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SN74ACT2236-20PAG

Texas Instruments

SN74ACT2236-20PAG by Texas Instruments

SN74ACT2236-20PAG by Texas Instruments is a 2Kx9 FIFO with 3-STATE output, operating at 5V. It features a flatpack package style, 0.5mm terminal pitch, and GULL WING terminals. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,229 parts In-Stock

1+ parts

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5,229

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Digiode

USA . 1,602 parts In-Stock

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1,602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 625 parts In-Stock

1+ parts

$1.928

100+ parts

-

1k+ parts

$2.464

10k+ parts

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625

$1.928

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$2.464

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DigiPath Technology Company

USA . 928 parts In-Stock

1+ parts

$2.123

100+ parts

$1.953

1k+ parts

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928

$2.123

$1.953

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ChromeModa Solutions

Germany . 6,218 parts In-Stock

1+ parts

$2.166

100+ parts

$1.776

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6,218

$2.166

$1.776

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IDEA Electronic Components Group

UK . 1,468 parts In-Stock

1+ parts

$2.166

100+ parts

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1k+ parts

$1.949

10k+ parts

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1,468

$2.166

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$1.949

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AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$9.776

100+ parts

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862

$9.776

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One Stop Electronics

USA . 507 parts In-Stock

1+ parts

$25.000

100+ parts

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507

$25.000

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Corphita

USA . 3,590 parts In-Stock

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3,590

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Overview

Unlock seamless data transfer and storage with the SN74ACT2236-20PAG by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers a high-performance FIFO device that is perfect for a wide range of applications. Experience the convenience of synchronous operation and 3-state output characteristics in a compact package that is easy to integrate into your designs. Elevate your projects with the value and reliability that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures accurate and timely data transfer.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with a standard supply voltage of 5V.

No. of Terminals: 64

With 64 terminals, the product can handle a high amount of data efficiently.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design allow for a compact and space-saving solution.

Organization: 2KX9

The 2KX9 organization provides a good balance between storage capacity and access speed.

Output Characteristics: 3-STATE

The 3-STATE output allows for high flexibility in data transmission.

Terminal Position: QUAD

The quad terminal position enables easy connections and reduces signal interference.

Maximum Seated Height: 1.2 mm

The low seated height makes the product suitable for compact electronic devices.

Width: 10 mm

The 10mm width ensures compatibility with standard spacing on circuit boards.

Length: 10 mm

The 10mm length provides a balanced form factor for the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: PARALLEL

The parallel operation allows for faster data transfers compared to serial communication.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections on the circuit board.

No. of Words: 2048 words

With 2048 words capacity, the product can store a significant amount of data.

Memory Width: 9

The memory width of 9 bits allows for efficient data processing.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides high density and reliable connections.

No. of Words Code: 2K

The 2K words code indicates the high storage capacity of the product.

Memory Density: 18432 bit

The high memory density of 18432 bits enables storage of large amounts of information.

Technical Specifications

FIFO SN74ACT2236-20PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

64

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Organization:

2KX9

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SN74ACT2236-20PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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