Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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5962-8986305YA by Qp Semiconductor is a FIFO memory with a cycle time of 40 ns. It has an organization of 512X9 and a memory density of 4608 bit. This CMOS technology device operates in an asynchronous mode and is suitable for military applications.
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This fast cycle time ensures efficient and quick data access, making it suitable for high-speed data processing applications.
The rectangular package shape allows for easy integration and placement within electronic systems.
The asynchronous operating mode provides flexibility in data retrieval without being dependent on a clock signal, making it suitable for diverse applications.
The nominal supply voltage of 5V ensures stable and reliable operation of the product.
The ample number of terminals allows for easy connectivity and interfacing with other components in a system.
The in-line package style offers a compact and space-saving design.
The high maximum operating temperature tolerance ensures the product can withstand harsh environmental conditions.
The organization of 512x9 provides a good balance between storage capacity and data width, suitable for various applications.
The low minimum operating temperature tolerance allows for reliable operation even in cold environments.
The TIN LEAD terminal finish ensures good conductivity and solderability.
The dual terminal position offers flexibility in installation and connection options.
The minimum supply voltage requirement of 4.5V ensures the product can function even with slightly lower voltage inputs.
The military-grade temperature tolerance ensures reliable performance in demanding and rugged environments.
The CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable.
The parallel data transfer mode allows for faster data access and transmission in comparison to serial communication methods.
The through-hole terminal form provides reliable mechanical strength and robustness for secure connections.
The 512-word capacity provides ample storage for data processing and retrieval requirements.
The memory width of 9 bits allows for efficient handling of data with a good balance between granularity and capacity.
The 512-word code ensures compatibility and seamless integration with systems requiring specific memory configurations.
The maximum supply voltage tolerance of 5.5V provides a safety margin for voltage fluctuations and ensures reliable operation.
The high memory density of 4608 bits offers ample storage capacity for data-intensive applications.
The fast maximum access time of 30 ns ensures quick data retrieval and processing, contributing to high performance and efficiency.
FIFO 5962-8986305YA attributes and parameters. Explore more FIFO devices from Qp Semiconductor
Maximum Access Time:
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Memory Density:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Position:
5962-8986305YA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
P Semiconductor is a privately held California company incorporated in October 1985. QP Semiconductor was formed initially to provide semiconductor assembly, electrical test and qualification services to the military, aerospace and high reliability industries. The company has since evolved into a true fabless semiconductor company with a complete range of manufacturing capability by establishing product design and fab foundry relationships to complement its assembly, test and qualification capability. The products and services offered, focus on providing total parts solutions for DMS, (Diminished Manufacturing Sources) and EOL (End of Life) semiconductor components to the military, aerospace and high reliability markets. QP Semiconductor was acquired by British company e2v in October, 2008.
4554
Jw Miller Magnetics
Other Semiconductors;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
Vishay Semiconductors
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
Weitronic Enterprise
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
General Semiconductor
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SN74V263-6PZA
SN74V263-6PZA by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 166 MHz with a cycle time of 6 ns. It features synchronous operation, 3-state output characteristics, and a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
74HC7403D,512
NXP Semiconductors' 74HC7403D,512 FIFO chip operates at 5V with a cycle time of 83.33ns and supports a max clock frequency of 12MHz. Ideal for automotive applications, it features a memory width of 4 bits, output enable function, and offers a memory density of 256 bits.
SN74ABT3611-20PQ
SN74ABT3611-20PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a max access time of 12 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V3622L10PFG8
Integrated Device Technology
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
72V3650L6PFG8
Renesas Electronics
The Renesas Electronics 72V3650L6PFG8 FIFO operates synchronously with a cycle time of 6 ns and clock frequency up to 166 MHz. It has an organization of 2KX36, suitable for applications requiring fast data processing such as networking equipment and telecommunications systems. With a low profile flatpack package style, it offers parallel operation with output enable functionality.
5962-9560901QYA
The Texas Instruments 5962-9560901QYA is a MILITARY-grade BI-DIRECTIONAL FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at -55 to 125 °C and is ideal for high-speed data buffering in military applications.
5962-8952305EA
Teledyne E2v (uk)
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN74ACT2226DW
SN74ACT2226DW by Texas Instruments is a FIFO with 64x1 organization, operating at 60MHz clock frequency. It features a cycle time of 45.45ns and operates on a nominal voltage of 5V. Ideal for industrial applications requiring fast data storage and retrieval in a compact small outline package.
IDT72V265LA15TFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Access Time: 10 ns;
SN74ACT3632-15PQ
SN74ACT3632-15PQ by Texas Instruments is a FIFO memory IC with 512x36 organization, operating at 66.7 MHz with a cycle time of 15 ns. It features a parallel interface, synchronous operation, and output enable functionality. This device is commonly used in applications requiring fast data storage and retrieval in commercial temperature environments.
CD74HCT40105M96
CD74HCT40105M96 by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density and 10 MHz max clock frequency. Operating at -55 to 125 °C, it's ideal for military-grade applications requiring fast data storage and retrieval. With synchronous operation and output enable feature, this CMOS technology-based device offers reliable parallel data processing in compact small outline packaging.
IDT7203L15TPI
IDT7203L15TPI by Integrated Device Technology is a FIFO memory with 2Kx9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and is suitable for industrial applications requiring fast data storage and retrieval. With a package style of IN-LINE and through-hole terminal form, it offers reliable performance in harsh environments.
1O3614-30PQG4
1O3614-30PQG4 by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It operates synchronously in commercial temperature grade applications, featuring parallel technology and output enable functionality for high-speed data processing.
SN74ACT2236-40FNR
SN74ACT2236-40FNR by Texas Instruments is a FIFO chip with 2KX9 organization, 40 ns cycle time, and 35 ns max access time. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT2235-30PAG
SN74ACT2235-30PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 30 ns cycle time and 33 MHz clock frequency. It features a 64-terminal flatpack package suitable for parallel applications. With a supply voltage of 5V, it offers fast access times and output enable functionality for efficient data storage and retrieval.
SN74ABT7820-25PH
SN74ABT7820-25PH by Texas Instruments is a 512x18 FIFO with a cycle time of 25ns and max clock frequency of 40MHz. It operates synchronously at a nominal voltage of 5V, making it ideal for high-speed data buffering in commercial applications.
IDT72V3660L6PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Functions: 1;
SN74ABT3612-15PCB
SN74ABT3612-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15 ns cycle time, and 66.7 MHz clock frequency. It operates synchronously at 5V and has a low profile square package shape for applications requiring fast data storage and retrieval in commercial temperature environments.
CD74HC40105M96G4
CD74HC40105M96G4 by Texas Instruments is a FIFO memory with 16x4 organization, operating at 12 MHz clock frequency. It has a cycle time of 500 ns and can operate in synchronous mode. This small outline package is suitable for military-grade applications requiring fast data storage and retrieval.
SN74ALS232BN
SN74ALS232BN by Texas Instruments is a 16x4 FIFO with 25ns cycle time, operating at 5V. It features a max clock frequency of 40MHz and output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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5962-8986305YA
Atmel
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
Temic Semiconductors
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;
Renesas Electronics 5962-8986305YA FIFO operates at 25 MHz with 512x9 organization. Ideal for military applications, it has a cycle time of 40 ns and can withstand temperatures from -55 to 125 °C.
Teledyne E2v (Uk)
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;
Defense Logistics Agency
Cypress Semiconductor
Matra Mhs
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Qp Semiconductor
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Cycle Time: 100 ns;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
5962-9560801NXD
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: -55 Cel;
5962-9470401QXX
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Technology: BICMOS;
5962-9470401QXA
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Qualification: Qualified;
5962-9560801NXX
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
5962-01-164-5285
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
5962-01-354-8213
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
5962-8986302UX
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DFP; Package Shape: RECTANGULAR; Surface Mount: YES;
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