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SN74V245-7PAG

Texas Instruments

SN74V245-7PAG by Texas Instruments

SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.

Median Price

$15.306

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,793 parts In-Stock

1+ parts

$11.071

100+ parts

$9.670

1k+ parts

$6.669

10k+ parts

-

5,793

$11.071

$9.670

$6.669

-

Mouser Electronics

USA . 749 parts In-Stock

1+ parts

$19.540

100+ parts

$15.010

1k+ parts

$14.590

10k+ parts

-

749

$19.540

$15.010

$14.590

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DigiKey

USA . 249 parts In-Stock

1+ parts

$19.540

100+ parts

$17.127

1k+ parts

$15.599

10k+ parts

-

249

$19.540

$17.127

$15.599

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Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$10.790

1k+ parts

$9.660

10k+ parts

$9.090

31

-

$10.790

$9.660

$9.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$9.592

100+ parts

-

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54

$9.592

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Digiode

USA . 2,681 parts In-Stock

1+ parts

$9.908

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-

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2,681

$9.908

-

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Vyrian

USA . 1,848 parts In-Stock

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1,848

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,026 parts In-Stock

1+ parts

$2.466

100+ parts

$229.023

1k+ parts

$2.220

10k+ parts

-

2,026

$2.466

$229.023

$2.220

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DigiPath Technology Company

USA . 1,447 parts In-Stock

1+ parts

$2.716

100+ parts

-

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1,447

$2.716

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-

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$2.771

100+ parts

-

1k+ parts

$2.494

10k+ parts

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1,065

$2.771

-

$2.494

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ChromeModa Solutions

Germany . 904 parts In-Stock

1+ parts

$2.771

100+ parts

$2.272

1k+ parts

-

10k+ parts

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904

$2.771

$2.272

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Semicontronic

India . 1,540 parts In-Stock

1+ parts

$8.870

100+ parts

$8.648

1k+ parts

$8.604

10k+ parts

-

1,540

$8.870

$8.648

$8.604

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Ampacity Inc.

Singapore . 1,413 parts In-Stock

1+ parts

$8.870

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1,413

$8.870

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Corphita

USA . 4,125 parts In-Stock

1+ parts

$9.387

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4,125

$9.387

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Continental Prestige Electronics

USA . 6,540 parts In-Stock

1+ parts

$9.592

100+ parts

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10k+ parts

$9.400

6,540

$9.592

-

-

$9.400

Corohmni

South Africa . 207 parts In-Stock

1+ parts

$10.670

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207

$10.670

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Lixinc

USA . 11,614 parts In-Stock

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11,614

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Argo Parts USA

USA . 2,257 parts In-Stock

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2,257

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$9.400

1k+ parts

$9.112

10k+ parts

$8.920

2,000

-

$9.400

$9.112

$8.920

Perfect Parts

USA . 636 parts In-Stock

1+ parts

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636

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74V245-7PAG FIFO memory IC. This versatile component offers seamless data transfer with a fast cycle time of 7.5 ns, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum clock frequency of 166 MHz, this IC delivers exceptional performance while maintaining low power consumption. Trust in Texas Instruments for cutting-edge technology and unmatched value in memory solutions. Elevate your designs with the SN74V245-7PAG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and allows for easy handling during installation and maintenance.

Cycle Time: 7.5 ns

Fast cycle time ensures quick data transfer and efficient operation.

Nominal Supply Voltage / Vsup (V): 3.3

Stable 3.3V supply voltage ensures reliable performance and compatibility with standard power sources.

Maximum Clock Frequency (fCLK): 166 MHz

High maximum clock frequency allows for rapid data processing and throughput.

Memory Density: 73728 bit

High memory density enables storage of a large amount of data in a compact form factor.

Output Enable: YES

Output enable feature provides flexibility in controlling data output and helps in optimizing power consumption.

Technical Specifications

FIFO SN74V245-7PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74V245-7PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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