Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.
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This material provides durability and protection for the components inside, making it a reliable choice for long-term use.
The surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
With a fast cycle time, this FIFO can quickly process and transfer data, enhancing the overall performance of the system.
The rectangular shape of the package makes it easy to integrate into various designs and layouts, offering flexibility in use.
The asynchronous operating mode enables independent operations without the need for synchronization, improving efficiency and simplifying design.
The 5V supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.
With 32 terminals, this FIFO can accommodate a wide range of connections, providing versatility in application.
The chip carrier style offers compactness and protection for the components, making it suitable for space-constrained environments.
The high maximum operating temperature allows for reliable performance in various environmental conditions, making it suitable for industrial use.
The 512x9 organization provides a balance between storage capacity and data width, offering efficient data handling and storage capabilities.
The low minimum operating temperature ensures the FIFO can function effectively in cold environments, expanding its range of applications.
The matte tin finish provides corrosion resistance and promotes good electrical conductivity, ensuring long-term reliability.
The quad terminal position allows for easy connection and compatibility with standard interfaces, facilitating integration into systems.
The low seated height of 3.55mm saves space and allows for compact designs, making it ideal for applications with limited vertical clearance.
The compact width of 11.43mm enables tight placement on circuit boards, maximizing space efficiency in the overall system design.
The 4.5V minimum supply voltage ensures stable operation even under lower voltage conditions, enhancing the reliability of the product.
The length of 13.97mm provides a balance between compactness and accessibility, making it easy to integrate into various system configurations.
The industrial temperature grade ensures reliable operation in harsh environments, making it suitable for demanding industrial applications.
The CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable performance.
The parallel data transfer mode enables high-speed communication and efficient data handling, enhancing system performance.
The J bend terminal form allows for secure connections and reliable contact, ensuring stable data transfer and operation.
The maximum supply current of 80mA ensures efficient power consumption and helps prevent overheating, contributing to the longevity of the product.
The 512-word capacity provides ample storage for data handling and processing, making it suitable for applications with moderate storage requirements.
The memory width of 9 bits allows for efficient data processing and storage, supporting a wide range of applications and data types.
The terminal pitch of 1.27mm offers compatibility with standard spacing requirements, ensuring easy integration into existing systems.
The 512-word code allows for efficient data organization and management, simplifying data retrieval and processing tasks.
The maximum supply voltage of 5.5V provides a safety margin for voltage fluctuations, enhancing the durability and reliability of the product.
The memory density of 4608 bits offers ample storage capacity for various data types, supporting versatile applications and data processing tasks.
The fast maximum access time of 25ns ensures quick data retrieval and processing, enhancing the overall performance and efficiency of the system.
FIFO 7201LA25JGI8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
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7201LA25JGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
EEAGA1H4R7
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
SN74ACT2236-30FN
Texas Instruments
SN74ACT2236-30FN by Texas Instruments is a 2Kx9 BI-DIRECTIONAL FIFO chip carrier with 3-STATE output, operating at 33MHz with a cycle time of 30.3ns. Ideal for industrial applications, it features synchronous operation and a memory density of 18432 bits, making it suitable for high-speed parallel data transfer.
72V801L15PFI8
Integrated Device Technology
72V801L15PFI8 by Integrated Device Technology is a FIFO with 256x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. Ideal for industrial applications requiring fast data processing and synchronous operation in a compact FLATPACK package.
CV215-10PAGG4
CV215-10PAGG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 100 MHz clock frequency. It has a cycle time of 10 ns and is used in applications requiring fast synchronous data storage and retrieval. The device features a thin profile flatpack package with gull wing terminals, suitable for commercial temperature grade environments.
SN74ACT72235-30FNR
SN74ACT72235-30FNR by Texas Instruments is a FIFO chip with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square plastic/epoxy package with 44 terminals for surface mount installation.
SN74ACT7204-40N
SN74ACT7204-40N by Texas Instruments is a 4Kx9 FIFO memory IC with 36864-bit memory density and 20 MHz max clock frequency. It operates asynchronously at a nominal voltage of 5V, making it ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CD40105BEE4
CD40105BEE4 by Texas Instruments is a FIFO IC with 16x4 organization, operating at 1.5MHz clock frequency. It has a memory width of 4 bits and can operate in parallel mode. This CMOS technology device is ideal for military-grade applications requiring fast access times and low power consumption.
SN74ACT2236-60PAG
SN74ACT2236-60PAG by Texas Instruments is a 64-terminal FIFO with 2Kx9 organization, operating at 5V. It features a flatpack, thin profile package and offers 3-state output characteristics. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.
7201LA25SOI8
7201LA25SOI8 by Integrated Device Technology is a FIFO memory with 512x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in a compact small outline package.
72V243L6BCG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Memory Density: 36864 bit;
7203L12JG8
Renesas Electronics
Renesas Electronics 7203L12JG8 is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It has a cycle time of 20 ns and supports parallel mode. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT3622-20PQR
SN74ACT3622-20PQR by Texas Instruments is a FIFO with 256x36 organization, operating at 20 ns cycle time. It features 3-STATE output characteristics and synchronous operation mode, suitable for applications requiring fast data transfer and storage in commercial temperature environments. With a package style of FLATPACK, BUMPER and GULL WING terminal form, it offers parallel data processing with a memory width of 36 bits.
5962-8986305YA
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;
SN74ACT53861PZ
SN74ACT53861PZ by Texas Instruments is a FIFO memory IC with 4Kx18 organization, operating at 50 MHz with a cycle time of 20 ns. It features synchronous operation, 3-STATE output characteristics, and parallel interface. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3614-15PQR
SN74ABT3614-15PQR by Texas Instruments is a FIFO with 64x36 organization, 15 ns cycle time, and 10 ns max access time. It operates synchronously at 5V and has a memory density of 2304 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74V215-10PAG
SN74V215-10PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz. It features a cycle time of 10 ns and operates at a nominal voltage of 3.3V. This device is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ABT7815-25PCB
SN74ABT7815-25PCB by Texas Instruments is a 128x36 bi-directional FIFO memory IC with 40MHz clock frequency, operating at 5V. It features synchronous operation, GULL WING terminals, and a flatpack package style. Ideal for applications requiring fast data access and storage in commercial temperature environments.
SN74ABT3613PCB
SN74ABT3613PCB by Texas Instruments is a FIFO with 64x36 organization, operating at 5V. It has a cycle time of 30ns and max access time of 15ns. This synchronous device in a square package is ideal for applications requiring fast data storage and retrieval.
CD74HC40105E
CD74HC40105E by Texas Instruments is a 16x4 FIFO memory IC with 500ns cycle time, operating at 10MHz clock frequency. It has 3-state output characteristics and supports parallel operation. Ideal for military-grade applications requiring fast data storage and retrieval in a compact IN-LINE package.
72V271LA15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
5962-9560801QYA
The Texas Instruments 5962-9560801QYA FIFO features a cycle time of 20ns, operating at a supply voltage of 5V. With an organization of 1KX36 and memory density of 36864 bits, it is ideal for military applications requiring fast access times and synchronous operation. The device is designed with a ceramic, glass-sealed package body material and operates within a wide temperature range from -55 to 125°C.
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7201LA15SOGI8
Renesas Electronics' 7201LA15SOGI8 FIFO features 512x9 organization, 25ns cycle time, and operates at a nominal voltage of 5V. Ideal for industrial applications requiring fast data access with parallel operation in a compact small outline package.
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
7201LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Enable: NO;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Additional Features: RETRANSMIT;
7201LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7201LA12SOG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 20 ns;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
7201LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
7201LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
7201LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 4608 bit;
7201LA35JG8
FIFOs;
7201LA35SOG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
7201LA15DGI
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
7201LA25J8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .0005 Amp;
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