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IDT72V05L25JI8

Integrated Device Technology

IDT72V05L25JI8 by Integrated Device Technology

IDT72V05L25JI8 by Integrated Device Technology is a FIFO chip with 8Kx9 organization, operating at 3.3V. It features a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data storage and retrieval in parallel mode.

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Overview

Enhance your electronic designs with the IDT72V05L25JI8 FIFO from Integrated Device Technology. Known for their top-quality products, IDT offers a reliable solution for data buffering and storage needs. Ideal for industrial applications, this asynchronous FIFO chip provides a seamless interface for parallel data transfer at a maximum clock frequency of 28.5 MHz. With a wide operating temperature range and low power consumption, the IDT72V05L25JI8 ensures optimal performance and efficiency. Upgrade your systems today with this versatile and efficient FIFO solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards.

Cycle Time: 35 ns

With a fast cycle time of 35 ns, this FIFO is capable of high-speed data transfer.

Package Shape: RECTANGULAR

The rectangular shape of the package enables space-efficient integration into electronic systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with a wide range of systems.

Power Supplies (V): 3.3

The 3.3V power supply offers efficient power management for the product.

No. of Terminals: 32

The 32 terminals provide ample connectivity options for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and lightweight design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this FIFO can withstand harsh environments.

Organization: 8KX9

The 8KX9 organization ensures efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn85Pb15)

The tin/lead terminal finish provides excellent solderability and conductivity.

Terminal Position: QUAD

The quad terminal position facilitates easy connection to external devices.

Maximum Seated Height: 3.556 mm

The compact maximum seated height makes this FIFO suitable for space-constrained applications.

Maximum Clock Frequency (fCLK): 28.5 MHz

The high maximum clock frequency of 28.5 MHz enables rapid data processing.

Width: 11.4554 mm

The width of 11.4554 mm allows for easy integration into circuit layouts.

Minimum Supply Voltage (Vsup): 3 V

The 3V minimum supply voltage ensures consistent performance in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 20

The 20-second maximum time at peak reflow temperature ensures proper solder reflow during installation.

Peak Reflow Temperature °C: 225

The high peak reflow temperature of 225C ensures secure solder joints for reliability.

Length: 13.9954 mm

The length of 13.9954 mm offers a compact footprint for space-saving designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this FIFO suitable for rugged environments.

Technology: CMOS

The CMOS technology ensures efficient power usage and high-speed data processing.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for simultaneous and fast data exchange.

Terminal Form: J BEND

The J bend terminal form provides secure connections and ease of soldering.

Maximum Supply Current: 50 mA

The 50 mA maximum supply current ensures stable operation under varying load conditions.

No. of Words: 8192 words

The 8192-word capacity offers ample storage for data-intensive applications.

Memory Width: 9

The 9 memory width provides sufficient data storage capacity for diverse requirements.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy connection and board layout.

No. of Words Code: 8K

The 8K word code denotes the capacity of the FIFO for efficient data management.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage ensures safe operation within specified limits.

Memory Density: 73728 bit

The high memory density of 73728 bits allows for extensive data storage capacity.

Memory IC Type: OTHER FIFO

The use of a specialized FIFO memory IC type offers unique features for specific applications.

Maximum Standby Current: 0.005 Amp

The low maximum standby current of 0.005 Amp ensures minimal power consumption during idle periods.

Maximum Access Time: 25 ns

The fast maximum access time of 25 ns enables quick retrieval of stored data.

Technical Specifications

FIFO IDT72V05L25JI8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.9954 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.556 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.4554 mm

Trade Compliance

IDT72V05L25JI8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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