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IDT72V05L25JI

Integrated Device Technology

IDT72V05L25JI by Integrated Device Technology

IDT72V05L25JI by Integrated Device Technology is a FIFO chip with 8Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in parallel mode, featuring a memory density of 73728 bits and low standby current consumption of 0.005Amp.

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Aztec Data Supply Inc.

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AZTECH Wire

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Overview

Experience reliable and efficient data storage with the IDT72V05L25JI FIFO by Integrated Device Technology. Crafted with precision and expertise, this chip carrier package offers seamless asynchronous operation, a fast cycle time of 35ns, and a generous 8Kx9 organization for optimal performance. Ideal for industrial applications, this FIFO device boasts a wide temperature range from -40 to 85°C, ensuring reliability in any environment. Trust in Integrated Device Technology's cutting-edge CMOS technology to deliver quality and value, making your data management tasks a breeze. Elevate your projects with the IDT72V05L25JI and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring long-term functionality.

Cycle Time: 35 ns

Fast cycle time allows for quick access and transfer of data, making it efficient for FIFO operations.

Nominal Supply Voltage / Vsup: 3.3V

Optimal supply voltage for the product, ensuring stable performance and power efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various industrial settings.

No. of Words: 8192 words

Large memory capacity for storing a significant amount of data in the FIFO.

Technology: CMOS

CMOS technology offers low power consumption and high speed, enhancing the overall performance of the FIFO.

Technical Specifications

FIFO IDT72V05L25JI attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.9954 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.556 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.4554 mm

Trade Compliance

IDT72V05L25JI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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