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SN74ACT3641-30PCBR

Texas Instruments

SN74ACT3641-30PCBR by Texas Instruments

SN74ACT3641-30PCBR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data access times and synchronous operation, suitable for commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,674 parts In-Stock

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Digiode

USA . 139 parts In-Stock

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139

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Parana Technologies

USA . 1,258 parts In-Stock

1+ parts

$5.064

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-

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$5.632

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1,258

$5.064

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$5.632

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$5.576

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$5.130

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$5.576

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ChromeModa Solutions

Germany . 3,107 parts In-Stock

1+ parts

$5.690

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$4.666

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3,107

$5.690

$4.666

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IDEA Electronic Components Group

UK . 1,552 parts In-Stock

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$5.690

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$5.121

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$5.121

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AZTECH Wire

Italy . 771 parts In-Stock

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$7.497

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771

$7.497

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One Stop Electronics

USA . 833 parts In-Stock

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$16.000

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$16.000

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Corphita

USA . 1,705 parts In-Stock

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Overview

Unlock unparalleled speed and reliability with the SN74ACT3641-30PCBR FIFO by Texas Instruments. Built with precision and expertise, this high-quality FIFO device offers seamless data storage and retrieval for a wide range of applications. From telecommunications to industrial automation, this product ensures optimal performance and efficiency. Experience the value of fast cycle times, synchronous operation, and 3-STATE output characteristics. Trust in Texas Instruments to deliver top-tier technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards without the need for additional hardware.

Cycle Time: 30 ns

Fast cycle time ensures efficient data processing and transfer.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supply voltage for easy integration.

No. of Terminals: 120

Sufficient number of terminals for connecting to other components in the circuit.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, suitable for various environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed for efficient performance.

Output Enable: YES

Output enable feature provides control over data output, increasing flexibility.

Technical Specifications

FIFO SN74ACT3641-30PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

36864 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ACT3641-30PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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