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SN74ACT2235-20FNR

Texas Instruments

SN74ACT2235-20FNR by Texas Instruments

SN74ACT2235-20FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 20ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is commonly used in applications requiring fast data storage and retrieval with parallel access.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,821 parts In-Stock

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5,821

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Digiode

USA . 4,786 parts In-Stock

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4,786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,450 parts In-Stock

1+ parts

$3.925

100+ parts

-

1k+ parts

$4.398

10k+ parts

-

1,450

$3.925

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$4.398

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ChromeModa Solutions

Germany . 1,034 parts In-Stock

1+ parts

$4.410

100+ parts

$3.616

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-

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1,034

$4.410

$3.616

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IDEA Electronic Components Group

UK . 44 parts In-Stock

1+ parts

$4.410

100+ parts

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$3.969

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44

$4.410

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$3.969

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AZTECH Wire

Italy . 672 parts In-Stock

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$14.118

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672

$14.118

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One Stop Electronics

USA . 970 parts In-Stock

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$27.000

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970

$27.000

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Corphita

USA . 3,337 parts In-Stock

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3,337

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DigiPath Technology Company

USA . 980 parts In-Stock

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$3.976

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980

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$3.976

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Overview

Unlock seamless data transfer and storage with the SN74ACT2235-20FNR by Texas Instruments. This FIFO device offers unparalleled quality and reliability, thanks to the renowned manufacturer's commitment to excellence. Perfect for a wide range of applications, this chip carrier package ensures efficient data handling with its 1Kx9 organization and 3-STATE output characteristics. Experience faster cycle times, reliable operation, and easy integration into your system with the SN74ACT2235-20FNR. Elevate your projects with Texas Instruments' cutting-edge technology and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Cycle Time: 20 ns

The fast cycle time ensures efficient operation and quick access to data, making it ideal for time-sensitive applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent and flexible data handling, making the product versatile and adaptable to different systems.

No. of Terminals: 44

The high number of terminals allows for more connections and flexibility in the system design, making the product suitable for complex applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

FIFO SN74ACT2235-20FNR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Additional Features:

BYPASS-XCVR

Cycle Time:

20 ns

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

Memory Density:

9216 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.585 mm

Trade Compliance

SN74ACT2235-20FNR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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