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72V821L15TFI8

Integrated Device Technology

72V821L15TFI8 by Integrated Device Technology

72V821L15TFI8 by Integrated Device Technology is a FIFO memory with a cycle time of 15 ns and an operating frequency of up to 66.7 MHz. It is commonly used in industrial applications that require high-speed data buffering and storage.

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AZTECH Wire

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Continental Prestige Electronics

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QUARKTWIN TECHNOLOGY LTD

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Overview

Discover the 72V821L15TFI8 by Integrated Device Technology, a top-quality FIFO product that offers incredible value and benefits to customers. With its advanced technology and industrial-grade design, this FIFO is perfect for various applications. Whether you need fast data transfer, reliable performance, or efficient memory management, this product delivers it all. Experience seamless operations with its synchronous operating mode and impressive cycle time of 15ns. Say goodbye to compatibility issues and enjoy the advantages of its surface mount feature. Choose the 72V821L15TFI8 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product's use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making it suitable for various environments.

Surface Mount:

YES - The surface mount design of this product allows for easy installation and integration onto PCBs, saving space and simplifying the manufacturing process.

Cycle Time:

15 ns - With a fast cycle time of 15 ns, this product offers quick and efficient data transfer, enhancing overall system performance.

No. of Functions:

1 - Having a single function simplifies the design and operation of the product, making it easier to implement and troubleshoot.

Package Shape:

SQUARE - The square package shape provides uniformity and compatibility with common board layouts, enabling easy integration into existing systems.

Operating Mode:

SYNCHRONOUS - The synchronous operating mode ensures accurate data synchronization and reliable communication, making this product suitable for real-time applications.

Nominal Supply Voltage / Vsup (V):

3.3 - This product operates at a nominal supply voltage of 3.3V, offering compatibility with a wide range of systems and power sources.

Power Supplies (V):

3.3 - The use of a 3.3V power supply simplifies power management and reduces the need for additional voltage conversion circuitry.

No. of Terminals:

64 - With 64 terminals, this product offers ample connectivity options for easy integration into various systems, ensuring compatibility and flexibility.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - The flatpack, low profile, and fine pitch package style provides compactness, allowing for high-density mounting and improved board space utilization.

Maximum Operating Temperature:

85 °C - The ability to operate under high temperatures up to 85°C makes this product suitable for demanding industrial environments where temperature fluctuations are common.

Organization:

1KX9 - The organization of 1KX9 ensures a memory capacity of 1024 words with a width of 9 bits, providing sufficient storage capacity for data handling and processing.

Minimum Operating Temperature:

40 °C - With a minimum operating temperature of -40°C, this product can withstand harsh operating conditions in cold environments, making it versatile and reliable.

Terminal Finish:

TIN LEAD - The tin lead terminal finish offers reliable solderability and protection against oxidation, ensuring secure connections and extended product lifespan.

Terminal Position:

QUAD - The quad terminal position provides increased stability and mechanical strength, preventing terminal damage during installation and operation.

Maximum Seated Height:

1.6 mm - The low maximum seated height allows for a compact and streamlined design, facilitating space optimization and efficient PCB layout.

Maximum Clock Frequency (fCLK):

66.7 MHz - With a high maximum clock frequency of 66.7 MHz, this product supports fast data transfer and processing, enhancing system performance and efficiency.

Width:

10 mm - The width of 10 mm offers a compact form factor, contributing to space-saving installations and efficient use of board real estate.

Minimum Supply Voltage (Vsup):

3 V - This product can operate at a minimum supply voltage of 3V, ensuring compatibility with lower power systems and reducing overall power consumption.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds allows for safe and reliable soldering during the manufacturing process, ensuring proper connections and reducing component failure.

Peak Reflow Temperature °C:

240 - With a peak reflow temperature of 240°C, this product can withstand high-temperature soldering processes, ensuring its reliability and long-term performance.

Length:

10 mm - The length of 10 mm contributes to the compact form factor, making this product suitable for space-constrained applications and systems.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade rating indicates that this product can operate reliably in a wide range of temperature conditions, ensuring its suitability for industrial applications.

Technology:

CMOS - The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic families, making this product energy-efficient and versatile.

Parallel or Serial:

PARALLEL - The parallel data transfer mode allows for simultaneous transmission of multiple bits, enabling high-speed data transfer and efficient handling of large datasets.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength during installation and offers secure board attachment, ensuring reliable electrical connections.

Maximum Supply Current:

40 mA - With a maximum supply current of 40 mA, this product operates efficiently with low power consumption, reducing overall system energy requirements.

No. of Words:

1024 words - The product's capacity of 1024 words allows for the storage and retrieval of a significant amount of data, ensuring sufficient memory for various applications.

Memory Width:

9 - The memory width of 9 bits allows for flexible data handling and processing, accommodating a wide range of data formats and enhancing system compatibility.

Terminal Pitch:

0.5 mm - The small terminal pitch of 0.5 mm facilitates high-density packaging, enabling efficient use of board space and supporting compact system designs.

No. of Words Code:

1K - The use of a 1K words code provides a standardized memory capacity, ensuring compatibility and ease of integration with other systems and components.

Moisture Sensitivity Level (MSL):

3 - With an MSL of 3, this product can withstand moderate exposure to moisture, providing increased reliability and reducing the risk of performance degradation.

Maximum Supply Voltage (Vsup):

3.6 V - The maximum supply voltage of 3.6V allows for compatibility with higher power systems and offers a wider range of potential applications.

Memory Density:

9216 bit - This product's memory density of 9216 bits ensures ample storage capacity for data, enabling efficient data handling and processing.

Memory IC Type:

OTHER FIFO - This product being a FIFO (First-In-First-Out) memory IC type allows for organized data flow, ensuring sequential access and efficient queuing of data.

Output Enable:

YES - The presence of an output enable feature allows for control over data output and enables optimal data processing and management.

Maximum Standby Current:

0.01 Amp - With a maximum standby current of 0.01 Amp, this product maintains low power consumption during standby mode, contributing to energy efficiency and extended battery life.

Maximum Access Time:

10 ns - The fast maximum access time of 10 ns ensures rapid data retrieval and reduces bottlenecks in data transmission, enhancing overall system responsiveness.

Technical Specifications

FIFO 72V821L15TFI8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

10 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

72V821L15TFI8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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