Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 72V241L10PFG is a FIFO memory with 4Kx9 organization, operating at 100MHz clock frequency and 10ns cycle time. It is used in applications requiring fast synchronous data storage and retrieval, such as networking equipment and communication systems.
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PLASTIC/EPOXY - This material provides a lightweight yet durable construction for the product, making it ideal for various applications.
YES - The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.
10 ns - With a fast cycle time, this FIFO ensures efficient data processing and transfer, enhancing overall system speed and performance.
SQUARE - The square shape of the package offers optimal space utilization and easy integration into compact designs.
SYNCHRONOUS - The synchronous operation of this FIFO ensures precise data synchronization, reducing the risk of errors in data transmission.
3.3 - The nominal supply voltage of 3.3V provides stable power delivery, ensuring reliable operation of the product.
3.3 - The consistent power supply at 3.3V enhances the reliability and performance of the FIFO.
32 - With 32 terminals, this FIFO offers ample connectivity options for seamless integration into complex systems.
FLATPACK, LOW PROFILE - The flatpack, low profile design of the package allows for space-saving installation in tight spaces.
70 °C - The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments.
4KX9 - The organized structure of 4KX9 facilitates efficient data storage and retrieval, improving overall system efficiency.
0 °C - The low minimum operating temperature of 0°C ensures the FIFO can be used in a wide range of operating conditions.
Matte Tin (Sn) - annealed - The matte tin finish provides corrosion resistance and ensures long-term durability of the terminals.
QUAD - The quad terminal position offers secure and stable connections for reliable data transmission.
1.6 mm - The low maximum seated height allows for compact and space-efficient PCB designs.
100 MHz - The high maximum clock frequency of 100MHz enables fast data processing and transfer rates.
7 mm - The compact width of 7mm makes this FIFO suitable for applications with limited space availability.
3 V - The minimum supply voltage of 3V ensures the FIFO can operate efficiently even at lower power levels.
30 - The FIFO can withstand peak reflow temperatures for up to 30 seconds, ensuring durability during assembly processes.
260 - The high peak reflow temperature of 260°C allows for reliable soldering during assembly, ensuring a strong connection.
7 mm - The compact length of 7mm makes this FIFO suitable for applications where space is limited.
COMMERCIAL - The commercial temperature grade ensures reliable operation in standard operating conditions.
CMOS - The CMOS technology used in this FIFO offers low power consumption and high noise immunity, improving overall efficiency.
PARALLEL - The parallel data transfer mode offers fast and efficient data processing capabilities, suitable for high-speed applications.
GULL WING - The gull wing terminal form provides secure soldering connections and reliable data transmission.
20 mA - The low maximum supply current of 20mA ensures efficient power consumption for energy-saving operation.
4096 words - The large number of words supported by this FIFO enables extensive data storage and processing capabilities.
9 - The memory width of 9 provides ample storage capacity for data-intensive applications.
0.8 mm - The tight terminal pitch of 0.8mm allows for compact design layouts and efficient PCB integration.
4K - The 4K words code offers a standardized format for data storage and retrieval, simplifying system integration.
3 - The MSL 3 rating ensures the FIFO can withstand moderate moisture exposure without compromising performance.
3.6 V - The maximum supply voltage of 3.6V provides flexibility for operation in varying power conditions.
36864 bit - The high memory density of 36864 bits allows for extensive data storage capacity, suitable for demanding applications.
OTHER FIFO - The use of specialized FIFO memory IC type ensures efficient data handling and transfer within the system.
YES - The output enable feature allows for flexible control over data output, enhancing system functionality.
0.005 Amp - The low maximum standby current of 0.005A ensures energy-efficient operation during idle periods.
6.5 ns - The fast maximum access time of 6.5ns ensures quick data retrieval and processing, contributing to overall system speed.
FIFO 72V241L10PFG attributes and parameters. Explore more FIFO devices from Renesas Electronics
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72V241L10PFG Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Label Chg 1/Dec/2022
PCN Assembly/Origin - Alternate Assembly Facility 14/Apr/2016
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
EU2B-YS3203F
Idec
ROTARY SWITCH;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
USB2514BI-AEZG
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Microsemi
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
IDT72V275L10PFG8
Integrated Device Technology
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V;
72V2105L10PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74ACT3642-20PCB
SN74ACT3642-20PCB by Texas Instruments is a FIFO memory with 1Kx36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a CMOS technology, operates at 5V supply voltage, and has a memory density of 36864 bits. This device is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
7200L25SOI8
7200L25SOI8 FIFO by Integrated Device Technology features a cycle time of 35ns, operating at 5V with an organization of 256X9. Ideal for industrial applications requiring fast data storage and retrieval, this CMOS technology device offers a parallel interface with a clock frequency of up to 28.5MHz.
72V275L10TFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
IDT7201LA12PDG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
7202LA15JI8
7202LA15JI8 by Integrated Device Technology is a FIFO chip with 1KX9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and memory density of 9216 bit. Ideal for industrial applications requiring fast data processing and storage in parallel mode.
SN74ACT3641-30PCB
SN74ACT3641-30PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, operating at 30ns cycle time and 33.4MHz clock frequency. It is designed for parallel applications requiring fast data access and features a 5V nominal voltage.
72V821L15TFI8
72V821L15TFI8 by Integrated Device Technology is a FIFO memory with a cycle time of 15 ns and an operating frequency of up to 66.7 MHz. It is commonly used in industrial applications that require high-speed data buffering and storage.
72V841L10TFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
SN74ACT72235-40FN
SN74ACT72235-40FN by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square chip carrier package with surface mount capability.
SN74ACT72211L35RJ
SN74ACT72211L35RJ by Texas Instruments is a 512x9 FIFO chip with synchronous operation and 5V nominal voltage. It features a memory density of 4608 bits, operates in commercial temperature grade up to 70°C, and supports parallel data transfer. This chip is commonly used in applications requiring high-speed data buffering and storage.
IDT72V211L15JI8
IDT72V211L15JI8 by Integrated Device Technology is a FIFO chip with 512x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is used in industrial applications requiring synchronous operation and a memory density of 4608 bit.
7203L25JI8
7203L25JI8 by Integrated Device Technology is a FIFO chip with 2KX9 organization, operating at 5V. It has a cycle time of 35ns and max clock frequency of 28.5MHz. Ideal for industrial applications requiring fast data storage and retrieval in parallel mode.
IDT72V7280L10BBG
IDT72V7280L10BBG is a 16Kx72 FIFO with 10ns cycle time, operating in synchronous mode at 3.3V. It has a memory density of 1179648 bit and offers parallel access with an output enable feature. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
CD54HCT40105F3A
CD54HCT40105F3A by Texas Instruments is a 16x4 FIFO with 100ns cycle time, operating at 5V. It has a max clock frequency of 10MHz and is suitable for military-grade applications requiring synchronous operation.
IDT7280L15PA
IDT7280L15PA by Integrated Device Technology is a FIFO with 256x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates in asynchronous mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
SN54ALS236FK
SN54ALS236FK by Texas Instruments is a 64x4 FIFO chip with 40ns cycle time, operating at 5V. It features totem pole output, asynchronous mode, and military-grade temperature range. Ideal for applications requiring fast data storage and retrieval in harsh environments.
SN74ACT7206L-25RJR
SN74ACT7206L-25RJR by Texas Instruments is a 16Kx9 FIFO chip with a cycle time of 35ns, operating at 5V. It features an asynchronous mode, 3-STATE output characteristics, and parallel organization. This CMOS technology device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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Renesas Electronics
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
72V2105L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
72V2111L15PFGI
The Renesas Electronics 72V2111L15PFGI FIFO operates synchronously with a cycle time of 15 ns and a clock frequency of up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V211L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
72V2111L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V211L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 4608 bit;
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
72V241L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
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