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CY7C4285V-15ASXI

Infineon Technologies

CY7C4285V-15ASXI by Infineon Technologies

CY7C4285V-15ASXI by Infineon Technologies is a 64Kx18 FIFO with 15ns cycle time, operating at 66.7MHz clock frequency. It features a low profile flatpack package and operates in industrial temperature range. Ideal for applications requiring fast synchronous data transfer with parallel interface.

Median Price

$26.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$26.250

100+ parts

$24.680

1k+ parts

$23.100

10k+ parts

-

500

$26.250

$24.680

$23.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 483 parts In-Stock

1+ parts

$27.712

100+ parts

-

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10k+ parts

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483

$27.712

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-

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Vyrian

USA . 681 parts In-Stock

1+ parts

$29.170

100+ parts

-

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681

$29.170

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Flip Electronics

USA . 238 parts In-Stock

1+ parts

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238

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Chip Stock

USA . 138 parts In-Stock

1+ parts

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138

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 224 parts In-Stock

1+ parts

$2.663

100+ parts

$2.556

1k+ parts

$2.450

10k+ parts

-

224

$2.663

$2.556

$2.450

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Corphita

USA . 878 parts In-Stock

1+ parts

$26.253

100+ parts

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878

$26.253

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Glotronic Ltd.

UK . 3,700 parts In-Stock

1+ parts

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3,700

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Alle Elektronik GmbH

Germany . 3,483 parts In-Stock

1+ parts

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3,483

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 340 parts In-Stock

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340

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Overview

Discover the CY7C4285V-15ASXI by Infineon Technologies, a top-quality FIFO product designed to meet your needs. With Infineon's reputation for excellence in manufacturing, you can trust in the reliability and performance of this device. Ideal for a wide range of applications, this FIFO offers seamless operation and efficient data handling. Experience the value and benefits of this product firsthand, providing you with a competitive edge in your projects. Choose the CY7C4285V-15ASXI and unlock a world of possibilities for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Cycle Time: 15 ns

Fast operation allows for quick data access and processing.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage for reliable functionality.

Maximum Clock Frequency (fCLK): 66.7 MHz

High clock frequency for efficient data transfer and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Output Enable: YES

Output enable feature allows for control of data output.

Technical Specifications

FIFO CY7C4285V-15ASXI attributes and parameters. Explore more FIFO devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Memory Density:

1179648 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.004 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Trade Compliance

CY7C4285V-15ASXI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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