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SN74ABT7820-20PN

Texas Instruments

SN74ABT7820-20PN by Texas Instruments

SN74ABT7820-20PN by Texas Instruments is a FIFO with 512x18 organization, operating at 50 MHz. It features a cycle time of 20 ns and operates in synchronous mode. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

$19.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

$16.790

1k+ parts

$15.020

10k+ parts

$14.140

2,740

-

$16.790

$15.020

$14.140

DigiKey

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

$19.410

1k+ parts

-

10k+ parts

-

2,740

-

$19.410

-

-

Verical

USA . 1,263 parts In-Stock

1+ parts

-

100+ parts

$20.988

1k+ parts

$18.775

10k+ parts

$17.675

1,263

-

$20.988

$18.775

$17.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,395 parts In-Stock

1+ parts

$17.727

100+ parts

-

1k+ parts

-

10k+ parts

-

3,395

$17.727

-

-

-

Vyrian

USA . 2,348 parts In-Stock

1+ parts

$18.660

100+ parts

-

1k+ parts

-

10k+ parts

-

2,348

$18.660

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 321 parts In-Stock

1+ parts

$4.712

100+ parts

-

1k+ parts

$5.203

10k+ parts

-

321

$4.712

-

$5.203

-

ChromeModa Solutions

Germany . 6,866 parts In-Stock

1+ parts

$5.294

100+ parts

$4.341

1k+ parts

-

10k+ parts

-

6,866

$5.294

$4.341

-

-

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$5.294

100+ parts

-

1k+ parts

$4.765

10k+ parts

-

1,094

$5.294

-

$4.765

-

Andel Nordic

Denmark . 2,857 parts In-Stock

1+ parts

$6.534

100+ parts

-

1k+ parts

$6.273

10k+ parts

$6.273

2,857

$6.534

-

$6.273

$6.273

Corphita

USA . 2,726 parts In-Stock

1+ parts

$16.794

100+ parts

-

1k+ parts

-

10k+ parts

-

2,726

$16.794

-

-

-

Kepictronics

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

-

-

-

-

DigiPath Technology Company

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$4.773

1k+ parts

-

10k+ parts

-

360

-

$4.773

-

-

Microchip USA

USA . 122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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122

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Overview

Discover the cutting-edge technology of the SN74ABT7820-20PN by Texas Instruments, a high-quality FIFO memory IC designed to optimize data storage and retrieval processes. With its reliable performance and innovative design, this product is ideal for a wide range of applications in various industries. Texas Instruments, known for its commitment to excellence and innovation, ensures that customers receive top-notch products that deliver superior functionality and value. Enhance your systems with the SN74ABT7820-20PN and experience seamless operation, increased efficiency, and improved overall performance. Elevate your projects with Texas Instruments' trusted solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product durable and lightweight.

Cycle Time: 20 ns

The fast cycle time of 20ns ensures efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources.

Organization: 512X18

The organization of 512 words by 18 bits allows for efficient storage and retrieval of data.

Memory IC Type: BI-DIRECTIONAL FIFO

The memory IC type of bi-directional FIFO enables data to be read and written in both directions, increasing flexibility.

Maximum Clock Frequency (fCLK): 50 MHz

The high maximum clock frequency of 50MHz allows for fast data processing and communication.

Output Enable: YES

The output enable feature allows for control over the output of data, enhancing flexibility in operation.

Technical Specifications

FIFO SN74ABT7820-20PN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13.5 ns

Additional Features:

BYPASS XCVR

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SN74ABT7820-20PN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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