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SN74ACT7204-30FM

Texas Instruments

SN74ACT7204-30FM by Texas Instruments

SN74ACT7204-30FM by Texas Instruments is a FIFO chip with 4Kx9 organization, 25 MHz clock frequency, and 30 ns access time. It operates at 5V, has 32 terminals in a chip carrier package, and is ideal for commercial applications requiring fast asynchronous data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,243 parts In-Stock

1+ parts

-

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3,243

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Digiode

USA . 2,022 parts In-Stock

1+ parts

-

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2,022

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 526 parts In-Stock

1+ parts

$4.530

100+ parts

-

1k+ parts

$4.976

10k+ parts

-

526

$4.530

-

$4.976

-

DigiPath Technology Company

USA . 153 parts In-Stock

1+ parts

$4.988

100+ parts

$4.589

1k+ parts

-

10k+ parts

-

153

$4.988

$4.589

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ChromeModa Solutions

Germany . 6,651 parts In-Stock

1+ parts

$5.090

100+ parts

$4.174

1k+ parts

-

10k+ parts

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6,651

$5.090

$4.174

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

1+ parts

$5.090

100+ parts

-

1k+ parts

$4.581

10k+ parts

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1,504

$5.090

-

$4.581

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AZTECH Wire

Italy . 434 parts In-Stock

1+ parts

$7.876

100+ parts

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434

$7.876

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One Stop Electronics

USA . 447 parts In-Stock

1+ parts

$19.000

100+ parts

-

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447

$19.000

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Corphita

USA . 4,158 parts In-Stock

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4,158

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Overview

Enhance your electronic designs with the SN74ACT7204-30FM FIFO chip from Texas Instruments, a leading manufacturer known for quality and reliability. This versatile component offers seamless data transfer in a compact package, making it ideal for various applications in consumer electronics, industrial automation, and telecommunications. Experience the value of improved efficiency and performance with the SN74ACT7204-30FM, providing significant benefits and advantages to customers seeking superior functionality in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable or rugged applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent read and write operations, providing flexibility and efficiency in data transfer.

Maximum Clock Frequency (fCLK): 25 MHz

With a maximum clock frequency of 25 MHz, this FIFO product can handle high-speed data transfer and processing, making it suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, ensuring reliable operation and energy efficiency.

Memory Density: 36864 bit

The high memory density of 36864 bit allows for storing a large amount of data in a compact form, making this FIFO product efficient in space utilization.

Technical Specifications

FIFO SN74ACT7204-30FM attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

30 ns

Maximum Clock Frequency (fCLK):

25 MHz

JESD-30 Code:

R-PQCC-J32

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

9

No. of Terminals:

32

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX9

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7204-30FM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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