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SN74ACT3641-15PCB

Texas Instruments

SN74ACT3641-15PCB by Texas Instruments

Texas Instruments SN74ACT3641-15PCB FIFO operates at 66.7MHz with 15ns cycle time. It has 1Kx36 memory density, CMOS technology, and supports parallel operation. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.

Median Price

$21.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$18.560

1k+ parts

$16.610

10k+ parts

$15.630

2,250

-

$18.560

$16.610

$15.630

DigiKey

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$21.460

1k+ parts

-

10k+ parts

-

2,250

-

$21.460

-

-

Verical

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$23.200

1k+ parts

$20.762

10k+ parts

$19.538

1,250

-

$23.200

$20.762

$19.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 743 parts In-Stock

1+ parts

$19.598

100+ parts

-

1k+ parts

-

10k+ parts

-

743

$19.598

-

-

-

Vyrian

USA . 2,364 parts In-Stock

1+ parts

$20.630

100+ parts

-

1k+ parts

-

10k+ parts

-

2,364

$20.630

-

-

-

DigiKey Marketplace

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 23 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

$4.247

10k+ parts

-

23

$3.750

-

$4.247

-

DigiPath Technology Company

USA . 635 parts In-Stock

1+ parts

$4.129

100+ parts

$3.798

1k+ parts

-

10k+ parts

-

635

$4.129

$3.798

-

-

IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$4.213

100+ parts

-

1k+ parts

$3.792

10k+ parts

-

1,673

$4.213

-

$3.792

-

ChromeModa Solutions

Germany . 1,022 parts In-Stock

1+ parts

$4.213

100+ parts

$3.455

1k+ parts

-

10k+ parts

-

1,022

$4.213

$3.455

-

-

Corphita

USA . 3,826 parts In-Stock

1+ parts

$18.567

100+ parts

-

1k+ parts

-

10k+ parts

-

3,826

$18.567

-

-

-

Component Stockers USA

USA . 2,119 parts In-Stock

1+ parts

$20.880

100+ parts

$19.620

1k+ parts

$17.740

10k+ parts

-

2,119

$20.880

$19.620

$17.740

-

Ampacity Inc.

Singapore . 2,002 parts In-Stock

1+ parts

$38.170

100+ parts

-

1k+ parts

-

10k+ parts

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2,002

$38.170

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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24,513

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-

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Microchip USA

USA . 357 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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357

-

-

-

-

Overview

Unleash the power of seamless data transfer with the Texas Instruments SN74ACT3641-15PCB FIFO memory IC. Designed with precision and reliability in mind, this product offers a cutting-edge solution for various applications. With a cycle time of 15 ns and a synchronous operating mode, this FIFO memory ensures lightning-fast performance while maintaining a nominal supply voltage of 5V. Whether you're in need of high-speed data buffering or efficient data storage, this BI-DIRECTIONAL FIFO memory IC is the perfect choice. Upgrade your systems today with Texas Instruments and experience unparalleled quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the internal components of the FIFO, ensuring reliable performance over time.

Cycle Time: 15 ns

Fast cycle time of 15 ns allows for efficient data transfer within the FIFO, improving overall system speed and performance.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of existing systems and easy to integrate.

Memory Width: 36

Wide memory width of 36 bits allows for storing and retrieving large amounts of data simultaneously, enhancing data processing capabilities.

Maximum Clock Frequency (fCLK): 66.7 MHz

High maximum clock frequency of 66.7 MHz enables rapid data transfer and processing speed, ideal for demanding applications.

Technical Specifications

FIFO SN74ACT3641-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11 ns

Additional Features:

RETRANSMIT; MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3641-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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