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74HC40105N

NXP Semiconductors

74HC40105N by NXP Semiconductors

The NXP Semiconductors 74HC40105N FIFO chip operates asynchronously with a cycle time of 71.428 ns and a max clock frequency of 14 MHz. It has a memory width of 4 bits and is suitable for automotive applications due to its temperature grade.

Median Price

$2.500

Lifecycle Status

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Corel Iberica Componentes, S.L.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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AZTECH Wire

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Overview

Experience seamless data transfer with the 74HC40105N FIFO by NXP Semiconductors, a leading manufacturer in semiconductor technology. This versatile device offers reliable performance in a variety of applications, ensuring smooth operation and efficient data handling. With a robust design and high-quality materials, this FIFO provides value and peace of mind to customers looking for a dependable solution. Upgrade your system today with the 74HC40105N and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for automotive applications.

Cycle Time: 71.428 ns

The fast cycle time ensures efficient data transfer and processing, making the product suitable for high-speed applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent and simultaneous data transfers, enhancing the overall system performance.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is within a common range, making it compatible with various power supply configurations.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options, allowing for versatile integration within different systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for automotive and industrial environments with varying temperature conditions.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and reliable operation, making it a cost-effective choice for long-term use.

Output Enable: YES

The presence of output enable functionality provides control over data output, enhancing flexibility and efficiency in data processing.

Technical Specifications

FIFO 74HC40105N attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

600 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 750NS

Maximum Clock Frequency (fCLK):

14 MHz

Cycle Time:

71.428 ns

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC40105N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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