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SN74ACT7200L-15RJR

Texas Instruments

SN74ACT7200L-15RJR by Texas Instruments

SN74ACT7200L-15RJR by Texas Instruments is a FIFO chip with 256x9 organization, 25 ns cycle time, and 15 ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V, making it ideal for high-speed data buffering applications in commercial temperature environments.

Median Price

$6.175

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,750 parts In-Stock

1+ parts

-

100+ parts

$4.940

1k+ parts

$4.420

10k+ parts

$4.160

36,750

-

$4.940

$4.420

$4.160

DigiKey

USA . 36,750 parts In-Stock

1+ parts

-

100+ parts

$6.500

1k+ parts

-

10k+ parts

-

36,750

-

$6.500

-

-

Verical

USA . 36,750 parts In-Stock

1+ parts

-

100+ parts

$6.175

1k+ parts

$5.525

10k+ parts

$5.200

36,750

-

$6.175

$5.525

$5.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,341 parts In-Stock

1+ parts

$5.216

100+ parts

-

1k+ parts

-

10k+ parts

-

4,341

$5.216

-

-

-

Vyrian

USA . 1,285 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

$5.490

-

-

-

DigiKey Marketplace

USA . 36,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 274 parts In-Stock

1+ parts

$4.614

100+ parts

-

1k+ parts

$5.083

10k+ parts

-

274

$4.614

-

$5.083

-

Corphita

USA . 3,079 parts In-Stock

1+ parts

$4.941

100+ parts

-

1k+ parts

-

10k+ parts

-

3,079

$4.941

-

-

-

ChromeModa Solutions

Germany . 4,684 parts In-Stock

1+ parts

$5.184

100+ parts

$4.251

1k+ parts

-

10k+ parts

-

4,684

$5.184

$4.251

-

-

IDEA Electronic Components Group

UK . 1,891 parts In-Stock

1+ parts

$5.184

100+ parts

-

1k+ parts

$4.666

10k+ parts

-

1,891

$5.184

-

$4.666

-

Component Stockers USA

USA . 69,554 parts In-Stock

1+ parts

$5.640

100+ parts

$5.300

1k+ parts

$4.790

10k+ parts

$4.790

69,554

$5.640

$5.300

$4.790

$4.790

DigiPath Technology Company

USA . 486 parts In-Stock

1+ parts

-

100+ parts

$4.674

1k+ parts

-

10k+ parts

-

486

-

$4.674

-

-

Overview

Elevate your electronics projects with the SN74ACT7200L-15RJR FIFO by Texas Instruments. Known for their high-quality products, Texas Instruments delivers unmatched reliability and performance in the field of FIFO technology. This versatile chip carrier offers a wide range of applications, from data buffering to memory interfacing, making it a valuable asset for any project. With fast cycle times and 3-state output characteristics, this device ensures smooth operation and seamless integration. Trust Texas Instruments to provide the cutting-edge technology you need to bring your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Cycle Time: 25 ns

Offers fast and efficient data transfer, making the product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Works effectively within the standard voltage range, ensuring compatibility with most systems.

No. of Terminals: 32

Plenty of terminals for connecting to other components, increasing versatility and functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

FIFO SN74ACT7200L-15RJR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

RETRANSMIT

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

2304 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT7200L-15RJR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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