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SN74ACT3631-30PQ

Texas Instruments

SN74ACT3631-30PQ by Texas Instruments

SN74ACT3631-30PQ by Texas Instruments is a FIFO with 512x36 organization, operating at 30ns cycle time and 33.4MHz clock frequency. It is used in applications requiring synchronous operation, featuring a 5V nominal voltage and 3-STATE output characteristics.

Median Price

$19.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

$17.010

1k+ parts

$15.220

10k+ parts

$14.330

1,106

-

$17.010

$15.220

$14.330

DigiKey

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

$19.670

1k+ parts

-

10k+ parts

-

1,106

-

$19.670

-

-

Verical

USA . 655 parts In-Stock

1+ parts

-

100+ parts

$21.262

1k+ parts

$19.025

10k+ parts

$17.913

655

-

$21.262

$19.025

$17.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 199 parts In-Stock

1+ parts

$17.964

100+ parts

-

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-

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199

$17.964

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Vyrian

USA . 1,328 parts In-Stock

1+ parts

$18.910

100+ parts

-

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1,328

$18.910

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DigiKey Marketplace

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,106

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

$2.479

100+ parts

-

1k+ parts

$2.971

10k+ parts

-

1,498

$2.479

-

$2.971

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DigiPath Technology Company

USA . 1,228 parts In-Stock

1+ parts

$2.729

100+ parts

$2.511

1k+ parts

-

10k+ parts

-

1,228

$2.729

$2.511

-

-

ChromeModa Solutions

Germany . 2,094 parts In-Stock

1+ parts

$2.785

100+ parts

$2.284

1k+ parts

-

10k+ parts

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2,094

$2.785

$2.284

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$2.785

100+ parts

-

1k+ parts

$2.506

10k+ parts

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341

$2.785

-

$2.506

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Corphita

USA . 2,728 parts In-Stock

1+ parts

$17.019

100+ parts

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2,728

$17.019

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Microchip USA

USA . 358 parts In-Stock

1+ parts

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358

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Overview

Experience seamless data transfer and efficient memory management with the SN74ACT3631-30PQ FIFO by Texas Instruments. Known for its high-quality products, Texas Instruments delivers reliable solutions for a variety of applications. This FIFO device offers unparalleled performance with a 30 ns cycle time and a maximum clock frequency of 33.4 MHz, making it ideal for demanding tasks. With a 512x36 organization and 3-STATE output characteristics, this product provides exceptional value and benefits to customers looking for a dependable memory IC. Upgrade your system with the SN74ACT3631-30PQ and enjoy superior functionality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and lightweight design, making the product easy to handle and transport.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Cycle Time: 30 ns

Fast cycle time ensures quick data transfer and processing, improving overall system performance.

Operating Mode: SYNCHRONOUS

Synchronous operation enables data transfers to occur at precise intervals, reducing the risk of errors and improving data reliability.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply ensures compatibility with most electronics and simplifies integration into existing systems.

No. of Terminals: 132

Sufficient number of terminals allow for versatile connectivity options, facilitating integration into various applications.

Package Style (Meter): FLATPACK, BUMPER

Combination of flatpack and bumper design offers a balance of compactness and protection, ensuring optimal performance and durability.

Maximum Clock Frequency (fCLK): 33.4 MHz

High clock frequency enables rapid data processing and communication, enhancing overall system efficiency and speed.

Memory Width: 36

Wide memory width accommodates large data sets, allowing for efficient storage and retrieval of information.

Memory Density: 18432 bit

High memory density provides ample storage capacity, making the product suitable for storing a large volume of data.

Technical Specifications

FIFO SN74ACT3631-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ACT3631-30PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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