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SN74ACT7205L50NP

Texas Instruments

SN74ACT7205L50NP by Texas Instruments

SN74ACT7205L50NP by Texas Instruments is a FIFO memory with 8Kx9 organization, 65ns cycle time, and 15MHz max clock frequency. It operates at 5V, has 28 terminals in an in-line package style, and is suitable for commercial temperature grade applications.

Median Price

$9.113

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$7.290

1k+ parts

$6.520

10k+ parts

$6.140

900

-

$7.290

$6.520

$6.140

DigiKey

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$9.590

1k+ parts

-

10k+ parts

-

900

-

$9.590

-

-

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$9.113

1k+ parts

$8.150

10k+ parts

$7.675

900

-

$9.113

$8.150

$7.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,719 parts In-Stock

1+ parts

$7.686

100+ parts

-

1k+ parts

-

10k+ parts

-

1,719

$7.686

-

-

-

Vyrian

USA . 3,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,452

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 299 parts In-Stock

1+ parts

$3.076

100+ parts

-

1k+ parts

$3.591

10k+ parts

-

299

$3.076

-

$3.591

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$3.387

100+ parts

$3.116

1k+ parts

-

10k+ parts

-

2,057

$3.387

$3.116

-

-

IDEA Electronic Components Group

UK . 1,121 parts In-Stock

1+ parts

$3.456

100+ parts

-

1k+ parts

$3.110

10k+ parts

-

1,121

$3.456

-

$3.110

-

ChromeModa Solutions

Germany . 1,006 parts In-Stock

1+ parts

$3.456

100+ parts

$2.834

1k+ parts

-

10k+ parts

-

1,006

$3.456

$2.834

-

-

Corphita

USA . 185 parts In-Stock

1+ parts

$7.281

100+ parts

-

1k+ parts

-

10k+ parts

-

185

$7.281

-

-

-

Overview

Upgrade your system with the Texas Instruments SN74ACT7205L50NP FIFO, designed for seamless data transfer and reliable performance. With a commitment to quality and innovation, Texas Instruments delivers cutting-edge technology for a wide range of applications. Enhance your project with this versatile FIFO, offering fast cycle times, low power consumption, and a compact package design. Trust Texas Instruments for superior products that provide value and efficiency for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FIFO reliable for long-term use.

Cycle Time: 65 ns

The fast cycle time ensures quick data access and transfer, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many systems and easy to integrate.

No. of Terminals: 28

Having a high number of terminals allows for efficient data connections, enhancing the FIFO's functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the FIFO can function reliably in various environments.

Memory Density: 73728 bit

With a high memory density, the FIFO can store a large amount of data, making it suitable for demanding applications.

Maximum Clock Frequency (fCLK): 15 MHz

Supporting a high clock frequency enables fast data processing and transfer speeds, enhancing overall system efficiency.

Technical Specifications

FIFO SN74ACT7205L50NP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

Cycle Time:

65 ns

JESD-30 Code:

R-PDIP-T28

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7205L50NP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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