Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Renesas Electronics 7202LA25JGI8 FIFO chip features 1Kx9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast access times and parallel operation. Package style is chip carrier with dimensions of 13.97mm x 11.43mm x 3.55mm, suitable for surface mount assembly in various electronic systems.
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The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable and long-lasting applications.
The 5V supply voltage ensures compatibility with a wide range of systems and power sources.
The fast cycle time of 35 ns ensures quick and efficient data processing, making the product suitable for high-speed applications.
The asynchronous operating mode allows for independent control of data input and output, offering flexibility in data communication.
With an industrial temperature grade of -40 to 85°C, the product can withstand harsh environmental conditions, making it suitable for industrial applications.
The high memory density of 9216 bits provides ample storage capacity for data processing and retrieval, making the product efficient in handling large volumes of information.
FIFO 7202LA25JGI8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
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7202LA25JGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
National Semiconductor
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
2N2222A
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
International Semiconductor
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN74ABT7819A-10PH
SN74ABT7819A-10PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO with 10ns cycle time, operating at up to 100MHz clock frequency. It features synchronous operation, parallel interface, and GULL WING terminals. Ideal for applications requiring fast data transfer and memory management in commercial-grade environments.
SN74ACT3638-20PQ
SN74ACT3638-20PQ by Texas Instruments is a 512x32 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring high-speed data buffering in commercial temperature environments up to 70°C.
SN74ACT2235-20FN
SN74ACT2235-20FN by Texas Instruments is a FIFO chip with 1KX9 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is used in applications requiring bi-directional memory access, such as data buffering and caching in parallel systems.
CD74HC40105ME4
CD74HC40105ME4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and has a max access time of 2250 ns. Ideal for military-grade applications requiring fast data storage and retrieval.
72V265LA10PFG8
72V265LA10PFG8 by Renesas Electronics is a FIFO with 16Kx18 organization, operating at 100MHz clock frequency. It has a cycle time of 10ns and operates in synchronous mode. This device is suitable for applications requiring fast data processing and memory management in commercial-grade environments.
SN74ABT3613-20PQ
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
SN74ABT3612-30PQR
SN74ABT3612-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and temporary storage in electronic systems.
CD74HCT40105MTG4
CD74HCT40105MTG4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 12 MHz clock frequency. It operates synchronously at a cycle time of 100 ns and is suitable for military-grade applications requiring fast data storage and retrieval.
CD74HCT40105MT
CD74HCT40105MT by Texas Instruments is a FIFO memory IC with 16x4 organization, operating at 5V. It has a cycle time of 100ns and max clock frequency of 10MHz. Ideal for military applications requiring synchronous operation and parallel data transfer.
SN74ACT7201LA15RJ
SN74ACT7201LA15RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in asynchronous mode. This CMOS technology-based chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
NTE74HC40105
Nte Electronics
NTE74HC40105 by Nte Electronics is a 16X4 FIFO memory IC with 64-bit memory density. It operates in synchronous mode at supply voltages ranging from 2V to 6V. With a max temperature of 85°C, it is ideal for industrial applications requiring a parallel output and 3-STATE characteristics.
74HC40105D,652
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SN54ALS229AFK
SN54ALS229AFK by Texas Instruments is a 16x5 FIFO chip with 40ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max access time of 35ns. Ideal for military-grade applications requiring fast data storage and retrieval in a compact square chip carrier package.
SN74ABT7819-20PNR
SN74ABT7819-20PNR by Texas Instruments is a FIFO with 512x18 organization, 20 ns cycle time, and operates at 5V. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems. The device features a low profile flatpack package with gull wing terminals for easy surface mounting.
SN74ABT3613-30PQR
SN74ABT3613-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as communication systems and high-speed computing devices.
SN74ACT3641-20PCB
SN74ACT3641-20PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7203L-50RJR
SN74ACT7203L-50RJR by Texas Instruments is a 2Kx9 FIFO chip with 65ns cycle time, operating at 5V. It features a 3-STATE output and operates in asynchronous mode. This rectangular chip carrier package is ideal for commercial applications requiring fast parallel data storage and retrieval.
SN74ACT7202LA-25RJR
SN74ACT7202LA-25RJR by Texas Instruments is a FIFO chip with 1KX9 organization, 35 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a supply voltage of 5V, making it ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7206-50RJ
SN74ACT7206-50RJ by Texas Instruments is a 16Kx9 FIFO chip carrier with 3-state output, operating at 5V. It features asynchronous mode, CMOS technology, and parallel organization. Ideal for applications requiring high-speed data transfer and temporary storage in electronic systems.
SN74ACT7204L35RJ
SN74ACT7204L35RJ by Texas Instruments is a 4Kx9 FIFO chip carrier with CMOS technology. It operates asynchronously at 5V, with a memory density of 36864 bits and 4096 words. This rectangular package is surface-mountable and ideal for commercial applications requiring parallel data storage.
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7202LA15JGI
Integrated Device Technology
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 9;
7202LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 1KX9;
7202LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
7202LA50JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7202
Teledyne E2v (Uk)
FIFOs;
7202LA25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
7202LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 80 mA;
7202LA25SOI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
7202LA50JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7202LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 25 ns;
The Renesas Electronics 7202LA15SOGI is a FIFO memory IC with a cycle time of 25 ns and a max clock frequency of 40 MHz. It is commonly used in industrial applications that require fast and reliable data storage and retrieval.
7202LA20LB8
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Standby Current: .0009 Amp;
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; JESD-30 Code: R-CQCC-N32;
7202LA25J8
7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
7202LA25JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
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