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SN74ABT3612-20PCB

Texas Instruments

SN74ABT3612-20PCB by Texas Instruments

SN74ABT3612-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is suitable for applications requiring fast synchronous data transfer in commercial-grade environments.

Median Price

$11.760

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$10.170

1k+ parts

$9.100

10k+ parts

$8.570

208

-

$10.170

$9.100

$8.570

DigiKey

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$11.760

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208

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$11.760

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Verical

USA . 194 parts In-Stock

1+ parts

-

100+ parts

$12.713

1k+ parts

$11.375

10k+ parts

$10.713

194

-

$12.713

$11.375

$10.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,830 parts In-Stock

1+ parts

$10.744

100+ parts

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2,830

$10.744

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Vyrian

USA . 5,320 parts In-Stock

1+ parts

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5,320

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DigiKey Marketplace

USA . 208 parts In-Stock

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208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 404 parts In-Stock

1+ parts

$3.049

100+ parts

-

1k+ parts

$3.563

10k+ parts

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404

$3.049

-

$3.563

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ChromeModa Solutions

Germany . 2,432 parts In-Stock

1+ parts

$3.426

100+ parts

$2.809

1k+ parts

-

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2,432

$3.426

$2.809

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IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$3.426

100+ parts

-

1k+ parts

$3.083

10k+ parts

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1,092

$3.426

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$3.083

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Corphita

USA . 2,959 parts In-Stock

1+ parts

$10.179

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2,959

$10.179

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DigiPath Technology Company

USA . 709 parts In-Stock

1+ parts

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100+ parts

$3.089

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709

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$3.089

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Microchip USA

USA . 372 parts In-Stock

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372

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Overview

Experience seamless data transfer and superior performance with the Texas Instruments SN74ABT3612-20PCB FIFO memory IC. Crafted with precision and expertise, this device offers a reliable solution for various applications in the electronics industry. With its efficient design and advanced features, this BI-DIRECTIONAL FIFO memory IC ensures quick and accurate data processing. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides unmatched value for your projects. Elevate your designs with the SN74ABT3612-20PCB and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.

Cycle Time: 20 ns

Fast cycle time of 20 ns ensures efficient operation and quick data transfer, making the product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred at a consistent pace, reducing the risk of data loss or errors.

Maximum Clock Frequency (fCLK): 50 MHz

High maximum clock frequency of 50 MHz allows for rapid data processing and smooth operation, making the product ideal for demanding tasks.

Technology: BICMOS

Utilizing Bipolar Complementary Metal Oxide Semiconductor (BiCMOS) technology offers the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO memory IC allows for efficient data transfer in both directions, enhancing the versatility and usability of the product.

Technical Specifications

FIFO SN74ABT3612-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ABT3612-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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