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CD74HC40105M96

Texas Instruments

CD74HC40105M96 by Texas Instruments

CD74HC40105M96 by Texas Instruments is a FIFO memory with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and has a temperature range of -55 to 125°C. Ideal for military applications requiring fast data storage and retrieval.

Median Price

$0.688

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,437 parts In-Stock

1+ parts

$0.890

100+ parts

$0.779

1k+ parts

$0.638

10k+ parts

$0.564

1,437

$0.890

$0.779

$0.638

$0.564

Rochester

USA . 6,817 parts In-Stock

1+ parts

-

100+ parts

$0.603

1k+ parts

$0.500

10k+ parts

$0.446

6,817

-

$0.603

$0.500

$0.446

DigiKey

USA . 6,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.750

10k+ parts

-

6,817

-

-

$0.750

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Verical

USA . 2,500 parts In-Stock

1+ parts

-

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$0.625

10k+ parts

$0.557

2,500

-

-

$0.625

$0.557

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,211 parts In-Stock

1+ parts

$0.408

100+ parts

-

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3,211

$0.408

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Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$0.433

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-

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56

$0.433

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Semi Source

USA . 5,725 parts In-Stock

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5,725

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Vyrian

USA . 3,851 parts In-Stock

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3,851

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Bristol Electronics

USA . 2,495 parts In-Stock

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2,495

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ComSIT Distribution GmbH

Germany . 2,325 parts In-Stock

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2,325

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ACDS - Activité Composants Distribution Service

France . 2,180 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2,104 parts In-Stock

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R&J Components

USA . 504 parts In-Stock

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504

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LWI Electronics Inc

India . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,805 parts In-Stock

1+ parts

$0.365

100+ parts

$0.356

1k+ parts

$0.354

10k+ parts

-

3,805

$0.365

$0.356

$0.354

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Component Stockers USA

USA . 16,284 parts In-Stock

1+ parts

$0.380

100+ parts

$0.360

1k+ parts

$0.290

10k+ parts

-

16,284

$0.380

$0.360

$0.290

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Corphita

USA . 3,212 parts In-Stock

1+ parts

$0.386

100+ parts

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3,212

$0.386

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

$0.433

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60

$0.433

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.433

100+ parts

$0.425

1k+ parts

-

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2,000

$0.433

$0.425

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Argo Parts USA

USA . 1,832 parts In-Stock

1+ parts

$0.433

100+ parts

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1k+ parts

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10k+ parts

$0.420

1,832

$0.433

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-

$0.420

Continental Prestige Electronics

USA . 168 parts In-Stock

1+ parts

$0.433

100+ parts

-

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$0.425

168

$0.433

-

-

$0.425

Parana Technologies

USA . 1,999 parts In-Stock

1+ parts

$4.061

100+ parts

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$4.526

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1,999

$4.061

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$4.526

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$4.472

100+ parts

$4.114

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1,780

$4.472

$4.114

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ChromeModa Solutions

Germany . 4,100 parts In-Stock

1+ parts

$4.563

100+ parts

$3.742

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4,100

$4.563

$3.742

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$4.563

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$4.107

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1,993

$4.563

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$4.107

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QUARKTWIN TECHNOLOGY LTD

USA . 14,083 parts In-Stock

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Perfect Parts

USA . 8,033 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,329 parts In-Stock

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Assy Fe

Spain . 4,599 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,219 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,379 parts In-Stock

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3,379

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Cyclops Electronics Ltd (Excess)

UK . 2,180 parts In-Stock

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2,180

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Glotronic Ltd.

UK . 1,744 parts In-Stock

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1,744

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Supply Digital

USA . 1,601 parts In-Stock

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1,601

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Overview

Elevate your applications with the CD74HC40105M96 by Texas Instruments. This FIFO memory IC offers unparalleled quality and reliability, backed by a trusted manufacturer. Whether you're working on industrial automation, telecommunications, or consumer electronics, this product delivers seamless operation with a cycle time of just 500 ns. With a compact design and versatile functionality, the CD74HC40105M96 is the perfect solution to optimize your system performance. Upgrade your projects today with this high-quality component that promises exceptional value and benefits for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product will last for a long time.

Cycle Time: 500 ns

The fast cycle time of 500 ns allows for quick data processing and transfer, making this FIFO product efficient.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures that data is transferred accurately and in sync, improving overall system functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this FIFO can withstand harsh environmental conditions and high temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this FIFO energy efficient and fast.

Technical Specifications

FIFO CD74HC40105M96 attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

2250 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

500 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC40105M96 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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