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SN74ACT7206L50RJ

Texas Instruments

SN74ACT7206L50RJ by Texas Instruments

SN74ACT7206L50RJ by Texas Instruments is a FIFO chip with 16Kx9 organization, operating at 15 MHz with a cycle time of 65 ns. It has a memory density of 147456 bits and is suitable for applications requiring fast asynchronous data transfer in commercial temperature environments.

Median Price

$16.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,284 parts In-Stock

1+ parts

-

100+ parts

$12.820

1k+ parts

$11.470

10k+ parts

$10.790

3,284

-

$12.820

$11.470

$10.790

DigiKey

USA . 3,284 parts In-Stock

1+ parts

-

100+ parts

$16.860

1k+ parts

-

10k+ parts

-

3,284

-

$16.860

-

-

Verical

USA . 2,560 parts In-Stock

1+ parts

-

100+ parts

$16.025

1k+ parts

$14.338

10k+ parts

$13.488

2,560

-

$16.025

$14.338

$13.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,191 parts In-Stock

1+ parts

$13.528

100+ parts

-

1k+ parts

-

10k+ parts

-

4,191

$13.528

-

-

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Vyrian

USA . 4,324 parts In-Stock

1+ parts

$14.240

100+ parts

-

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10k+ parts

-

4,324

$14.240

-

-

-

DigiKey Marketplace

USA . 3,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,284

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

$3.232

100+ parts

-

1k+ parts

$3.755

10k+ parts

-

1,082

$3.232

-

$3.755

-

DigiPath Technology Company

USA . 2,185 parts In-Stock

1+ parts

$3.559

100+ parts

-

1k+ parts

-

10k+ parts

-

2,185

$3.559

-

-

-

ChromeModa Solutions

Germany . 3,570 parts In-Stock

1+ parts

$3.632

100+ parts

$2.978

1k+ parts

-

10k+ parts

-

3,570

$3.632

$2.978

-

-

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$3.632

100+ parts

-

1k+ parts

$3.269

10k+ parts

-

179

$3.632

-

$3.269

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Ampacity Inc.

Singapore . 2,884 parts In-Stock

1+ parts

$12.100

100+ parts

-

1k+ parts

-

10k+ parts

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2,884

$12.100

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-

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Corphita

USA . 3,645 parts In-Stock

1+ parts

$12.816

100+ parts

-

1k+ parts

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10k+ parts

-

3,645

$12.816

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-

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Overview

Unlock seamless data transfer and optimize your system performance with the SN74ACT7206L50RJ FIFO chip by Texas Instruments. Designed with precision and reliability in mind, this versatile component offers a fast cycle time of 65 ns, ensuring efficient operation in various applications. With a nominal supply voltage of 5V and a maximum clock frequency of 15 MHz, this chip delivers exceptional value and benefits to customers seeking high-quality memory solutions. Whether you're in the industrial, automotive, or consumer electronics sector, the SN74ACT7206L50RJ is the perfect choice for enhancing your device's functionality and speed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Cycle Time: 65 ns

Fast cycle time ensures efficient data transfer and processing, essential for high-speed applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent read and write operations, providing flexibility and efficiency in data handling.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures reliable performance and compatibility with standard power sources.

No. of Words: 16384 words

Large word capacity enables storage and retrieval of a significant amount of data, suitable for applications requiring extensive memory.

Maximum Clock Frequency (fCLK): 15 MHz

High clock frequency allows for rapid data access and processing, making the product suitable for demanding tasks.

Memory Density: 147456 bit

High memory density provides ample storage capacity for data, ensuring efficient operation and data management.

Maximum Access Time: 50 ns

Low access time ensures quick retrieval of data, enhancing the overall performance and responsiveness of the product.

Technical Specifications

FIFO SN74ACT7206L50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

Cycle Time:

65 ns

JESD-30 Code:

R-PQCC-J32

Memory Density:

147456 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7206L50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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