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SN74ACT7200L-50RJR

Texas Instruments

SN74ACT7200L-50RJR by Texas Instruments

SN74ACT7200L-50RJR by Texas Instruments is a FIFO chip with 256x9 organization, 65ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a supply voltage of 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$2.112

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

750

-

$1.890

$1.690

$1.590

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.490

10k+ parts

-

750

-

-

$2.490

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.112

10k+ parts

$1.988

750

-

-

$2.112

$1.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,942 parts In-Stock

1+ parts

$1.986

100+ parts

-

1k+ parts

-

10k+ parts

-

3,942

$1.986

-

-

-

Vyrian

USA . 5,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,536

-

-

-

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DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$2.170

1k+ parts

-

10k+ parts

-

750

-

$2.170

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,913 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

2,913

$1.881

-

-

-

Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

$2.266

100+ parts

-

1k+ parts

$2.767

10k+ parts

-

1,762

$2.266

-

$2.767

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DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$2.495

100+ parts

$2.295

1k+ parts

-

10k+ parts

-

1,892

$2.495

$2.295

-

-

ChromeModa Solutions

Germany . 5,260 parts In-Stock

1+ parts

$2.546

100+ parts

$2.088

1k+ parts

-

10k+ parts

-

5,260

$2.546

$2.088

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$2.546

100+ parts

-

1k+ parts

$2.291

10k+ parts

-

1,940

$2.546

-

$2.291

-

Overview

Unlock the power of seamless data storage and retrieval with the SN74ACT7200L-50RJR FIFO chip by Texas Instruments. Built with top-of-the-line materials and cutting-edge technology, this asynchronous chip offers lightning-fast cycle times and a wide operating temperature range, making it ideal for a variety of applications. From industrial automation to telecommunications, this chip's 3-STATE output characteristics and high memory density ensure reliable performance in any setting. Invest in quality, reliability, and efficiency with the SN74ACT7200L-50RJR and experience the difference Texas Instruments brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 65 ns

Fast operation speed allows for quick data transfer and processing, increasing efficiency.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, making it easy to integrate into existing systems.

Output Characteristics: 3-STATE

Allows for flexible output options, enabling customization based on specific requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it energy efficient.

Technical Specifications

FIFO SN74ACT7200L-50RJR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Additional Features:

RETRANSMIT

Cycle Time:

65 ns

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

2304 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT7200L-50RJR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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