Loading...

SN74ACT2235-35FN

Texas Instruments

SN74ACT2235-35FN by Texas Instruments

SN74ACT2235-35FN by Texas Instruments is a 2Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output, and a memory density of 18432 bits. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,521

-

-

-

-

Digiode

USA . 2,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 29 parts In-Stock

1+ parts

$2.560

100+ parts

-

1k+ parts

$3.049

10k+ parts

-

29

$2.560

-

$3.049

-

ChromeModa Solutions

Germany . 3,327 parts In-Stock

1+ parts

$2.876

100+ parts

$2.358

1k+ parts

-

10k+ parts

-

3,327

$2.876

$2.358

-

-

IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$2.876

100+ parts

-

1k+ parts

$2.588

10k+ parts

-

723

$2.876

-

$2.588

-

AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$14.008

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$14.008

-

-

-

One Stop Electronics

USA . 943 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$28.000

-

-

-

Corphita

USA . 3,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,798

-

-

-

-

DigiPath Technology Company

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$2.593

1k+ parts

-

10k+ parts

-

599

-

$2.593

-

-

Overview

Elevate your electronics with the SN74ACT2235-35FN by Texas Instruments, a top-tier FIFO chip designed to optimize data storage and retrieval. Crafted with precision and expertise, this chip boasts superior quality and reliability that only a trusted manufacturer like Texas Instruments can deliver. Perfect for a wide range of applications, from telecommunications to industrial automation, this chip offers lightning-fast cycle times, synchronous operation, and 3-state output characteristics. Experience the seamless integration and high performance that this chip brings, all while ensuring maximum efficiency and productivity in your projects. Choose the SN74ACT2235-35FN for unparalleled value and unbeatable advantages in data management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, making it ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Cycle Time: 25 ns

The fast cycle time of 25 ns ensures quick and efficient data access and retrieval, enhancing overall system performance.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures synchronized data transfer, reducing the likelihood of data errors and improving system reliability.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a standard and commonly available power source, making the product compatible with a wide range of systems.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and compatibility with various interfaces and systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and performance in a wide range of operating conditions.

Memory Width: 9

With a memory width of 9, the product can store and retrieve data efficiently, suitable for applications requiring moderate memory capacity.

Technical Specifications

FIFO SN74ACT2235-35FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Cycle Time:

25 ns

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

44

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

SN74ACT2235-35FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20