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SN74ACT7201LA15DV

Texas Instruments

SN74ACT7201LA15DV by Texas Instruments

SN74ACT7201LA15DV by Texas Instruments is a FIFO memory IC with 512x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$5.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 75 parts In-Stock

1+ parts

$5.010

100+ parts

$4.910

1k+ parts

$4.810

10k+ parts

-

75

$5.010

$4.910

$4.810

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,128 parts In-Stock

1+ parts

-

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4,128

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Digiode

USA . 2,556 parts In-Stock

1+ parts

-

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-

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2,556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 525 parts In-Stock

1+ parts

$5.250

100+ parts

-

1k+ parts

$5.869

10k+ parts

-

525

$5.250

-

$5.869

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DigiPath Technology Company

USA . 1,321 parts In-Stock

1+ parts

$5.781

100+ parts

-

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1,321

$5.781

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ChromeModa Solutions

Germany . 6,278 parts In-Stock

1+ parts

$5.899

100+ parts

$4.837

1k+ parts

-

10k+ parts

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6,278

$5.899

$4.837

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$5.899

100+ parts

-

1k+ parts

$5.309

10k+ parts

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95

$5.899

-

$5.309

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$12.506

100+ parts

-

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223

$12.506

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One Stop Electronics

USA . 834 parts In-Stock

1+ parts

$15.000

100+ parts

-

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834

$15.000

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Ampacity Inc.

Singapore . 1,089 parts In-Stock

1+ parts

$26.000

100+ parts

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1,089

$26.000

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Component Stockers USA

USA . 463 parts In-Stock

1+ parts

$99.990

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463

$99.990

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Corphita

USA . 2,218 parts In-Stock

1+ parts

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2,218

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Microchip USA

USA . 1,643 parts In-Stock

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1,643

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Overview

Unlock seamless data transfer and streamline your system with the SN74ACT7201LA15DV FIFO by Texas Instruments. With a reputation for top-quality components, Texas Instruments delivers reliable products that ensure peak performance. This FIFO device offers lightning-fast cycle times of 25ns, operating in asynchronous mode at a clock frequency of up to 40MHz. Ideal for a wide range of applications, this small outline package is perfect for projects requiring high-speed data processing. Trust in Texas Instruments to provide advanced technology that exceeds expectations and enhances your workflow.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable packaging solution for the FIFO product.

Cycle Time: 25 ns

Offers fast data transfer and processing speed, making it suitable for applications requiring quick response times.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without being synchronized to an external clock signal, offering flexibility in use.

Nominal Supply Voltage / Vsup (V): 5

Provides stable power supply for the FIFO product to operate efficiently.

Maximum Clock Frequency (fCLK): 40 MHz

Supports high-speed clocking for rapid data handling and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Memory Width: 9

Provides a wider memory width for storing and accessing data efficiently.

Maximum Access Time: 15 ns

Ensures quick access to stored data, enhancing the performance of the FIFO product.

Technical Specifications

FIFO SN74ACT7201LA15DV attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PDSO-G28

Memory Density:

4608 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.45

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7201LA15DV Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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