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SN74ACT7200L20RJ

Texas Instruments

SN74ACT7200L20RJ by Texas Instruments

SN74ACT7200L20RJ by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This chip is ideal for applications requiring high-speed data transfer and storage in commercial temperature environments.

Median Price

$4.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$3.480

1k+ parts

$3.110

10k+ parts

$2.930

1,536

-

$3.480

$3.110

$2.930

DigiKey

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$4.580

1k+ parts

-

10k+ parts

-

1,536

-

$4.580

-

-

Verical

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$4.350

1k+ parts

$3.888

10k+ parts

$3.663

1,536

-

$4.350

$3.888

$3.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,679 parts In-Stock

1+ parts

$3.676

100+ parts

-

1k+ parts

-

10k+ parts

-

4,679

$3.676

-

-

-

Vyrian

USA . 1,410 parts In-Stock

1+ parts

$3.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$3.870

-

-

-

DigiKey Marketplace

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 307 parts In-Stock

1+ parts

$1.833

100+ parts

-

1k+ parts

$2.384

10k+ parts

-

307

$1.833

-

$2.384

-

ChromeModa Solutions

Germany . 5,923 parts In-Stock

1+ parts

$2.060

100+ parts

$1.689

1k+ parts

-

10k+ parts

-

5,923

$2.060

$1.689

-

-

IDEA Electronic Components Group

UK . 1,887 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

$1.854

10k+ parts

-

1,887

$2.060

-

$1.854

-

Corphita

USA . 4,553 parts In-Stock

1+ parts

$3.483

100+ parts

-

1k+ parts

-

10k+ parts

-

4,553

$3.483

-

-

-

Component Stockers USA

USA . 3,898 parts In-Stock

1+ parts

$3.980

100+ parts

$3.750

1k+ parts

$3.390

10k+ parts

-

3,898

$3.980

$3.750

$3.390

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,268

-

-

-

-

DigiPath Technology Company

USA . 1,231 parts In-Stock

1+ parts

-

100+ parts

$1.857

1k+ parts

-

10k+ parts

-

1,231

-

$1.857

-

-

Overview

Enhance your electronic designs with the SN74ACT7200L20RJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This FIFO device is perfect for applications requiring high-speed data transfer and storage, offering seamless operation and efficient performance. With its compact chip carrier package and wide operating temperature range, this product provides unmatched value and flexibility to customers. Upgrade your projects with the SN74ACT7200L20RJ and experience the superior benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection to the components inside, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and offers good compatibility with standard PCB designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent data transfers, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and compact size, making it suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures reliable operation even in demanding environmental conditions.

Organization: 256X9

The 256x9 organization provides a good balance between memory capacity and data width, suitable for various applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows for operation in a wide range of temperature environments.

Terminal Position: QUAD

The quad terminal position offers easy connectivity and installation on the PCB, enhancing ease of use and compatibility.

Maximum Seated Height: 3.56 mm

With a maximum seated height of 3.56mm, the component is compact and can fit in tight spaces, ideal for small form factor designs.

Width: 11.4554 mm

The width of 11.4554mm ensures compatibility with standard PCB layouts and allows for efficient use of space on the board.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation even with lower power sources, providing flexibility in system design.

Length: 13.995 mm

The length of 13.995mm provides a compact footprint, ideal for applications where space is limited.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the component is suitable for standard commercial applications, offering good compatibility and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the component energy-efficient and reliable in noisy environments.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for high-speed data processing, making the product suitable for applications requiring quick data access.

Terminal Form: J BEND

The J bend terminal form offers secure connection points and ease of installation on the PCB, enhancing reliability and ease of use.

No. of Words: 256 words

With 256 words of memory, the component can store a large amount of data, suitable for applications requiring extensive data storage.

Memory Width: 9

The 9-bit memory width allows for efficient data processing and storage, providing flexibility in handling different types of data.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm offers good connectivity options and compatibility with standard PCB layouts, facilitating easy integration into the system.

No. of Words Code: 256

Having 256 words in the code provides a wide range of memory addressing options, enhancing flexibility in data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures safe operation within specified voltage limits, protecting the component from damage due to voltage fluctuations.

Memory Density: 2304 bit

With a memory density of 2304 bits, the component offers sufficient storage capacity for various data processing tasks, making it a versatile choice for different applications.

Technical Specifications

FIFO SN74ACT7200L20RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

2304 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT7200L20RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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