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SN74ABT3611-30PCBR

Texas Instruments

SN74ABT3611-30PCBR by Texas Instruments

SN74ABT3611-30PCBR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and synchronization, such as high-speed communication systems or memory buffering.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,938 parts In-Stock

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Digiode

USA . 523 parts In-Stock

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523

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Distributors (Availability)

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Parana Technologies

USA . 1,538 parts In-Stock

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$4.488

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-

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$4.927

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1,538

$4.488

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$4.927

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DigiPath Technology Company

USA . 1,961 parts In-Stock

1+ parts

$4.942

100+ parts

$4.547

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1,961

$4.942

$4.547

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ChromeModa Solutions

Germany . 6,632 parts In-Stock

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$5.043

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$4.135

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6,632

$5.043

$4.135

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IDEA Electronic Components Group

UK . 274 parts In-Stock

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$5.043

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$4.539

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274

$5.043

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$4.539

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One Stop Electronics

USA . 733 parts In-Stock

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$9.000

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733

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AZTECH Wire

Italy . 488 parts In-Stock

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$14.997

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Corphita

USA . 521 parts In-Stock

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Overview

Experience seamless data transfer and efficient memory management with the SN74ABT3611-30PCBR by Texas Instruments. As a leader in innovative electronics, Texas Instruments delivers top-quality FIFO products like this one, perfect for a wide range of applications. With a cycle time of just 30 ns and a 64x36 organization, this FIFO device offers unparalleled speed and reliability. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Unlock new possibilities with the SN74ABT3611-30PCBR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 30 ns

With a fast cycle time of 30 ns, this FIFO can efficiently process data and provide quick access to stored information.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into a variety of systems.

No. of Words: 64 words

With a storage capacity of 64 words, this FIFO can handle a large amount of data, making it suitable for applications with high throughput requirements.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high speed and low power consumption for efficient operation.

Technical Specifications

FIFO SN74ABT3611-30PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

2304 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ABT3611-30PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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