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SN74ACT72211L-20RJ

Texas Instruments

SN74ACT72211L-20RJ by Texas Instruments

SN74ACT72211L-20RJ by Texas Instruments is a FIFO chip with 512x9 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V and has a max access time of 12ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$17.975

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$14.380

1k+ parts

$12.870

10k+ parts

$12.110

56

-

$14.380

$12.870

$12.110

DigiKey

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$18.930

1k+ parts

-

10k+ parts

-

56

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$18.930

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Verical

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$17.975

1k+ parts

$16.087

10k+ parts

$15.137

56

-

$17.975

$16.087

$15.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,602 parts In-Stock

1+ parts

$15.181

100+ parts

-

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1,602

$15.181

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Vyrian

USA . 7,593 parts In-Stock

1+ parts

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7,593

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DigiKey Marketplace

USA . 56 parts In-Stock

1+ parts

-

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-

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56

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 104 parts In-Stock

1+ parts

$3.362

100+ parts

-

1k+ parts

$3.890

10k+ parts

-

104

$3.362

-

$3.890

-

ChromeModa Solutions

Germany . 3,122 parts In-Stock

1+ parts

$3.778

100+ parts

$3.098

1k+ parts

-

10k+ parts

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3,122

$3.778

$3.098

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IDEA Electronic Components Group

UK . 660 parts In-Stock

1+ parts

$3.778

100+ parts

-

1k+ parts

$3.400

10k+ parts

-

660

$3.778

-

$3.400

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Corphita

USA . 3,065 parts In-Stock

1+ parts

$14.382

100+ parts

-

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3,065

$14.382

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Microchip USA

USA . 1,039 parts In-Stock

1+ parts

$42.950

100+ parts

$42.340

1k+ parts

$42.030

10k+ parts

$41.720

1,039

$42.950

$42.340

$42.030

$41.720

DigiPath Technology Company

USA . 1,509 parts In-Stock

1+ parts

-

100+ parts

$3.406

1k+ parts

-

10k+ parts

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1,509

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$3.406

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Overview

Experience unparalleled performance and reliability with the SN74ACT72211L-20RJ by Texas Instruments, a leading manufacturer known for cutting-edge technology. As a FIFO device, this chip carrier offers fast cycle times and synchronous operation, making it ideal for a wide range of applications. With a 512x9 organization, 3-state output characteristics, and a maximum clock frequency of 50 MHz, this commercial-grade CMOS technology ensures seamless data transmission. Enhance your project with the value and benefits of this high-quality component, delivering efficiency and precision to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FIFO, ensuring reliable performance.

Cycle Time: 20 ns

Fast cycle time allows for quick data processing and efficient operation of the FIFO.

No. of Terminals: 32

Sufficient number of terminals for connecting the FIFO to other components in a system.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperature environments, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the FIFO.

Memory Density: 4608 bit

High memory density allows for storing a large amount of data in the FIFO.

Output Enable: YES

Enables control over the output of the FIFO, providing flexibility in data retrieval.

Maximum Access Time: 12 ns

Quick access time ensures fast retrieval of data from the FIFO, improving overall system performance.

Technical Specifications

FIFO SN74ACT72211L-20RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

4608 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

140 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72211L-20RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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