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SN74ABT7819-15PNR

Texas Instruments

SN74ABT7819-15PNR by Texas Instruments

SN74ABT7819-15PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 14.92ns, synchronous mode, and 3-STATE output characteristics. This device is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,621 parts In-Stock

1+ parts

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5,621

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Digiode

USA . 2,185 parts In-Stock

1+ parts

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2,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,076 parts In-Stock

1+ parts

$3.543

100+ parts

-

1k+ parts

$4.066

10k+ parts

-

1,076

$3.543

-

$4.066

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ChromeModa Solutions

Germany . 5,407 parts In-Stock

1+ parts

$3.981

100+ parts

$3.264

1k+ parts

-

10k+ parts

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5,407

$3.981

$3.264

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

1+ parts

$3.981

100+ parts

-

1k+ parts

$3.583

10k+ parts

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1,832

$3.981

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$3.583

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AZTECH Wire

Italy . 485 parts In-Stock

1+ parts

$8.850

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485

$8.850

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One Stop Electronics

USA . 609 parts In-Stock

1+ parts

$30.000

100+ parts

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609

$30.000

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

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100+ parts

$3.589

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710

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$3.589

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Corphita

USA . 407 parts In-Stock

1+ parts

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407

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Overview

Enhance your electronic projects with the SN74ABT7819-15PNR FIFO by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of innovative solutions for various applications. This FIFO device boasts fast cycle times, synchronous operation, and 3-state output characteristics. Perfect for high-speed data transfer, this product ensures seamless performance and efficient data management. Upgrade your designs with the SN74ABT7819-15PNR and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the components inside.

Cycle Time: 14.92 ns

Fast cycle time ensures efficient operation and quick data access.

Nominal Supply Voltage: 5V

Operates at a standard voltage, making it compatible with most systems.

No. of Terminals: 80

Ample number of terminals for connectivity and data transfer.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without compromising performance.

Technology: BICMOS

Utilizes BiCMOS technology for improved efficiency and speed.

Output Enable: YES

Output enable feature allows for control over data output.

Technical Specifications

FIFO SN74ABT7819-15PNR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Cycle Time:

14.92 ns

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

9216 bit

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

SN74ABT7819-15PNR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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