN74ACT7201LA-35RJ
SN74ACT7201LA-35RJ by Texas Instruments is a FIFO chip with 512x9 organization, 45ns cycle time, and 22.2MHz clock frequency. It operates asynchronously at a supply voltage of 5V, making it ideal for high-speed data buffering applications in commercial temperature environments.
SN54ABT7819HT
SN54ABT7819HT by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 20ns and synchronous operation, suitable for military-grade applications requiring fast access times. This ceramic-metal sealed co-fired package has 84 terminals in a square shape, making it ideal for parallel data processing in harsh environments.
72V275L10PFG8
Renesas Electronics 72V275L10PFG8 FIFO operates at 100MHz with a cycle time of 10ns. It has an organization of 32KX18 and memory density of 589824 bit. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
72V265LA10TFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
IDT7200L25JI8
IDT7200L25JI8 by Integrated Device Technology is a FIFO chip with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in industrial applications requiring fast asynchronous data storage and retrieval capabilities.
7283L12PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G56;
SN74ACT3638-15PQ
SN74ACT3638-15PQ by Texas Instruments is a 512x32 FIFO memory IC with 15ns cycle time, operating at 66.7MHz clock frequency. It features a 3-STATE output and operates in synchronous mode. This CMOS technology device is ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
72V241L15PFGI
The Renesas Electronics 72V241L15PFGI FIFO operates at a cycle time of 15 ns with a clock frequency of up to 66.7 MHz. It has an organization of 4KX9 and is suitable for industrial applications requiring fast data processing and storage in parallel mode. The device features a low profile flatpack package with dimensions of 7mm x 7mm, making it ideal for space-constrained environments.
SN74ABT3613-30PQ
SN74ABT3613-30PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a commercial temperature grade. Ideal for applications requiring fast data storage and retrieval in parallel processing systems.
SN74ABT3614-20PCB
SN74ABT3614-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT72235-30PAGR
SN74ACT72235-30PAGR by Texas Instruments is a FIFO with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and synchronous operation, such as communication systems and networking equipment.
SN74ACT7201LA20DV
SN74ACT7201LA20DV by Texas Instruments is a FIFO chip with 512x9 organization, operating in asynchronous mode at 5V. It features a small outline package, Gull Wing terminal form, and CMOS technology. Ideal for applications requiring parallel memory storage with a capacity of 4608 bits.
7201LA12JG8
Renesas Electronics 7201LA12JG8 FIFO chip features 512x9 organization, operates at 50 MHz clock frequency, and has a cycle time of 20 ns. Ideal for applications requiring fast data storage and retrieval in commercial-grade temperature environments.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
1M7802-60PNG4
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
1M7804-20DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
1M7805-15DLG4
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SSOP56,.4;
1M7806-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
1M7807-15PAGG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Length: 10 mm;
1M7813-25DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
1M7814-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Access Time: 20 ns;
1M7881-20PNG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: NICKEL PALLADIUM GOLD;
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