Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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72V821L15TFI8 by Integrated Device Technology is a FIFO memory with a cycle time of 15 ns and an operating frequency of up to 66.7 MHz. It is commonly used in industrial applications that require high-speed data buffering and storage.
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1k+
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Vyrian
Nova Conductors
Ampacity Inc.
$8.000
AZTECH Wire
$11.331
Continental Prestige Electronics
QUARKTWIN TECHNOLOGY LTD
Argo Parts USA
Aranea Global
Microchip USA
PLASTIC/EPOXY - This product's use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making it suitable for various environments.
YES - The surface mount design of this product allows for easy installation and integration onto PCBs, saving space and simplifying the manufacturing process.
15 ns - With a fast cycle time of 15 ns, this product offers quick and efficient data transfer, enhancing overall system performance.
1 - Having a single function simplifies the design and operation of the product, making it easier to implement and troubleshoot.
SQUARE - The square package shape provides uniformity and compatibility with common board layouts, enabling easy integration into existing systems.
SYNCHRONOUS - The synchronous operating mode ensures accurate data synchronization and reliable communication, making this product suitable for real-time applications.
3.3 - This product operates at a nominal supply voltage of 3.3V, offering compatibility with a wide range of systems and power sources.
3.3 - The use of a 3.3V power supply simplifies power management and reduces the need for additional voltage conversion circuitry.
64 - With 64 terminals, this product offers ample connectivity options for easy integration into various systems, ensuring compatibility and flexibility.
FLATPACK, LOW PROFILE, FINE PITCH - The flatpack, low profile, and fine pitch package style provides compactness, allowing for high-density mounting and improved board space utilization.
85 °C - The ability to operate under high temperatures up to 85°C makes this product suitable for demanding industrial environments where temperature fluctuations are common.
1KX9 - The organization of 1KX9 ensures a memory capacity of 1024 words with a width of 9 bits, providing sufficient storage capacity for data handling and processing.
40 °C - With a minimum operating temperature of -40°C, this product can withstand harsh operating conditions in cold environments, making it versatile and reliable.
TIN LEAD - The tin lead terminal finish offers reliable solderability and protection against oxidation, ensuring secure connections and extended product lifespan.
QUAD - The quad terminal position provides increased stability and mechanical strength, preventing terminal damage during installation and operation.
1.6 mm - The low maximum seated height allows for a compact and streamlined design, facilitating space optimization and efficient PCB layout.
66.7 MHz - With a high maximum clock frequency of 66.7 MHz, this product supports fast data transfer and processing, enhancing system performance and efficiency.
10 mm - The width of 10 mm offers a compact form factor, contributing to space-saving installations and efficient use of board real estate.
3 V - This product can operate at a minimum supply voltage of 3V, ensuring compatibility with lower power systems and reducing overall power consumption.
30 - The maximum time at peak reflow temperature of 30 seconds allows for safe and reliable soldering during the manufacturing process, ensuring proper connections and reducing component failure.
240 - With a peak reflow temperature of 240°C, this product can withstand high-temperature soldering processes, ensuring its reliability and long-term performance.
10 mm - The length of 10 mm contributes to the compact form factor, making this product suitable for space-constrained applications and systems.
INDUSTRIAL - The industrial temperature grade rating indicates that this product can operate reliably in a wide range of temperature conditions, ensuring its suitability for industrial applications.
CMOS - The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic families, making this product energy-efficient and versatile.
PARALLEL - The parallel data transfer mode allows for simultaneous transmission of multiple bits, enabling high-speed data transfer and efficient handling of large datasets.
GULL WING - The gull wing terminal form provides mechanical strength during installation and offers secure board attachment, ensuring reliable electrical connections.
40 mA - With a maximum supply current of 40 mA, this product operates efficiently with low power consumption, reducing overall system energy requirements.
1024 words - The product's capacity of 1024 words allows for the storage and retrieval of a significant amount of data, ensuring sufficient memory for various applications.
9 - The memory width of 9 bits allows for flexible data handling and processing, accommodating a wide range of data formats and enhancing system compatibility.
0.5 mm - The small terminal pitch of 0.5 mm facilitates high-density packaging, enabling efficient use of board space and supporting compact system designs.
1K - The use of a 1K words code provides a standardized memory capacity, ensuring compatibility and ease of integration with other systems and components.
3 - With an MSL of 3, this product can withstand moderate exposure to moisture, providing increased reliability and reducing the risk of performance degradation.
3.6 V - The maximum supply voltage of 3.6V allows for compatibility with higher power systems and offers a wider range of potential applications.
9216 bit - This product's memory density of 9216 bits ensures ample storage capacity for data, enabling efficient data handling and processing.
OTHER FIFO - This product being a FIFO (First-In-First-Out) memory IC type allows for organized data flow, ensuring sequential access and efficient queuing of data.
YES - The presence of an output enable feature allows for control over data output and enables optimal data processing and management.
0.01 Amp - With a maximum standby current of 0.01 Amp, this product maintains low power consumption during standby mode, contributing to energy efficiency and extended battery life.
10 ns - The fast maximum access time of 10 ns ensures rapid data retrieval and reduces bottlenecks in data transmission, enhancing overall system responsiveness.
FIFO 72V821L15TFI8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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72V821L15TFI8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
1552200168
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
2N7002DWH6327XTSA1
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
SMMBT3904LT1G
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
Digitron Semiconductors
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
SN74ACT3651-15PQR
Texas Instruments
SN74ACT3651-15PQR by Texas Instruments is a FIFO with 2KX36 organization, 15 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer such as networking equipment and telecommunications devices.
74HC40105D,653
NXP Semiconductors
NXP Semiconductors' 74HC40105D,653 FIFO chip operates asynchronously with a cycle time of 71.428 ns and a clock frequency of up to 14 MHz. This CMOS technology device has a memory width of 4 bits and is ideal for automotive applications due to its wide temperature range from -40°C to 125°C.
7203L15PI
Integrated Device Technology
7203L15PI FIFO by Integrated Device Technology features a cycle time of 25 ns, operating at 5V with an organization of 2KX9. Ideal for industrial applications, this CMOS technology device has a max clock frequency of 40 MHz and memory density of 18432 bit.
SN54ALS233AFK
SN54ALS233AFK by Texas Instruments is a 16x5 FIFO chip carrier with 40ns cycle time, operating at 25MHz clock frequency. Suitable for military applications due to its -55 to 125°C temperature range and synchronous operation mode. It features a 3-STATE output and NO LEAD terminal form for parallel data processing.
SN74ABT7819-20PH
SN74ABT7819-20PH by Texas Instruments is a 512x18 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial temperature environments.
SN74ABT3612-30PQR
SN74ABT3612-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and temporary storage in electronic systems.
72V211L15PFGI8
Renesas Electronics
The Renesas Electronics 72V211L15PFGI8 FIFO operates synchronously with a cycle time of 15 ns. It features a memory density of 4608 bit and an organization of 512X9, making it ideal for industrial applications requiring fast data processing. With a low profile flatpack package style and GULL WING terminal form, this FIFO is suitable for surface mount PCB designs in various electronic systems.
SN74ACT3642-15PCB
SN74ACT3642-15PCB by Texas Instruments is a FIFO memory with 1Kx36 organization, operating at 15ns cycle time and 66.7MHz clock frequency. It is used in applications requiring fast synchronous data transfer, such as networking equipment and telecommunications devices.
SN74ACT2235-30PMR
SN74ACT2235-30PMR by Texas Instruments is a FIFO with 1KX9 organization, 30 ns cycle time, and 3-STATE output characteristics. It operates at 5V, suitable for commercial applications requiring fast data transfer in parallel mode. The device comes in a square plastic/epoxy package with gull wing terminals and is surface mountable.
72V235L10TFG8
The Renesas Electronics 72V235L10TFG8 FIFO features a cycle time of 10 ns, operating at a max clock frequency of 100 MHz. With an organization of 2KX18, it is suitable for applications requiring fast data processing and synchronization in commercial-grade environments. The device offers parallel operation with a memory width of 18 bits and output enable functionality for efficient data management.
SN74ACT7201LA20NP
SN74ACT7201LA20NP by Texas Instruments is a FIFO with 512x9 organization, operating at 5V. It features an asynchronous mode, CMOS technology, and parallel interface. This device is ideal for applications requiring high-speed data transfer and memory management in commercial temperature environments.
SN74ACT7202-35N
SN74ACT7202-35N by Texas Instruments is a FIFO with 1Kx9 organization, 45ns cycle time, and 22MHz max clock frequency. It operates at 5V, has 28 terminals in an IN-LINE package style, and is ideal for parallel data storage applications.
SN74ACT72235-30PAGR
SN74ACT72235-30PAGR by Texas Instruments is a FIFO with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and synchronous operation, such as communication systems and networking equipment.
72V295L15PFI
72V295L15PFI by Integrated Device Technology is a FIFO with 128KX18 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for industrial applications requiring a memory density of 2359296 bit, with parallel operation and output enable feature.
SN74ABT7815-20PQ
SN74ABT7815-20PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with a max clock frequency of 50 MHz. Operating at 5V, it has a max access time of 12 ns and operates in synchronous mode. This device is commonly used in applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7201LA-50RJR
SN74ACT7201LA-50RJR by Texas Instruments is a FIFO chip with 512x9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is commonly used in applications requiring fast data storage and retrieval in parallel processing systems.
SN74ABT3611-30PQR
SN74ABT3611-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.
SN74ACT7204L-15DVR
SN74ACT7204L-15DVR by Texas Instruments is a 4Kx9 FIFO with 25ns cycle time and 15ns access time. It operates at 5V, has 28 terminals, and supports parallel mode. Ideal for applications requiring fast data transfer in commercial temperature environments.
CV245-10PAGG4
CV245-10PAGG4 by Texas Instruments is a 4Kx18 FIFO with 10ns cycle time, operating at 100MHz clock frequency. It features synchronous operation and GULL WING terminals. Ideal for applications requiring fast data transfer and memory management in commercial-grade devices.
IDT7202LA25PI
IDT7202LA25PI by Integrated Device Technology is a FIFO memory with 1KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. It operates in asynchronous mode and is suitable for industrial applications requiring fast data storage and retrieval. The memory IC type is Other FIFO with a memory density of 9216 bit, making it ideal for high-speed parallel data processing tasks.
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72V82L20PAGI8
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Density: 9216 bit;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
72V845L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Words Code: 4K;
72V845L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Maximum Access Time: 10 ns;
72V851L10PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
The Renesas Electronics 72V851L10PFG8 is a FIFO memory with 8Kx9 organization, operating at 100MHz clock frequency. It features a cycle time of 10ns and operates in synchronous mode. This low-profile flatpack device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V801L15PFGI8
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V;
72V821L20PFG8
The Renesas Electronics 72V821L20PFG8 is a FIFO memory with 1Kx9 organization, operating at 3.3V. It features a cycle time of 20ns and synchronous operation mode, suitable for applications requiring fast data processing such as networking equipment and telecommunications devices. The memory IC type is bi-directional FIFO with parallel interface and output enable functionality.
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Length: 14 mm;
72V82L15PAG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Output Enable: NO;
72V82L20PAGI
The Renesas Electronics 72V82L20PAGI is a small outline, thin profile, shrink pitch FIFO memory IC with a capacity of 1Kx9 words. It operates asynchronously at a max clock frequency of 33.3 MHz and has a temperature range of -40 to 85°C. This IC is commonly used in industrial applications that require high-speed data buffering and storage.
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
72V841L10PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
72V801L15PFI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
72V821L15TFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
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