Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
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The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making this product ideal for applications where portability and reliability are required.
With surface mount capability, this product can be easily integrated onto circuit boards, simplifying the assembly process and increasing efficiency.
The low cycle time of 35 ns ensures fast and efficient data transfer, making this product suitable for high-speed applications that require quick response times.
This product incorporates a single function, allowing for streamlined implementation and reducing complexity in system design.
The rectangular package shape allows for space-efficient integration into circuit boards, optimizing the use of available layout area.
The asynchronous operating mode enables independent, non-synchronized data transfers, providing flexibility and versatility in various system architectures.
With a nominal supply voltage of 5V, this product is compatible with standard power supply systems, ensuring easy integration into existing setups.
The availability of power supplies at 5V ensures stable and reliable operation, minimizing the risk of performance issues or data loss.
The 32 terminals allow for the connection of various external components, expanding the functionality and possibilities of the product.
The chip carrier package style provides a compact and efficient form factor, facilitating space-saving integration in applications with limited board space.
The ability to operate at a maximum temperature of 70°C enhances the product's reliability and durability in demanding environments.
The organization of 1Kx9 signifies that this product is capable of storing 1 kilobit of data in a 9-word structure, catering to data storage requirements in various scenarios.
The product's ability to operate at a minimum temperature of 0°C allows for reliable performance in colder environments.
The use of tin lead terminal finish ensures excellent solderability and corrosion resistance, contributing to the product's long-term reliability.
The quad terminal positioning allows for easy and secure connections, reducing the risk of loose or unreliable connections.
With a maximum seated height of 3.55 mm, this product offers a compact profile, making it suitable for applications with height limitations.
The high maximum clock frequency of 28.5 MHz enables efficient and rapid data processing, facilitating real-time applications and reducing latency.
The product's width of 11.43 mm provides a compact form factor, allowing for easy integration and placement within confined spaces.
The minimum supply voltage requirement of 4.5V ensures compatibility with various power supply configurations, enhancing the flexibility of implementation.
With a maximum time at peak reflow temperature of 20 seconds, this product can undergo reliable soldering processes, ensuring secure connections during assembly.
The peak reflow temperature of 225°C enables the product to withstand the rigors of soldering processes, ensuring proper bonding and connection integrity.
The product's length of 13.97 mm offers a compact size, optimizing board space utilization and allowing for efficient integration.
The commercial temperature grade indicates that this product is designed and guaranteed to operate within standard commercial temperature ranges, making it suitable for most non-extreme applications.
Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and increased reliability, positioning it as an efficient and robust choice for various applications.
The parallel configuration allows for simultaneous data transfer, offering high bandwidth and enhanced performance for applications that require rapid data processing.
The J bend terminal form ensures secure and reliable electrical connections, minimizing the risk of signal loss or intermittent contact.
The maximum supply current of 125 mA ensures efficient power usage, reducing energy consumption and enabling longer battery life in portable applications.
With a capacity of storing 1024 words, this product offers ample memory space, accommodating large amounts of data for various applications.
The memory width of 9 signifies that each word in the memory structure consists of 9 bits, catering to applications that require storing or processing data in this format.
The terminal pitch of 1.27mm allows for precise and efficient connections, contributing to overall product reliability and ease of use.
The use of a 1K code indicates that this product supports a memory capacity of 1 kilobit, meeting the data storage requirements in a wide range of applications.
With a moisture sensitivity level of 1, this product can withstand standard moisture exposure conditions, ensuring its reliability and longevity.
The maximum supply voltage of 5.5V allows for a wider range of power supply options, providing flexibility and compatibility with various system configurations.
With a memory density of 9216 bits, this product offers substantial data storage capacity, accommodating large amounts of information for diverse applications.
The use of a FIFO (First-In, First-Out) memory IC type enhances data management efficiency, making it a suitable choice for applications that require sequential data processing and retrieval.
With a maximum standby current of 0.0005 Amp, this product minimizes power consumption during idle periods, optimizing energy efficiency and extending battery life.
The low maximum access time of 25 ns ensures quick and efficient data retrieval, enabling high-speed operations in time-critical applications.
FIFO 7202LA25J8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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7202LA25J8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Packaging - All Dev Label Chg 1/Dec/2022
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Taitron Components
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
Bytesonic Electronics
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
SN74ACT3642-30PCBR
SN74ACT3642-30PCBR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as networking equipment and telecommunications systems.
CD74HC40105E
General Electric Solid State
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
SN74ACT3622-20PQR
SN74ACT3622-20PQR by Texas Instruments is a FIFO with 256x36 organization, operating at 20 ns cycle time. It features 3-STATE output characteristics and synchronous operation mode, suitable for applications requiring fast data transfer and storage in commercial temperature environments. With a package style of FLATPACK, BUMPER and GULL WING terminal form, it offers parallel data processing with a memory width of 36 bits.
CD74HC40105MTG4
CD74HC40105MTG4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 12 MHz clock frequency. It operates synchronously at -55 to 125°C and is ideal for military-grade applications requiring fast data storage and retrieval.
SN74ACT7200L20NP
SN74ACT7200L20NP by Texas Instruments is a FIFO with 256x9 organization, operating at 5V. It features a CMOS technology, operates in parallel mode, and has a memory density of 2304 bits. This device is commonly used in applications requiring asynchronous operation and a memory width of 9 bits.
72V05L25JGI
Renesas Electronics
Renesas Electronics' 72V05L25JGI FIFO chip features 8Kx9 organization, 35ns cycle time, and operates at a supply voltage of 3.3V. Ideal for industrial applications requiring fast access times and high memory density.
SN74ABT3614-30PQ
SN74ABT3614-30PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V and has a commercial temperature grade. Ideal for applications requiring fast data storage and retrieval in electronic systems.
SN74ACT7200L20RJ
SN74ACT7200L20RJ by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This chip is ideal for applications requiring high-speed data transfer and storage in commercial temperature environments.
7200L15SOI8
Integrated Device Technology
7200L15SOI8 by Integrated Device Technology is a FIFO with 256x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can handle a max supply voltage of 5.5 V. Ideal for industrial applications requiring fast data processing and reliable memory storage in compact systems.
SN74ACT7200L25NP
SN74ACT7200L25NP by Texas Instruments is a FIFO memory IC with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in applications requiring fast asynchronous data storage and retrieval, with a package style of IN-LINE for easy integration into electronic systems.
72V275L15PFG8
Renesas Electronics' 72V275L15PFG8 FIFO features 32Kx18 organization, 15 ns cycle time, and 66.7 MHz clock frequency. Ideal for applications requiring fast synchronous operation in commercial temperature grades with a memory density of 589824 bits.
CY7C4201-15JC
Cypress Semiconductor
CY7C4201-15JC by Cypress Semiconductor is a FIFO chip with 256x9 organization, 15 ns cycle time, and 66.7 MHz clock frequency. It operates synchronously at 5V and is used in applications requiring fast data storage and retrieval.
72V265LA15PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Output Enable: YES;
SN74ABT3614-20PCBR
SN74ABT3614-20PCBR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, this device offers parallel access with a memory density of 2304 bits.
IDT7203L12J8
IDT7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ACT2236-30FN
SN74ACT2236-30FN by Texas Instruments is a 2Kx9 BI-DIRECTIONAL FIFO chip carrier with 3-STATE output, operating at 33MHz with a cycle time of 30.3ns. Ideal for industrial applications, it features synchronous operation and a memory density of 18432 bits, making it suitable for high-speed parallel data transfer.
SN74ACT7201A-25N
SN74ACT7201A-25N by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3614-30PCB
SN74ABT3614-30PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V, has a low profile flatpack package style, and is ideal for parallel data storage applications.
SN74ACT7201LA50RJ
SN74ACT7201LA50RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a nominal voltage of 5V. This CMOS technology chip is used for parallel data storage applications due to its fast access time and low standby current consumption.
IDT7204L15SOI8
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
7202LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 9;
7202LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 1KX9;
7202LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
7202LA50JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7202
Teledyne E2v (Uk)
FIFOs;
7202LA25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
7202LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 80 mA;
7202LA25SOI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
7202LA50JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7202LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 25 ns;
The Renesas Electronics 7202LA15SOGI is a FIFO memory IC with a cycle time of 25 ns and a max clock frequency of 40 MHz. It is commonly used in industrial applications that require fast and reliable data storage and retrieval.
7202LA20LB8
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Standby Current: .0009 Amp;
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; JESD-30 Code: R-CQCC-N32;
7202LA20SO
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
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