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7202LA25J8

Integrated Device Technology

7202LA25J8 by Integrated Device Technology

7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.

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Ampacity Inc.

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AZTECH Wire

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Component Stockers USA

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Overview

Experience superior performance and reliability with the 7202LA25J8 by Integrated Device Technology. As a leading manufacturer, they have crafted this FIFO device with precision and expertise, ensuring top-notch quality. This versatile product finds applications in various industries, offering seamless data transfer and efficient memory management. What sets it apart is the value it brings to customers - faster cycle time, asynchronous operation, and a wide temperature range. With its compact chip carrier package and robust design, the 7202LA25J8 delivers unmatched benefits and advantages for your business. Elevate your operations with this exceptional solution from Integrated Device Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making this product ideal for applications where portability and reliability are required.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, simplifying the assembly process and increasing efficiency.

Cycle Time: 35 ns

The low cycle time of 35 ns ensures fast and efficient data transfer, making this product suitable for high-speed applications that require quick response times.

No. of Functions: 1

This product incorporates a single function, allowing for streamlined implementation and reducing complexity in system design.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient integration into circuit boards, optimizing the use of available layout area.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode enables independent, non-synchronized data transfers, providing flexibility and versatility in various system architectures.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product is compatible with standard power supply systems, ensuring easy integration into existing setups.

Power Supplies (V): 5

The availability of power supplies at 5V ensures stable and reliable operation, minimizing the risk of performance issues or data loss.

No. of Terminals: 32

The 32 terminals allow for the connection of various external components, expanding the functionality and possibilities of the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor, facilitating space-saving integration in applications with limited board space.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70°C enhances the product's reliability and durability in demanding environments.

Organization: 1KX9

The organization of 1Kx9 signifies that this product is capable of storing 1 kilobit of data in a 9-word structure, catering to data storage requirements in various scenarios.

Minimum Operating Temperature: 0 °C

The product's ability to operate at a minimum temperature of 0°C allows for reliable performance in colder environments.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures excellent solderability and corrosion resistance, contributing to the product's long-term reliability.

Terminal Position: QUAD

The quad terminal positioning allows for easy and secure connections, reducing the risk of loose or unreliable connections.

Maximum Seated Height: 3.55 mm

With a maximum seated height of 3.55 mm, this product offers a compact profile, making it suitable for applications with height limitations.

Maximum Clock Frequency (fCLK): 28.5 MHz

The high maximum clock frequency of 28.5 MHz enables efficient and rapid data processing, facilitating real-time applications and reducing latency.

Width: 11.43 mm

The product's width of 11.43 mm provides a compact form factor, allowing for easy integration and placement within confined spaces.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage requirement of 4.5V ensures compatibility with various power supply configurations, enhancing the flexibility of implementation.

Maximum Time At Peak Reflow Temperature (s): 20

With a maximum time at peak reflow temperature of 20 seconds, this product can undergo reliable soldering processes, ensuring secure connections during assembly.

Peak Reflow Temperature °C: 225

The peak reflow temperature of 225°C enables the product to withstand the rigors of soldering processes, ensuring proper bonding and connection integrity.

Length: 13.97 mm

The product's length of 13.97 mm offers a compact size, optimizing board space utilization and allowing for efficient integration.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is designed and guaranteed to operate within standard commercial temperature ranges, making it suitable for most non-extreme applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and increased reliability, positioning it as an efficient and robust choice for various applications.

Parallel or Serial: PARALLEL

The parallel configuration allows for simultaneous data transfer, offering high bandwidth and enhanced performance for applications that require rapid data processing.

Terminal Form: J BEND

The J bend terminal form ensures secure and reliable electrical connections, minimizing the risk of signal loss or intermittent contact.

Maximum Supply Current: 125 mA

The maximum supply current of 125 mA ensures efficient power usage, reducing energy consumption and enabling longer battery life in portable applications.

No. of Words: 1024 words

With a capacity of storing 1024 words, this product offers ample memory space, accommodating large amounts of data for various applications.

Memory Width: 9

The memory width of 9 signifies that each word in the memory structure consists of 9 bits, catering to applications that require storing or processing data in this format.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and efficient connections, contributing to overall product reliability and ease of use.

No. of Words Code: 1K

The use of a 1K code indicates that this product supports a memory capacity of 1 kilobit, meeting the data storage requirements in a wide range of applications.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product can withstand standard moisture exposure conditions, ensuring its reliability and longevity.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for a wider range of power supply options, providing flexibility and compatibility with various system configurations.

Memory Density: 9216 bit

With a memory density of 9216 bits, this product offers substantial data storage capacity, accommodating large amounts of information for diverse applications.

Memory IC Type: OTHER FIFO

The use of a FIFO (First-In, First-Out) memory IC type enhances data management efficiency, making it a suitable choice for applications that require sequential data processing and retrieval.

Maximum Standby Current: 0.0005 Amp

With a maximum standby current of 0.0005 Amp, this product minimizes power consumption during idle periods, optimizing energy efficiency and extending battery life.

Maximum Access Time: 25 ns

The low maximum access time of 25 ns ensures quick and efficient data retrieval, enabling high-speed operations in time-critical applications.

Technical Specifications

FIFO 7202LA25J8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.55 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.43 mm

Trade Compliance

7202LA25J8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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