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SN74ACT2236-40FNR

Texas Instruments

SN74ACT2236-40FNR by Texas Instruments

SN74ACT2236-40FNR by Texas Instruments is a FIFO chip with 2KX9 organization, 40 ns cycle time, and 35 ns max access time. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,984 parts In-Stock

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4,984

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Vyrian

USA . 1,959 parts In-Stock

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1,959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 75 parts In-Stock

1+ parts

$3.692

100+ parts

-

1k+ parts

$4.196

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75

$3.692

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$4.196

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DigiPath Technology Company

USA . 285 parts In-Stock

1+ parts

$4.065

100+ parts

$3.740

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285

$4.065

$3.740

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ChromeModa Solutions

Germany . 6,663 parts In-Stock

1+ parts

$4.148

100+ parts

$3.401

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6,663

$4.148

$3.401

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IDEA Electronic Components Group

UK . 1,176 parts In-Stock

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$4.148

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$3.733

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1,176

$4.148

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$3.733

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AZTECH Wire

Italy . 778 parts In-Stock

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$15.939

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778

$15.939

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One Stop Electronics

USA . 1,069 parts In-Stock

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$17.000

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1,069

$17.000

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Corphita

USA . 1,071 parts In-Stock

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1,071

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Overview

Enhance your electronic projects with the SN74ACT2236-40FNR FIFO chip by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that guarantees superior performance. This versatile FIFO chip, operating in synchronous mode with a cycle time of 40ns, is perfect for applications requiring fast data transfer and storage. With a memory density of 18432 bits and 2048 words, this chip offers excellent value and benefits to customers looking for efficient data handling solutions. Upgrade your projects today with the SN74ACT2236-40FNR for seamless data processing and storage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material makes the package lightweight and durable, while EPOXY provides protection against moisture and corrosion.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Cycle Time: 40 ns

Fast operation with a low cycle time, ensuring efficient data storage and retrieval.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer reliability and synchronization within the system.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltage standards, making it easy to integrate into existing systems.

No. of Terminals: 44

Sufficient terminals for connecting to other components and peripherals, offering flexibility in system configuration.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides compact size and excellent heat dissipation, ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

Can operate reliably in a wide temperature range, making it suitable for various environments.

Organization: 2KX9

Organized in 2Kx9 configuration for efficient data organization and retrieval.

Output Characteristics: 3-STATE

3-state output allows for multiple states (high-impedance, logic 0, and logic 1), providing flexibility in interfacing with other components.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without compromising performance, ensuring reliability in various conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy installation and maintenance, reducing the risk of connection errors.

Memory Density: 18432 bit

High memory density allows for storing a large amount of data in a compact form factor, maximizing storage capacity.

Output Enable: YES

Output enable feature provides control over data output, enhancing system flexibility and power efficiency.

Technical Specifications

FIFO SN74ACT2236-40FNR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

35 ns

Additional Features:

IT CAN OPERATES ASYNCHRONOUS MODE ALSO

Cycle Time:

40 ns

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

44

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

SN74ACT2236-40FNR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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