Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 72V51446L6BB8 FIFO operates synchronously with a cycle time of 6 ns. It features 32Kx36 organization, 3.3V nominal voltage, and 256 terminals in a grid array package style. Ideal for applications requiring fast data processing and storage in commercial temperature environments.
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Provides durability and protection for the internal components, ensuring long-term reliability.
Fast data access speed, making it suitable for high-performance applications.
Operates efficiently at a standard supply voltage, ensuring compatibility with various systems.
Offers a large memory capacity and data width, suitable for storing and accessing a significant amount of information.
Designed to operate reliably within commercial temperature ranges, making it suitable for common usage scenarios.
Allows for control over data output, providing flexibility in data transmission.
FIFO 72V51446L6BB8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
Maximum Access Time:
Additional Features:
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Memory Density:
Memory Width:
Moisture Sensitivity Level (MSL):
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No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
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Maximum Time At Peak Reflow Temperature (s):
72V51446L6BB8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
1N4148W-T
Rectron
International Semiconductor
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
Cheng-yi Electronic
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SN74ABT7819A-15PH
SN74ABT7819A-15PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO memory IC with 67 MHz clock frequency, 15 ns cycle time, and 95 mA max supply current. It operates in synchronous mode and has a memory density of 9437184 bit. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT7819-30PH
SN74ABT7819-30PH by Texas Instruments is a 512x18 FIFO with a cycle time of 30.03 ns and max clock frequency of 33.3 MHz. It operates synchronously, has a memory density of 9216 bit, and is ideal for commercial applications requiring fast data storage and retrieval.
SN74ACT7203-30FM
SN74ACT7203-30FM by Texas Instruments is a 2Kx9 FIFO chip with 25MHz clock frequency, operating at 5V. It has a memory density of 18432 bits and operates in commercial temperature grade. This rectangular chip carrier package is suitable for applications requiring asynchronous operation and fast access times.
SN74ACT72235-20PM
SN74ACT72235-20PM by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation, such as data buffering and communication systems. The device features a low profile flatpack package with gull wing terminals for surface mount assembly.
IDT72V241L10PFG
Renesas Electronics
IDT72V241L10PFG by Renesas Electronics is a FIFO with 4Kx9 organization, operating at 3.3V. It features a cycle time of 10ns and synchronous operation, suitable for parallel applications requiring fast access times. This low-profile flatpack device has a memory density of 36864 bits and offers output enable functionality for efficient data processing.
SN74ACT3622-30PQR
SN74ACT3622-30PQR by Texas Instruments is a FIFO with 256x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments.
72V265LA10TFG8
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
CV215-10PAGG4
CV215-10PAGG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 100 MHz clock frequency. It has a cycle time of 10 ns and is used in applications requiring fast synchronous data storage and retrieval. The device features a thin profile flatpack package with gull wing terminals, suitable for commercial temperature grade environments.
SN74ACT2235-20PAGR
SN74ACT2235-20PAGR by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 3-STATE output characteristics. It operates at 5V with a temperature range of 0 to 70 °C. Ideal for applications requiring fast data storage and retrieval in parallel mode.
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
IDT7208L25JGI
IDT7208L25JGI by Renesas Electronics is a 64Kx9 FIFO with a cycle time of 35 ns. It operates in asynchronous mode and has a max access time of 25 ns. This chip carrier package is commonly used in industrial applications requiring high-speed data buffering.
IDT7203L15TPI
IDT7203L15TPI by Integrated Device Technology is a FIFO memory with 2Kx9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and is suitable for industrial applications requiring fast data storage and retrieval. With a package style of IN-LINE and through-hole terminal form, it offers reliable performance in harsh environments.
SN74ACT72231L-20RJR
SN74ACT72231L-20RJR by Texas Instruments is a 2Kx9 FIFO chip with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 50MHz. Ideal for applications requiring fast data buffering and retrieval in commercial temperature environments.
SN74ACT7201LA15RJ
SN74ACT7201LA15RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in asynchronous mode. This CMOS technology-based chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V851L10PFG8
The Renesas Electronics 72V851L10PFG8 is a FIFO memory with 8Kx9 organization, operating at 100MHz clock frequency. It features a cycle time of 10ns and operates in synchronous mode. This low-profile flatpack device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V285L10TFG8
The Renesas Electronics IDT72V285L10TFG8 FIFO operates in synchronous mode with a cycle time of 10 ns. It has an organization of 64KX18 and memory density of 1179648 bit, suitable for applications requiring fast data transfer such as networking equipment and telecommunications devices. The device features a low profile flatpack package with gull wing terminals, making it ideal for space-constrained designs.
SN54ALS234FK
SN54ALS234FK by Texas Instruments is a 64x4 FIFO chip with 40ns cycle time, operating at 5V. It features a 25MHz clock frequency and -55 to 125°C temperature range. Ideal for military-grade applications requiring fast data storage and retrieval in parallel mode.
CY7C421-20JXC
Cypress Semiconductor
CY7C421-20JXC by Cypress Semiconductor is a FIFO chip with 512x9 organization, operating at 33.33 MHz clock frequency. It has a cycle time of 30 ns and operates in asynchronous mode. This chip is commonly used in applications requiring fast data storage and retrieval, such as networking devices and communication systems.
SN74ACT3632-30PQ
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
72V2113L6PFG8
The Renesas Electronics 72V2113L6PFG8 is a FIFO memory with 256Kx18 organization, operating at 3.3V. It features a cycle time of 6ns and synchronous operation, suitable for applications requiring fast data processing such as networking equipment and telecommunications devices. The memory IC type is Other FIFO with parallel access mode and Gull Wing terminal form.
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72V51446L6BB8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V51256L6BBG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
72V51236L7-5BBI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN LEAD;
72V51253L6BBG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Standby Current: .025 Amp;
72V51256L6BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
72V51253L6BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Output Enable: YES;
72V51256L6BBG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.45 V;
72V51233L7-5BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;
72V51253L6BBG8
72V51236L7-5IBB
FIFOs;
72V51253L6BBI
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
72V51253L7-5BBI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 3.3;
72V51243L7-5BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
72V51256L6BB8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Access Time: 3.7 ns;
72V51236L7-5BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
72V51253L7-5BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;
72V51253L6BB8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
72V51233L6BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
72V51236L6BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
72V51446L6BB
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Terminal Position: BOTTOM;
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