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72V51253L7-5BB

Renesas Electronics

72V51253L7-5BB by Renesas Electronics

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 848 parts In-Stock

1+ parts

$17.150

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$17.150

-

-

-

Northwest PG Solutions

USA . 1,877 parts In-Stock

1+ parts

$18.865

100+ parts

$16.978

1k+ parts

-

10k+ parts

-

1,877

$18.865

$16.978

-

-

Microchip USA

USA . 1,363 parts In-Stock

1+ parts

$179.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

$179.708

-

-

-

Technical Specifications

FIFO 72V51253L7-5BB attributes and parameters. Explore more FIFO devices from Renesas Electronics

Specs

Maximum Access Time:

4 ns

Additional Features:

ALTERNATIVE MEMORY WIDTH:9-BIT

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Memory Density:

2359296 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

72V51253L7-5BB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Renesas Electronics

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