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SN74ACT3651-30PQ

Texas Instruments

SN74ACT3651-30PQ by Texas Instruments

SN74ACT3651-30PQ by Texas Instruments is a 2Kx36 BI-DIRECTIONAL FIFO memory IC with 30ns cycle time, operating at 5V. It features a max clock frequency of 33.4MHz and offers 3-STATE output characteristics. Ideal for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$24.670

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$24.670

1k+ parts

$22.070

10k+ parts

$20.780

3

-

$24.670

$22.070

$20.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,503 parts In-Stock

1+ parts

$26.049

100+ parts

-

1k+ parts

-

10k+ parts

-

3,503

$26.049

-

-

-

Vyrian

USA . 2,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,716

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 587 parts In-Stock

1+ parts

$5.167

100+ parts

-

1k+ parts

$5.768

10k+ parts

-

587

$5.167

-

$5.768

-

ChromeModa Solutions

Germany . 5,643 parts In-Stock

1+ parts

$5.806

100+ parts

$4.761

1k+ parts

-

10k+ parts

-

5,643

$5.806

$4.761

-

-

IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$5.806

100+ parts

-

1k+ parts

$5.225

10k+ parts

-

1,462

$5.806

-

$5.225

-

Corphita

USA . 4,155 parts In-Stock

1+ parts

$24.678

100+ parts

-

1k+ parts

-

10k+ parts

-

4,155

$24.678

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,921

-

-

-

-

Microchip USA

USA . 7,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,912

-

-

-

-

DigiPath Technology Company

USA . 658 parts In-Stock

1+ parts

-

100+ parts

$5.235

1k+ parts

-

10k+ parts

-

658

-

$5.235

-

-

Overview

Enhance your electronic projects with the SN74ACT3651-30PQ by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This FIFO memory device offers seamless data transfer at a blazing fast cycle time of 30 ns, making it ideal for applications requiring high-speed performance. Its 3-STATE output characteristics and bi-directional design ensure versatility and efficiency in managing data flow. With a nominal supply voltage of 5V and an operating temperature range from 0 to 70°C, this compact and durable component is a must-have for anyone seeking top-notch quality and performance in their designs. Elevate your projects with the SN74ACT3651-30PQ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred at a consistent rate, leading to reliable and predictable performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Maximum Clock Frequency (fCLK): 33.4 MHz

High clock frequency allows for fast data transfer rates, making this FIFO suitable for high-speed applications.

Memory Density: 73728 bit

High memory density allows for storage of a large amount of data, making it suitable for applications requiring extensive data buffering.

Technical Specifications

FIFO SN74ACT3651-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ACT3651-30PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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