Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
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$6.000
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$19.158
Component Stockers USA
$99.990
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Microchip USA
The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making this product ideal for applications where portability and reliability are required.
With surface mount capability, this product can be easily integrated onto circuit boards, simplifying the assembly process and increasing efficiency.
The low cycle time of 35 ns ensures fast and efficient data transfer, making this product suitable for high-speed applications that require quick response times.
This product incorporates a single function, allowing for streamlined implementation and reducing complexity in system design.
The rectangular package shape allows for space-efficient integration into circuit boards, optimizing the use of available layout area.
The asynchronous operating mode enables independent, non-synchronized data transfers, providing flexibility and versatility in various system architectures.
With a nominal supply voltage of 5V, this product is compatible with standard power supply systems, ensuring easy integration into existing setups.
The availability of power supplies at 5V ensures stable and reliable operation, minimizing the risk of performance issues or data loss.
The 32 terminals allow for the connection of various external components, expanding the functionality and possibilities of the product.
The chip carrier package style provides a compact and efficient form factor, facilitating space-saving integration in applications with limited board space.
The ability to operate at a maximum temperature of 70°C enhances the product's reliability and durability in demanding environments.
The organization of 1Kx9 signifies that this product is capable of storing 1 kilobit of data in a 9-word structure, catering to data storage requirements in various scenarios.
The product's ability to operate at a minimum temperature of 0°C allows for reliable performance in colder environments.
The use of tin lead terminal finish ensures excellent solderability and corrosion resistance, contributing to the product's long-term reliability.
The quad terminal positioning allows for easy and secure connections, reducing the risk of loose or unreliable connections.
With a maximum seated height of 3.55 mm, this product offers a compact profile, making it suitable for applications with height limitations.
The high maximum clock frequency of 28.5 MHz enables efficient and rapid data processing, facilitating real-time applications and reducing latency.
The product's width of 11.43 mm provides a compact form factor, allowing for easy integration and placement within confined spaces.
The minimum supply voltage requirement of 4.5V ensures compatibility with various power supply configurations, enhancing the flexibility of implementation.
With a maximum time at peak reflow temperature of 20 seconds, this product can undergo reliable soldering processes, ensuring secure connections during assembly.
The peak reflow temperature of 225°C enables the product to withstand the rigors of soldering processes, ensuring proper bonding and connection integrity.
The product's length of 13.97 mm offers a compact size, optimizing board space utilization and allowing for efficient integration.
The commercial temperature grade indicates that this product is designed and guaranteed to operate within standard commercial temperature ranges, making it suitable for most non-extreme applications.
Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and increased reliability, positioning it as an efficient and robust choice for various applications.
The parallel configuration allows for simultaneous data transfer, offering high bandwidth and enhanced performance for applications that require rapid data processing.
The J bend terminal form ensures secure and reliable electrical connections, minimizing the risk of signal loss or intermittent contact.
The maximum supply current of 125 mA ensures efficient power usage, reducing energy consumption and enabling longer battery life in portable applications.
With a capacity of storing 1024 words, this product offers ample memory space, accommodating large amounts of data for various applications.
The memory width of 9 signifies that each word in the memory structure consists of 9 bits, catering to applications that require storing or processing data in this format.
The terminal pitch of 1.27mm allows for precise and efficient connections, contributing to overall product reliability and ease of use.
The use of a 1K code indicates that this product supports a memory capacity of 1 kilobit, meeting the data storage requirements in a wide range of applications.
With a moisture sensitivity level of 1, this product can withstand standard moisture exposure conditions, ensuring its reliability and longevity.
The maximum supply voltage of 5.5V allows for a wider range of power supply options, providing flexibility and compatibility with various system configurations.
With a memory density of 9216 bits, this product offers substantial data storage capacity, accommodating large amounts of information for diverse applications.
The use of a FIFO (First-In, First-Out) memory IC type enhances data management efficiency, making it a suitable choice for applications that require sequential data processing and retrieval.
With a maximum standby current of 0.0005 Amp, this product minimizes power consumption during idle periods, optimizing energy efficiency and extending battery life.
The low maximum access time of 25 ns ensures quick and efficient data retrieval, enabling high-speed operations in time-critical applications.
FIFO 7202LA25J8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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7202LA25J8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Packaging - All Dev Label Chg 1/Dec/2022
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Fairchild Semiconductor
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IDT7202LA35SO8
Integrated Device Technology
IDT7202LA35SO8 by Integrated Device Technology is a FIFO with 1KX9 organization, 45 ns cycle time, and 22.2 MHz clock frequency. It operates at 5V, has a small outline package style, and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V235L10TFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ACT72235-20FNR
SN74ACT72235-20FNR by Texas Instruments is a FIFO chip with 1KX9 organization, 1024 words, and 9216 bit memory density. It operates synchronously at a cycle time of 20 ns and has an output enable feature. This chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3632-20PCB
SN74ACT3632-20PCB by Texas Instruments is a FIFO memory IC with 512x36 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It features a low profile flatpack package suitable for commercial temperature grade applications.
SN74ACT3632-20PQR
SN74ACT3632-20PQR by Texas Instruments is a FIFO with 512x36 organization, operating at 20 ns cycle time. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bit. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT7820-25PN
SN74ABT7820-25PN by Texas Instruments is a FIFO memory IC with 512x18 organization, 25 ns cycle time, and 40 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7203L15TPI
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
72V211L15PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
IDT72V271LA10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Length: 14 mm;
IDT72V3623L10PFG8
Renesas Electronics
IDT72V3623L10PFG8 by Renesas Electronics is a FIFO with 256x36 organization, operating synchronously at 10 ns cycle time. It features a low profile flatpack package with 128 terminals and operates in parallel mode. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT7204L-15DVR
SN74ACT7204L-15DVR by Texas Instruments is a 4Kx9 FIFO with 25ns cycle time and 15ns access time. It operates at 5V, has 28 terminals, and supports parallel mode. Ideal for applications requiring fast data transfer in commercial temperature environments.
SN74ABT3612-30PQR
SN74ABT3612-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and temporary storage in electronic systems.
CD74HCT40105E
CD74HCT40105E by Texas Instruments is a 16x4 FIFO memory IC with 100ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 10MHz. Ideal for military-grade applications requiring fast data storage and retrieval in parallel mode.
72V845L10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Words Code: 4K;
SN74ACT3631-15PCBR
SN74ACT3631-15PCBR by Texas Instruments is a FIFO with 512x36 organization, 15 ns cycle time, and operates at 5V. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.
SN74ACT7204L25NP
SN74ACT7204L25NP by Texas Instruments is a FIFO memory with 4Kx9 organization, operating at 28.8 MHz clock frequency and 35 ns cycle time. It has a memory density of 36864 bits and is suitable for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.
72V255LA10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
SN74ABT7815-25PQ
SN74ABT7815-25PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with 40 MHz clock frequency, operating at 5V. It features synchronous operation, GULL WING terminals, and a max access time of 14ns. Ideal for applications requiring fast data transfer in commercial temperature environments.
IDT72V273L7-5BCGI8
The Renesas Electronics IDT72V273L7-5BCGI8 is a FIFO with 16Kx18 organization, operating at 133.3MHz clock frequency and 7.5ns cycle time. It features a low profile grid array package suitable for industrial applications requiring synchronous operation and a memory density of 294912 bits.
CD54HC40105F3A
CD54HC40105F3A by Texas Instruments is a 16x4 FIFO with 500ns cycle time, operating at 4.5V. It has 3-STATE output characteristics and supports up to 10MHz clock frequency. Ideal for military applications due to its MILITARY temperature grade and through-hole terminal form.
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7202LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 9;
7202LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 1KX9;
7202LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
7202LA50JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7202
Teledyne E2v (Uk)
FIFOs;
7202LA25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
7202LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 80 mA;
7202LA25SOI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
7202LA50JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7202LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 25 ns;
The Renesas Electronics 7202LA15SOGI is a FIFO memory IC with a cycle time of 25 ns and a max clock frequency of 40 MHz. It is commonly used in industrial applications that require fast and reliable data storage and retrieval.
7202LA20LB8
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Standby Current: .0009 Amp;
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; JESD-30 Code: R-CQCC-N32;
7202LA20SO
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
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