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SN74ACT2226DWR

Texas Instruments

SN74ACT2226DWR by Texas Instruments

SN74ACT2226DWR by Texas Instruments is a FIFO with 64x1 organization, operating at 60MHz clock frequency. It has a cycle time of 45.45ns and can function in industrial temperature grades. This device is ideal for applications requiring high-speed data storage and retrieval in compact electronic systems.

Median Price

$4.680

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.620

10k+ parts

$3.410

4,000

-

$4.050

$3.620

$3.410

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$4.680

1k+ parts

-

10k+ parts

-

4,000

-

$4.680

-

-

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

4,000

-

$5.063

$4.525

$4.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 860 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$4.275

-

-

-

Vyrian

USA . 2,711 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

2,711

$4.500

-

-

-

DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,121 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

-

10k+ parts

-

4,121

$4.050

-

-

-

Parana Technologies

USA . 804 parts In-Stock

1+ parts

$5.284

100+ parts

-

1k+ parts

$5.911

10k+ parts

-

804

$5.284

-

$5.911

-

DigiPath Technology Company

USA . 1,263 parts In-Stock

1+ parts

$5.818

100+ parts

$5.353

1k+ parts

-

10k+ parts

-

1,263

$5.818

$5.353

-

-

ChromeModa Solutions

Germany . 5,049 parts In-Stock

1+ parts

$5.937

100+ parts

$4.868

1k+ parts

-

10k+ parts

-

5,049

$5.937

$4.868

-

-

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$5.937

100+ parts

-

1k+ parts

$5.343

10k+ parts

-

2,034

$5.937

-

$5.343

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,486

-

-

-

-

Microchip USA

USA . 478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

478

-

-

-

-

Overview

Experience seamless data transfer and efficient memory management with the Texas Instruments SN74ACT2226DWR FIFO. Crafted with precision and expertise by a trusted manufacturer, this high-quality device offers reliable performance in various applications. Whether you're looking to streamline your data processing or enhance your system's efficiency, this FIFO delivers exceptional value with its advanced features and optimal functionality. Upgrade your technology with the SN74ACT2226DWR and experience the benefits of top-notch performance and seamless operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components, making it suitable for various industrial environments.

Cycle Time: 45.45 ns

Fast cycle time ensures efficient operation and data transfer within the FIFO, making it ideal for applications requiring quick response times.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most systems and ensures stable performance.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this FIFO can withstand harsh environmental conditions without compromising functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FIFO energy-efficient and reliable for long-term use.

Technical Specifications

FIFO SN74ACT2226DWR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

60 MHz

Cycle Time:

45.45 ns

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X1

Output Characteristics:

TOTEM POLE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT2226DWR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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