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74HC40105D,653

NXP Semiconductors

74HC40105D,653 by NXP Semiconductors

NXP Semiconductors' 74HC40105D,653 FIFO chip operates asynchronously with a cycle time of 71.428 ns and a clock frequency of up to 14 MHz. This CMOS technology device has a memory width of 4 bits and is ideal for automotive applications due to its wide temperature range from -40°C to 125°C.

Median Price

$0.431

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 6,254 parts In-Stock

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$0.431

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$0.405

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$0.366

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Distributors (In-Stock)

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Nova Conductors

Japan . 55 parts In-Stock

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$0.395

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Digiode

USA . 3,793 parts In-Stock

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Chip Stock

USA . 171,000 parts In-Stock

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Vyrian

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VNN

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Anansix

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,028 parts In-Stock

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$0.366

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Corphita

USA . 4,534 parts In-Stock

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Argo Parts USA

USA . 1,246 parts In-Stock

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$0.395

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$0.384

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Netroflash

USA . 500 parts In-Stock

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$0.395

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$0.376

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$0.368

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$0.395

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$0.368

Continental Prestige Electronics

USA . 6 parts In-Stock

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$0.395

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AZTECH Wire

Italy . 10,899 parts In-Stock

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$0.430

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QUARKTWIN TECHNOLOGY LTD

USA . 16,659 parts In-Stock

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Microchip USA

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UNI Independent Distributors

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Supply Digital

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Overview

Unlock a world of seamless data storage and retrieval with the NXP Semiconductors 74HC40105D,653 FIFO memory chip. Designed for reliability and efficiency, this high-quality component offers fast cycle times and a wide operating temperature range, making it perfect for automotive applications. With its small outline package and dual terminal position, this FIFO chip is versatile and easy to integrate into your designs. Experience the benefits of 3-STATE output characteristics and parallel operation, providing you with maximum flexibility and performance. Trust NXP Semiconductors for top-tier technology that delivers value and innovation at every turn.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the FIFO, ensuring reliable performance and longevity.

Cycle Time: 71.428 ns

Fast cycle time of 71.428 ns allows for quick data transfer and processing, making the FIFO efficient for high-speed applications.

Nominal Supply Voltage / Vsup: 4.5V

Operating at a nominal supply voltage of 4.5V makes the FIFO compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the FIFO can withstand high heat environments, making it suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the FIFO.

Output Enable: YES

The output enable feature allows for convenient control over the data output, enabling seamless integration with other components and systems.

Technical Specifications

FIFO 74HC40105D,653 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

600 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 750NS

Maximum Clock Frequency (fCLK):

14 MHz

Cycle Time:

71.428 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74HC40105D,653 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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