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IDT7203L25JI8

Integrated Device Technology

IDT7203L25JI8 by Integrated Device Technology

IDT7203L25JI8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 28.5MHz clock frequency and 35ns cycle time. It is designed for industrial applications requiring fast asynchronous data storage and retrieval in parallel mode.

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AZTECH Wire

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Overview

Experience seamless data transfer and enhanced efficiency with the IDT7203L25JI8 FIFO chip by Integrated Device Technology. As a leader in semiconductor solutions, IDT guarantees top-notch quality and reliability in every product. Ideal for a wide range of applications, this FIFO chip offers fast cycle times, asynchronous operation, and a 2Kx9 organization. With a maximum clock frequency of 28.5 MHz and a low power consumption of only 120mA, this chip ensures optimal performance while saving energy. Upgrade your system today with the IDT7203L25JI8 and enjoy smooth data handling like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Cycle Time: 35 ns

Fast cycle time allows for efficient data transfer and processing.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for synchronization, increasing flexibility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

No. of Words: 2048 words

Offers a large memory capacity for storing data efficiently.

Technical Specifications

FIFO IDT7203L25JI8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.55 mm

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.43 mm

Trade Compliance

IDT7203L25JI8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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