Loading...

SN74ACT3642-30PQ

Texas Instruments

SN74ACT3642-30PQ by Texas Instruments

SN74ACT3642-30PQ by Texas Instruments is a FIFO memory with 1Kx36 organization, operating at 30 ns cycle time and 33.4 MHz clock frequency. It is ideal for applications requiring fast synchronous data transfer in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,009

-

-

-

-

Digiode

USA . 3,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,714

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,678 parts In-Stock

1+ parts

$5.028

100+ parts

-

1k+ parts

$5.582

10k+ parts

-

1,678

$5.028

-

$5.582

-

DigiPath Technology Company

USA . 760 parts In-Stock

1+ parts

$5.536

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$5.536

-

-

-

ChromeModa Solutions

Germany . 6,638 parts In-Stock

1+ parts

$5.649

100+ parts

$4.632

1k+ parts

-

10k+ parts

-

6,638

$5.649

$4.632

-

-

IDEA Electronic Components Group

UK . 1,337 parts In-Stock

1+ parts

$5.649

100+ parts

-

1k+ parts

$5.084

10k+ parts

-

1,337

$5.649

-

$5.084

-

One Stop Electronics

USA . 1,637 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,637

$12.000

-

-

-

AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$17.615

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$17.615

-

-

-

Corphita

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,340

-

-

-

-

Overview

Experience seamless data transfer with the Texas Instruments SN74ACT3642-30PQ FIFO memory IC. Crafted with precision and reliability in mind, this product offers a high-quality solution for various applications, ensuring fast and efficient performance. With its 3-STATE output characteristics and maximum clock frequency of 33.4 MHz, customers can trust in the value and benefits this device brings to their projects. Upgrade your system with this cutting-edge technology and witness the advantages it provides in terms of speed, reliability, and overall performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Cycle Time: 30 ns

Fast cycle time allows for efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with various systems.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer.

Maximum Clock Frequency (fCLK): 33.4 MHz

High clock frequency allows for fast data processing.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO design enables efficient data movement in both directions.

Technical Specifications

FIFO SN74ACT3642-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ACT3642-30PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20