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72V261LA10PFG8

Integrated Device Technology

72V261LA10PFG8 by Integrated Device Technology

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

Median Price

$68.352

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$68.352

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$68.352

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VNN

France . 2,890 parts In-Stock

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2,890

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Vyrian

USA . 549 parts In-Stock

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549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$18.556

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$18.556

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Ampacity Inc.

Singapore . 1,494 parts In-Stock

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$25.000

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Aranea Global

USA . 2,000 parts In-Stock

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$66.985

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$64.306

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2,000

$66.985

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$64.306

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Continental Prestige Electronics

USA . 1,415 parts In-Stock

1+ parts

$68.352

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$66.985

1,415

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$66.985

QUARKTWIN TECHNOLOGY LTD

USA . 22,872 parts In-Stock

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Microchip USA

USA . 3,077 parts In-Stock

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Argo Parts USA

USA . 1,742 parts In-Stock

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1,742

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Technical Specifications

FIFO 72V261LA10PFG8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

6.5 ns

Additional Features:

RETRANSMIT

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Memory Density:

147456 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

64

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

72V261LA10PFG8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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