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SN74ACT2235-30PAG

Texas Instruments

SN74ACT2235-30PAG by Texas Instruments

SN74ACT2235-30PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 30 ns cycle time and 33 MHz clock frequency. It features a 64-terminal flatpack package suitable for parallel applications. With a supply voltage of 5V, it offers fast access times and output enable functionality for efficient data storage and retrieval.

Median Price

$13.400

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

$11.600

1k+ parts

$10.380

10k+ parts

$9.770

1,430

-

$11.600

$10.380

$9.770

DigiKey

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

$13.400

1k+ parts

-

10k+ parts

-

1,430

-

$13.400

-

-

Verical

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

$14.500

1k+ parts

$12.975

10k+ parts

$12.213

1,430

-

$14.500

$12.975

$12.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,623 parts In-Stock

1+ parts

$12.236

100+ parts

-

1k+ parts

-

10k+ parts

-

2,623

$12.236

-

-

-

Vyrian

USA . 4,282 parts In-Stock

1+ parts

$12.880

100+ parts

-

1k+ parts

-

10k+ parts

-

4,282

$12.880

-

-

-

DigiKey Marketplace

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,430

-

-

-

-

Pegasus Components GmbH

Germany . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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25

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,737 parts In-Stock

1+ parts

$3.712

100+ parts

-

1k+ parts

$4.214

10k+ parts

-

1,737

$3.712

-

$4.214

-

ChromeModa Solutions

Germany . 2,143 parts In-Stock

1+ parts

$4.171

100+ parts

$3.420

1k+ parts

-

10k+ parts

-

2,143

$4.171

$3.420

-

-

IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$4.171

100+ parts

-

1k+ parts

$3.754

10k+ parts

-

320

$4.171

-

$3.754

-

Corphita

USA . 3,635 parts In-Stock

1+ parts

$11.592

100+ parts

-

1k+ parts

-

10k+ parts

-

3,635

$11.592

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,039 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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17,039

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-

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Microchip USA

USA . 4,412 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,412

-

-

-

-

DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

-

100+ parts

$3.761

1k+ parts

-

10k+ parts

-

1,491

-

$3.761

-

-

Kepictronics

USA . 820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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820

-

-

-

-

Overview

Unlock the ultimate efficiency and reliability with the SN74ACT2235-30PAG FIFO by Texas Instruments. This top-notch product offers seamless data storage and retrieval, perfect for a wide range of applications. With Texas Instruments renowned quality and expertise in semiconductor manufacturing, you can trust that this FIFO will exceed your expectations. Experience lightning-fast cycle times, versatile operating modes, and robust 3-state output characteristics, all in a compact and durable package. Elevate your projects with the SN74ACT2235-30PAG and enjoy unparalleled performance and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for electronic components.

Surface Mount: YES

Easy to install and saves space on PCB.

Cycle Time: 30 ns

Fast data transfer speed, suitable for efficient FIFO operations.

Operating Mode: ASYNCHRONOUS

Supports multiple simultaneous access requests without synchronization.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for compatibility with most electronic systems.

No. of Terminals: 64

Sufficient terminals for connecting to other components.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, suitable for various environments.

Memory IC Type: BI-DIRECTIONAL FIFO

Supports bidirectional data transfer, enhancing data processing capabilities.

Technical Specifications

FIFO SN74ACT2235-30PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Additional Features:

BYPASS-XCVR

Maximum Clock Frequency (fCLK):

33 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74ACT2235-30PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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