Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' 74HC40105D,653 FIFO chip operates asynchronously with a cycle time of 71.428 ns and a clock frequency of up to 14 MHz. This CMOS technology device has a memory width of 4 bits and is ideal for automotive applications due to its wide temperature range from -40°C to 125°C.
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PLASTIC/EPOXY material provides durability and protection to the internal components of the FIFO, ensuring reliable performance and longevity.
Fast cycle time of 71.428 ns allows for quick data transfer and processing, making the FIFO efficient for high-speed applications.
Operating at a nominal supply voltage of 4.5V makes the FIFO compatible with a wide range of systems and power sources.
With a maximum operating temperature of 125°C, the FIFO can withstand high heat environments, making it suitable for various industrial applications.
CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the FIFO.
The output enable feature allows for convenient control over the data output, enabling seamless integration with other components and systems.
FIFO 74HC40105D,653 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Additional Features:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
74HC40105D,653 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
Rfe International
2N7002-T1-E3
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
2N7002
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
Daco Semiconductor
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
SN74ACT7206L-15DVR
Texas Instruments
SN74ACT7206L-15DVR by Texas Instruments is a 16Kx9 FIFO with 25ns cycle time and 15ns access time. It operates at 5V, has 28 terminals, and supports parallel mode. Ideal for applications requiring fast data transfer in commercial temperature environments.
SN74ACT72231L-20RJ
SN74ACT72231L-20RJ by Texas Instruments is a 2Kx9 FIFO chip carrier with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT7819-30PHR
SN74ABT7819-30PHR by Texas Instruments is a 512x18 FIFO with 30.03ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
IDT72V211L15JI8
Integrated Device Technology
IDT72V211L15JI8 by Integrated Device Technology is a FIFO chip with 512x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is used in industrial applications requiring synchronous operation and a memory density of 4608 bit.
SN74ACT7204-40N
SN74ACT7204-40N by Texas Instruments is a 4Kx9 FIFO memory IC with 36864-bit memory density and 20 MHz max clock frequency. It operates asynchronously at a nominal voltage of 5V, making it ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V261LA10PFG8
Renesas Electronics
The Renesas Electronics 72V261LA10PFG8 FIFO operates in synchronous mode with a cycle time of 10 ns. It features an organization of 16KX9 and memory density of 147456 bit, suitable for applications requiring fast data access such as networking and telecommunications systems.
SN74ACT7201LA15RJ
SN74ACT7201LA15RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in asynchronous mode. This CMOS technology-based chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3611-30PCBR
SN74ABT3611-30PCBR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and synchronization, such as high-speed communication systems or memory buffering.
SN74ABT3613PQR
SN74ABT3613PQR by Texas Instruments is a FIFO with 64x36 organization, 15ns cycle time, and 5V nominal voltage. It is used in synchronous operating mode for parallel data transfer applications requiring fast access times and output enable functionality.
72V273L7-5BCGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
SN74ACT3632-15PQR
SN74ACT3632-15PQR by Texas Instruments is a FIFO with 512x36 organization, 15 ns cycle time, and 11 ns max access time. It operates synchronously at a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7201LA25SOI8
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
72V05L15JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
74HC40105D,652
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
IDT7202LA35SO8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
5962-9560801NXX
Texas Instruments' 5962-9560801NXX FIFO operates synchronously with a cycle time of 20ns and clock frequency up to 50MHz. Ideal for military applications, it features a memory density of 36864 bits, operating temperature range from -55 to 125°C, and low profile flatpack packaging.
SN74ABT7819-30PNR
SN74ABT7819-30PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 30.03 ns and offers 3-STATE output characteristics. This device is suitable for applications requiring synchronous operation and a memory density of 9216 bit in commercial temperature grade environments.
72V835L15PF8
72V835L15PF8 by Integrated Device Technology is a FIFO with 2KX18 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for applications requiring fast synchronous data transfer in commercial temperature grade environments.
72V211L15PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
SN74ACT2235-30FN
SN74ACT2235-30FN by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 30ns cycle time and 33MHz clock frequency. It features a memory density of 9216 bit and is ideal for applications requiring bi-directional FIFO memory with parallel operation.
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NXP Semiconductors
74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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