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SN74ACT7204L35NP

Texas Instruments

SN74ACT7204L35NP by Texas Instruments

SN74ACT7204L35NP by Texas Instruments is a 4Kx9 FIFO with CMOS technology. It operates asynchronously at 5V, has a memory density of 36864 bits, and supports parallel data transfer. This rectangular package with 28 terminals is ideal for commercial applications requiring fast and efficient data storage and retrieval.

Median Price

$6.987

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

$5.590

1k+ parts

$5.000

10k+ parts

$4.700

2,300

-

$5.590

$5.000

$4.700

DigiKey

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

$7.350

1k+ parts

-

10k+ parts

-

2,300

-

$7.350

-

-

Verical

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

$6.987

1k+ parts

$6.250

10k+ parts

$5.875

2,300

-

$6.987

$6.250

$5.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,289 parts In-Stock

1+ parts

$5.900

100+ parts

-

1k+ parts

-

10k+ parts

-

2,289

$5.900

-

-

-

Vyrian

USA . 132 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

-

10k+ parts

-

132

$6.210

-

-

-

DigiKey Marketplace

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,752 parts In-Stock

1+ parts

$4.389

100+ parts

$407.547

1k+ parts

$3.950

10k+ parts

-

1,752

$4.389

$407.547

$3.950

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$4.449

100+ parts

$4.049

1k+ parts

$3.648

10k+ parts

-

40

$4.449

$4.049

$3.648

-

DigiPath Technology Company

USA . 1,604 parts In-Stock

1+ parts

$4.832

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

$4.832

-

-

-

ChromeModa Solutions

Germany . 5,100 parts In-Stock

1+ parts

$4.931

100+ parts

$4.043

1k+ parts

-

10k+ parts

-

5,100

$4.931

$4.043

-

-

IDEA Electronic Components Group

UK . 2,153 parts In-Stock

1+ parts

$4.931

100+ parts

-

1k+ parts

$4.438

10k+ parts

-

2,153

$4.931

-

$4.438

-

Corphita

USA . 1,061 parts In-Stock

1+ parts

$5.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,061

$5.589

-

-

-

Overview

Enhance your electronic designs with the SN74ACT7204L35NP FIFO by Texas Instruments. This high-quality product offers reliability, efficiency, and versatility for a wide range of applications. With its advanced technology and durable construction, this FIFO device ensures seamless data transfer in an asynchronous operating mode. From industrial automation to telecommunications, this component provides exceptional value and performance, making it a must-have for any project requiring fast and efficient memory management. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent read and write access to the memory, increasing efficiency in data retrieval and storage.

Nominal Supply Voltage (Vsup): 5V

Operating at a standard nominal voltage of 5V makes it compatible with many systems and devices, offering versatility in usage.

No. of Terminals: 28

Having a sufficient number of terminals enables easy integration and connectivity with other components in a system or circuit.

Maximum Operating Temperature: 70°C

With a maximum operating temperature of 70°C, this product can function reliably even in high-temperature environments.

Organization: 4KX9

The specific organization of 4KX9 allows for efficient data storage and retrieval capabilities, ideal for applications requiring fast access to information.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in data processing.

No. of Words: 4096 words

Having a large number of words available for storage allows for extensive data capacity, suitable for applications with a need for storing a significant amount of information.

Memory Width: 9

A memory width of 9 ensures that data can be processed in larger chunks, enhancing the speed and efficiency of data transfer within the system.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this product can accommodate fluctuations in power supply while maintaining stable operation.

Memory Density: 36864 bit

The high memory density of 36864 bit allows for compact storage of data, saving space and making the product suitable for applications with limited physical footprint.

Technical Specifications

FIFO SN74ACT7204L35NP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Memory Density:

36864 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

SN74ACT7204L35NP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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