Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SN74ACT7200L20RJ by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This chip is ideal for applications requiring high-speed data transfer and storage in commercial temperature environments.
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The plastic/epoxy body material provides durability and protection to the components inside, ensuring long-term reliability.
Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.
The rectangular package shape is commonly used and offers good compatibility with standard PCB designs.
The asynchronous operating mode allows for flexible and independent data transfers, enhancing overall system performance.
The 5V supply voltage ensures compatibility with a wide range of systems and power sources.
Having 32 terminals provides ample connectivity options for interfacing with other components and systems.
The chip carrier package style offers good thermal performance and compact size, making it suitable for space-constrained applications.
The maximum operating temperature of 70°C ensures reliable operation even in demanding environmental conditions.
The 256x9 organization provides a good balance between memory capacity and data width, suitable for various applications.
The minimum operating temperature of 0°C allows for operation in a wide range of temperature environments.
The quad terminal position offers easy connectivity and installation on the PCB, enhancing ease of use and compatibility.
With a maximum seated height of 3.56mm, the component is compact and can fit in tight spaces, ideal for small form factor designs.
The width of 11.4554mm ensures compatibility with standard PCB layouts and allows for efficient use of space on the board.
The minimum supply voltage of 4.5V ensures reliable operation even with lower power sources, providing flexibility in system design.
The length of 13.995mm provides a compact footprint, ideal for applications where space is limited.
The commercial temperature grade indicates that the component is suitable for standard commercial applications, offering good compatibility and performance.
CMOS technology offers low power consumption and high noise immunity, making the component energy-efficient and reliable in noisy environments.
The parallel data transfer mode allows for high-speed data processing, making the product suitable for applications requiring quick data access.
The J bend terminal form offers secure connection points and ease of installation on the PCB, enhancing reliability and ease of use.
With 256 words of memory, the component can store a large amount of data, suitable for applications requiring extensive data storage.
The 9-bit memory width allows for efficient data processing and storage, providing flexibility in handling different types of data.
The terminal pitch of 1.27mm offers good connectivity options and compatibility with standard PCB layouts, facilitating easy integration into the system.
Having 256 words in the code provides a wide range of memory addressing options, enhancing flexibility in data storage and retrieval.
The maximum supply voltage of 5.5V ensures safe operation within specified voltage limits, protecting the component from damage due to voltage fluctuations.
With a memory density of 2304 bits, the component offers sufficient storage capacity for various data processing tasks, making it a versatile choice for different applications.
FIFO SN74ACT7200L20RJ attributes and parameters. Explore more FIFO devices from Texas Instruments
JESD-30 Code:
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Memory Density:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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SN74ACT7200L20RJ Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Continental Device India
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Multicomp Pro
Surge Components
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
Transys Electronics
CD74HCT40105M
Texas Instruments
CD74HCT40105M by Texas Instruments is a FIFO IC with 16x4 organization, operating at 5V. It features a cycle time of 100ns, synchronous operation, and output enable function. This small outline package has a max clock frequency of 10MHz and is suitable for military-grade applications requiring fast data storage and retrieval.
72V3622L10PFG8
Integrated Device Technology
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
SN74ACT7200L50DV
SN74ACT7200L50DV by Texas Instruments is a FIFO memory with 256x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a nominal voltage of 5V. This CMOS technology device is ideal for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.
5962-8986305YA
Renesas Electronics
Renesas Electronics 5962-8986305YA FIFO operates at 25 MHz with 512x9 organization. Ideal for military applications, it has a cycle time of 40 ns and can withstand temperatures from -55 to 125 °C.
7203L12JG
Renesas Electronics 7203L12JG FIFO chip features 2Kx9 organization, 20ns cycle time, and operates at a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial-grade environments.
SN74ACT3622-30PCBR
SN74ACT3622-30PCBR by Texas Instruments is a FIFO with 256x36 organization, 30 ns cycle time, and 5V nominal voltage. It operates synchronously in commercial temperature grade applications. This device features a parallel interface, 3-STATE output characteristics, and GULL WING terminal form for efficient data storage and retrieval.
IDT7280L15PA
IDT7280L15PA by Integrated Device Technology is a FIFO with 256x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates in asynchronous mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7206L-15DV
SN74ACT7206L-15DV by Texas Instruments is a 16Kx9 FIFO with 25ns cycle time, operating at 5V. It features a max clock frequency of 40MHz and offers 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
IDT72V05L25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 8KX9;
SN74ACT7204-40N
SN74ACT7204-40N by Texas Instruments is a 4Kx9 FIFO memory IC with 36864-bit memory density and 20 MHz max clock frequency. It operates asynchronously at a nominal voltage of 5V, making it ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CD54HCT40105F3A
CD54HCT40105F3A by Texas Instruments is a 16x4 FIFO with 100ns cycle time, operating at 5V. It has a max clock frequency of 10MHz and is suitable for military-grade applications requiring synchronous operation.
IDT7200L12SOG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
SN74ACT7201LA15DV
SN74ACT7201LA15DV by Texas Instruments is a FIFO memory IC with 512x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7202LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 25 ns;
CD74HC40105M96E4
CD74HC40105M96E4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and supports a max supply voltage of 6V. Ideal for military-grade applications requiring fast data storage and retrieval.
74HC40105PW,112
NXP Semiconductors
NXP Semiconductors' 74HC40105PW,112 FIFO chip features 16x4 organization, 33 MHz clock frequency, and 600 ns access time. Ideal for automotive applications, it operates in parallel mode with a supply voltage range of 2-6V.
FT245RL-TRAY
FTDI
FIFOs;
SN74ACT3641-30PCBR
SN74ACT3641-30PCBR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data access times and synchronous operation, suitable for commercial temperature grades.
SN74ACT2235-60FNR
SN74ACT2235-60FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 60 ns cycle time. It features 3-STATE output characteristics and operates in parallel mode. This chip is commonly used in applications requiring fast data storage and retrieval with a memory density of 9216 bits.
SN74ACT3642-15PQ
SN74ACT3642-15PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 15ns cycle time, operating at 5V. It features a max clock frequency of 66.7MHz and offers bi-directional parallel data transfer. This device is ideal for applications requiring fast synchronous data storage and retrieval in commercial temperature environments.
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DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
SN74V293-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
SN74V245-15PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Organization: 4KX18;
SN74V293-7PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G80;
SN74V245-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH;
SN74V235-7PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V245-7PAG
SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.
SN74V215-7PAG
SN74V215-7PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz clock frequency. It features a cycle time of 7.5 ns and operates at a nominal voltage of 3.3 V. This device is ideal for applications requiring fast data storage and retrieval in synchronous mode with 3-STATE output characteristics.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
SN74ACT7202LA25NP
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SN74V263-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74V215-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; JESD-609 Code: e4;
SN74V245-15PAGEP
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V215-20PAG
SN74V215-20PAG by Texas Instruments is a FIFO memory IC with 512x18 organization and 512 words code. It operates synchronously with a cycle time of 20 ns and has a max clock frequency of 133 MHz. This IC is commonly used in applications that require high-speed data buffering and storage.
SN74V283-15PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .015 Amp;
SN74ALVC7803-40DL
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
SN74ABT7819A-15PN
SN74ABT7819A-15PN by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with a cycle time of 15 ns and max clock frequency of 67 MHz. It is commonly used in applications requiring high-speed data buffering and storage.
SN74ABT7819A-30PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Organization: 512KX18;
SN74V235-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ABT7819A-10PN
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
SN74ABT7819A-15PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
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