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CY7C4275V-15ASXC

Infineon Technologies

CY7C4275V-15ASXC by Infineon Technologies

Infineon's CY7C4275V-15ASXC FIFO operates synchronously at 66.7MHz with 32Kx18 organization. Ideal for applications requiring fast data processing, it features a cycle time of 15ns and memory density of 589824 bits. The device supports parallel operation and has a low profile flatpack package style.

Median Price

$30.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 504 parts In-Stock

1+ parts

$30.630

100+ parts

$28.790

1k+ parts

$26.030

10k+ parts

$26.030

504

$30.630

$28.790

$26.030

$26.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 133 parts In-Stock

1+ parts

$29.098

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$29.098

-

-

-

Vyrian

USA . 669 parts In-Stock

1+ parts

$30.630

100+ parts

-

1k+ parts

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-

669

$30.630

-

-

-

Cyclops Electronics Ltd

UK . 60,250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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60,250

-

-

-

-

Flip Electronics

USA . 215 parts In-Stock

1+ parts

-

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-

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215

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Chip Stock

USA . 142 parts In-Stock

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142

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Nova Conductors

Japan . 19 parts In-Stock

1+ parts

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 800 parts In-Stock

1+ parts

$3.443

100+ parts

$3.305

1k+ parts

$3.168

10k+ parts

-

800

$3.443

$3.305

$3.168

-

Ampacity Inc.

Singapore . 208 parts In-Stock

1+ parts

$26.040

100+ parts

-

1k+ parts

-

10k+ parts

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208

$26.040

-

-

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Corphita

USA . 448 parts In-Stock

1+ parts

$27.567

100+ parts

-

1k+ parts

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448

$27.567

-

-

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Microchip USA

USA . 293 parts In-Stock

1+ parts

$150.000

100+ parts

-

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293

$150.000

-

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Argo Parts USA

USA . 4,472 parts In-Stock

1+ parts

-

100+ parts

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4,472

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QUARKTWIN TECHNOLOGY LTD

USA . 3,624 parts In-Stock

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100+ parts

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3,624

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

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Continental Prestige Electronics

USA . 2,700 parts In-Stock

1+ parts

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100+ parts

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2,700

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-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Formix International (Excess)

India . 41 parts In-Stock

1+ parts

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41

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Perfect Parts

USA . 31 parts In-Stock

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31

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Overview

Elevate your system performance with the CY7C4275V-15ASXC by Infineon Technologies. This FIFO memory device offers unmatched reliability and efficiency, thanks to its cutting-edge technology and superior craftsmanship. Ideal for a wide range of applications, this product delivers seamless data transfer and storage, ensuring smooth operation and enhanced productivity for your projects. Upgrade to the CY7C4275V-15ASXC today and experience the next level of performance and quality that only Infineon Technologies can provide.

Feature Benefit Bullets

Cycle Time: 15 ns

With a fast cycle time of 15 ns, this FIFO product is able to process data efficiently and quickly, making it a great choice for high-speed applications.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode allows for precise coordination of data transfer and processing, resulting in reliable performance and accurate data handling.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this FIFO product is compatible with commonly used power supplies, making it easy to integrate into various systems.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high maximum clock frequency of 66.7 MHz enables rapid data transfer and processing, making this FIFO product suitable for demanding applications that require fast operation.

Memory Density: 589824 bit

With a memory density of 589824 bit, this FIFO product offers ample storage capacity for data buffering and retrieval, making it ideal for applications with large data volumes.

Technical Specifications

FIFO CY7C4275V-15ASXC attributes and parameters. Explore more FIFO devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.004 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Trade Compliance

CY7C4275V-15ASXC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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