Loading...

SN74ACT7200L25RJ

Texas Instruments

SN74ACT7200L25RJ by Texas Instruments

SN74ACT7200L25RJ by Texas Instruments is a FIFO chip with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in applications requiring fast asynchronous data transfer, such as communication systems and data processing equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,313

-

-

-

-

Digiode

USA . 863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

863

-

-

-

-

Bristol Electronics

USA . 559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

559

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 12 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

$5.025

10k+ parts

-

12

$4.572

-

$5.025

-

DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$5.034

100+ parts

$4.632

1k+ parts

-

10k+ parts

-

1,752

$5.034

$4.632

-

-

ChromeModa Solutions

Germany . 6,035 parts In-Stock

1+ parts

$5.137

100+ parts

$4.212

1k+ parts

-

10k+ parts

-

6,035

$5.137

$4.212

-

-

IDEA Electronic Components Group

UK . 1,894 parts In-Stock

1+ parts

$5.137

100+ parts

-

1k+ parts

$4.623

10k+ parts

-

1,894

$5.137

-

$4.623

-

AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$13.383

100+ parts

-

1k+ parts

-

10k+ parts

-

786

$13.383

-

-

-

One Stop Electronics

USA . 159 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$27.000

-

-

-

Corphita

USA . 1,966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,966

-

-

-

-

Overview

Elevate your projects with the SN74ACT7200L25RJ FIFO by Texas Instruments, a reliable and high-quality memory IC that offers seamless data storage and retrieval. Designed with precision and expertise, Texas Instruments ensures top-notch performance and durability in every product they release. From industrial automation to telecommunications, this FIFO device caters to a wide range of applications, providing customers with unparalleled value and efficiency. Say goodbye to data bottlenecks and hello to smooth operations with the SN74ACT7200L25RJ - your trusted companion in data management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for use in electronic devices.

Cycle Time: 35 ns

The fast cycle time of 35 ns ensures quick data transfer, making this FIFO ideal for applications that require high-speed processing.

Nominal Supply Voltage / Vsup: 5V

The nominal supply voltage of 5V ensures stable and reliable operation of the FIFO in various electronic systems.

Memory Width: 9

With a memory width of 9, this FIFO can store and process data efficiently, making it suitable for handling a wide range of data types.

Maximum Clock Frequency (fCLK): 28.5 MHz

The high maximum clock frequency of 28.5 MHz allows for speedy data transfers and processing, making this FIFO suitable for high-performance applications.

Technical Specifications

FIFO SN74ACT7200L25RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.4554 mm

Trade Compliance

SN74ACT7200L25RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20