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SN74ACT7200L50DV

Texas Instruments

SN74ACT7200L50DV by Texas Instruments

SN74ACT7200L50DV by Texas Instruments is a FIFO memory with 256x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a nominal voltage of 5V. This CMOS technology device is ideal for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.

Median Price

$2.112

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 819 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

819

-

$1.890

$1.690

$1.590

DigiKey

USA . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.490

10k+ parts

-

819

-

-

$2.490

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Verical

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.112

10k+ parts

$1.988

481

-

-

$2.112

$1.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,845 parts In-Stock

1+ parts

$1.986

100+ parts

-

1k+ parts

-

10k+ parts

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1,845

$1.986

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Vyrian

USA . 3,261 parts In-Stock

1+ parts

-

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3,261

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DigiKey Marketplace

USA . 819 parts In-Stock

1+ parts

-

100+ parts

$2.170

1k+ parts

-

10k+ parts

-

819

-

$2.170

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 433 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

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433

$1.881

-

-

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Parana Technologies

USA . 1,304 parts In-Stock

1+ parts

$3.121

100+ parts

$289.854

1k+ parts

$2.809

10k+ parts

-

1,304

$3.121

$289.854

$2.809

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DigiPath Technology Company

USA . 270 parts In-Stock

1+ parts

$3.437

100+ parts

-

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-

10k+ parts

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270

$3.437

-

-

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IDEA Electronic Components Group

UK . 2,229 parts In-Stock

1+ parts

$3.507

100+ parts

-

1k+ parts

$3.156

10k+ parts

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2,229

$3.507

-

$3.156

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ChromeModa Solutions

Germany . 268 parts In-Stock

1+ parts

$3.507

100+ parts

$2.876

1k+ parts

-

10k+ parts

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268

$3.507

$2.876

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Overview

Texas Instruments, a renowned manufacturer in the industry, presents the SN74ACT7200L50DV FIFO, a high-quality and reliable solution for your data organization needs. This FIFO device offers seamless operation in various applications with its asynchronous mode and 256x9 organization, providing customers with efficient data storage and retrieval. With a cycle time of 65 ns and a maximum clock frequency of 15 MHz, this product delivers fast performance while maintaining a low power consumption of only 80 mA. Trust Texas Instruments to deliver top-notch products like the SN74ACT7200L50DV that bring value, benefits, and advantages to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, ensuring a reliable and long-lasting product.

Cycle Time: 65 ns

Fast cycle time of 65 ns allows for quick and efficient data storage and retrieval, improving overall system performance.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and simultaneous data transfers, increasing efficiency and flexibility in data handling.

Nominal Supply Voltage / Vsup: 5V

Stable supply voltage of 5V ensures consistent and reliable operation of the FIFO memory.

No. of Terminals: 28

Ample number of terminals provide flexibility in connections and compatibility with various systems and applications.

Maximum Clock Frequency (fCLK): 15 MHz

High clock frequency of 15 MHz enables fast data transfer rates, improving system efficiency and performance.

Memory Density: 2304 bit

Large memory density of 2304 bit allows for storing a significant amount of data, making it suitable for applications requiring high capacity storage.

Maximum Access Time: 50 ns

Low access time of 50 ns ensures quick retrieval of data, reducing latency and improving overall system responsiveness.

Technical Specifications

FIFO SN74ACT7200L50DV attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

Cycle Time:

65 ns

JESD-30 Code:

R-PDSO-G28

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.45

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7200L50DV Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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