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SN74ABT7819-10PH

Texas Instruments

SN74ABT7819-10PH by Texas Instruments

SN74ABT7819-10PH by Texas Instruments is a 512x18 Bi-directional FIFO with 10ns cycle time, operating at up to 100MHz. It features a synchronous mode and operates on a 5V supply voltage. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

$28.520

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,792 parts In-Stock

1+ parts

-

100+ parts

$28.520

1k+ parts

-

10k+ parts

-

2,792

-

$28.520

-

-

Rochester

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

$24.670

1k+ parts

$22.070

10k+ parts

$20.780

2,777

-

$24.670

$22.070

$20.780

Verical

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

$30.837

1k+ parts

$27.587

10k+ parts

$25.975

2,777

-

$30.837

$27.587

$25.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 535 parts In-Stock

1+ parts

$26.049

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$26.049

-

-

-

Vyrian

USA . 1,633 parts In-Stock

1+ parts

$27.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$27.420

-

-

-

DigiKey Marketplace

USA . 2,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,792

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,099 parts In-Stock

1+ parts

$2.028

100+ parts

-

1k+ parts

$2.553

10k+ parts

-

2,099

$2.028

-

$2.553

-

ChromeModa Solutions

Germany . 2,945 parts In-Stock

1+ parts

$2.279

100+ parts

$1.869

1k+ parts

-

10k+ parts

-

2,945

$2.279

$1.869

-

-

IDEA Electronic Components Group

UK . 1,536 parts In-Stock

1+ parts

$2.279

100+ parts

-

1k+ parts

$2.051

10k+ parts

-

1,536

$2.279

-

$2.051

-

Ampacity Inc.

Singapore . 2,558 parts In-Stock

1+ parts

$23.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

$23.310

-

-

-

Corphita

USA . 1,585 parts In-Stock

1+ parts

$24.678

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

$24.678

-

-

-

Component Stockers USA

USA . 2,207 parts In-Stock

1+ parts

$28.460

100+ parts

$26.750

1k+ parts

$24.190

10k+ parts

-

2,207

$28.460

$26.750

$24.190

-

Microchip USA

USA . 362 parts In-Stock

1+ parts

$65.600

100+ parts

$64.460

1k+ parts

$63.880

10k+ parts

$63.310

362

$65.600

$64.460

$63.880

$63.310

DigiPath Technology Company

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

$2.055

1k+ parts

-

10k+ parts

-

2,340

-

$2.055

-

-

Overview

Enhance your electronic designs with the SN74ABT7819-10PH FIFO by Texas Instruments. Known for their top-quality components, Texas Instruments delivers unmatched reliability and performance. This FIFO device is perfect for applications requiring fast data transfer, offering a cycle time of just 10 ns and a maximum clock frequency of 100 MHz. With a memory density of 9216 bits and a bidirectional design, this product boasts versatility and efficiency. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SN74ABT7819-10PH FIFO today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.

Cycle Time: 10 ns

Fast cycle time ensures quick data access and transfer, making the product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronized data flow, ensuring accurate data processing.

Nominal Supply Voltage/Vsup: 5V

Stable supply voltage of 5V ensures consistent performance of the product under various operating conditions.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options and flexibility for integrating the product into different systems.

Maximum Clock Frequency (fCLK): 100 MHz

High clock frequency allows for efficient data processing and transfer, making the product suitable for demanding applications.

Memory Density: 9216 bit

High memory density provides ample storage capacity for data, allowing the product to handle large amounts of information efficiently.

Output Enable: YES

Output enable feature allows for convenient control of data output, enhancing the product's flexibility in data management.

Technical Specifications

FIFO SN74ABT7819-10PH attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

9 ns

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.1 mm

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ABT7819-10PH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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