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CD74HC40105MT

Texas Instruments

CD74HC40105MT by Texas Instruments

CD74HC40105MT by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and is suitable for military-grade applications requiring fast data storage and retrieval.

Median Price

$0.648

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$5.109

100+ parts

$4.649

1k+ parts

$4.189

10k+ parts

-

100

$5.109

$4.649

$4.189

-

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$0.636

1k+ parts

$0.528

10k+ parts

$0.470

750

-

$0.636

$0.528

$0.470

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.540

10k+ parts

-

750

-

-

$0.540

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.659

10k+ parts

$0.588

750

-

-

$0.659

$0.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.464

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.464

-

-

-

Digiode

USA . 2,540 parts In-Stock

1+ parts

$0.494

100+ parts

-

1k+ parts

-

10k+ parts

-

2,540

$0.494

-

-

-

Vyrian

USA . 7,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,625

-

-

-

-

DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 446 parts In-Stock

1+ parts

$0.442

100+ parts

-

1k+ parts

-

10k+ parts

-

446

$0.442

-

-

-

Argo Parts USA

USA . 3,886 parts In-Stock

1+ parts

$0.464

100+ parts

-

1k+ parts

-

10k+ parts

$0.450

3,886

$0.464

-

-

$0.450

Continental Prestige Electronics

USA . 3,070 parts In-Stock

1+ parts

$0.464

100+ parts

-

1k+ parts

-

10k+ parts

$0.454

3,070

$0.464

-

-

$0.454

Corphita

USA . 4,308 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

-

10k+ parts

-

4,308

$0.468

-

-

-

Parana Technologies

USA . 2,065 parts In-Stock

1+ parts

$3.804

100+ parts

-

1k+ parts

$4.294

10k+ parts

-

2,065

$3.804

-

$4.294

-

DigiPath Technology Company

USA . 2,197 parts In-Stock

1+ parts

$4.189

100+ parts

$3.853

1k+ parts

-

10k+ parts

-

2,197

$4.189

$3.853

-

-

IDEA Electronic Components Group

UK . 2,046 parts In-Stock

1+ parts

$4.274

100+ parts

-

1k+ parts

$3.847

10k+ parts

-

2,046

$4.274

-

$3.847

-

ChromeModa Solutions

Germany . 200 parts In-Stock

1+ parts

$4.274

100+ parts

$3.505

1k+ parts

-

10k+ parts

-

200

$4.274

$3.505

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.109

100+ parts

$4.649

1k+ parts

$4.189

10k+ parts

-

100

$5.109

$4.649

$4.189

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$5.135

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$5.135

-

-

-

Microchip USA

USA . 4,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,364

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.454

1k+ parts

$0.441

10k+ parts

$0.431

50

-

$0.454

$0.441

$0.431

Overview

Experience seamless data management with the Texas Instruments CD74HC40105MT FIFO memory. Designed with precision and reliability in mind, this product offers a wide range of applications in various industries. With a compact design and high-quality materials, this FIFO memory ensures optimal performance and efficiency. Trust Texas Instruments to deliver unparalleled value and benefits to meet your data storage needs effortlessly. Elevate your data management capabilities with the CD74HC40105MT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Cycle Time: 500 ns

The fast cycle time of 500 ns allows for efficient operation and data transfer.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization of data.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable performance of the device.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability in various environments.

Memory Width: 4

With a memory width of 4, this FIFO can efficiently store and retrieve data in parallel.

Output Enable: YES

The availability of output enable feature allows for better control and management of data output.

Technical Specifications

FIFO CD74HC40105MT attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

2250 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

500 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC40105MT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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