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SN74V235-7PAG

Texas Instruments

SN74V235-7PAG by Texas Instruments

SN74V235-7PAG by Texas Instruments is a 2Kx18 FIFO with 7.5ns cycle time, operating at 166MHz clock frequency. It has a 3.3V nominal voltage and supports synchronous operation. Ideal for applications requiring fast data buffering in commercial temperature environments.

Median Price

$12.614

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,617 parts In-Stock

1+ parts

$10.929

100+ parts

$9.547

1k+ parts

$6.584

10k+ parts

-

2,617

$10.929

$9.547

$6.584

-

Mouser Electronics

USA . 354 parts In-Stock

1+ parts

$19.750

100+ parts

$15.010

1k+ parts

$15.000

10k+ parts

-

354

$19.750

$15.010

$15.000

-

Rochester

USA . 306 parts In-Stock

1+ parts

-

100+ parts

$10.870

1k+ parts

$9.720

10k+ parts

$9.150

306

-

$10.870

$9.720

$9.150

DigiKey

USA . 306 parts In-Stock

1+ parts

-

100+ parts

$14.300

1k+ parts

-

10k+ parts

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306

-

$14.300

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$9.663

100+ parts

-

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-

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83

$9.663

-

-

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Digiode

USA . 3,238 parts In-Stock

1+ parts

$9.975

100+ parts

-

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-

10k+ parts

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3,238

$9.975

-

-

-

Vyrian

USA . 6,025 parts In-Stock

1+ parts

-

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-

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6,025

-

-

-

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DigiKey Marketplace

USA . 529 parts In-Stock

1+ parts

-

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-

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529

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ACDS - Activité Composants Distribution Service

France . 57 parts In-Stock

1+ parts

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57

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LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

-

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

$3.576

100+ parts

$332.088

1k+ parts

$3.218

10k+ parts

-

1,332

$3.576

$332.088

$3.218

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$3.938

100+ parts

-

1k+ parts

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10k+ parts

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1,964

$3.938

-

-

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$4.018

100+ parts

-

1k+ parts

$3.616

10k+ parts

-

1,761

$4.018

-

$3.616

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ChromeModa Solutions

Germany . 625 parts In-Stock

1+ parts

$4.018

100+ parts

$3.295

1k+ parts

-

10k+ parts

-

625

$4.018

$3.295

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-

Semicontronic

India . 806 parts In-Stock

1+ parts

$8.080

100+ parts

$7.878

1k+ parts

$7.838

10k+ parts

-

806

$8.080

$7.878

$7.838

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Ampacity Inc.

Singapore . 534 parts In-Stock

1+ parts

$8.080

100+ parts

-

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534

$8.080

-

-

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Corphita

USA . 4,108 parts In-Stock

1+ parts

$9.450

100+ parts

-

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4,108

$9.450

-

-

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Continental Prestige Electronics

USA . 2,132 parts In-Stock

1+ parts

$9.663

100+ parts

-

1k+ parts

-

10k+ parts

$9.470

2,132

$9.663

-

-

$9.470

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.663

100+ parts

-

1k+ parts

$9.180

10k+ parts

$8.987

50

$9.663

-

$9.180

$8.987

Corohmni

South Africa . 221 parts In-Stock

1+ parts

$9.797

100+ parts

-

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-

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221

$9.797

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 4,982 parts In-Stock

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4,982

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-

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Argo Parts USA

USA . 2,566 parts In-Stock

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2,566

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Kepictronics

USA . 424 parts In-Stock

1+ parts

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424

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Cyclops Electronics Ltd (Excess)

UK . 57 parts In-Stock

1+ parts

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57

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Overview

Experience seamless data transfer with the Texas Instruments SN74V235-7PAG FIFO memory IC. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and reliability. This FIFO memory is perfect for applications requiring fast and synchronous data processing, offering a cycle time of 7.5 ns and a maximum clock frequency of 166 MHz. With a compact flatpack design and 2Kx18 organization, this memory IC provides high performance in a small package. Trust Texas Instruments to deliver cutting-edge technology that meets your data storage needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for reliable performance in various environments.

Cycle Time: 7.5 ns

Fast operation speed for efficient data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable voltage for power-efficient operation.

Maximum Clock Frequency (fCLK): 166 MHz

High clock frequency for quick data access.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Memory Density: 36864 bit

High memory density for storing large amounts of data efficiently.

Output Enable: YES

Ability to enable/disable output for better control over data flow.

Technical Specifications

FIFO SN74V235-7PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74V235-7PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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