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CD74HCT40105MT

Texas Instruments

CD74HCT40105MT by Texas Instruments

CD74HCT40105MT by Texas Instruments is a FIFO memory IC with 16x4 organization, operating at 5V. It has a cycle time of 100ns and max clock frequency of 10MHz. Ideal for military applications requiring synchronous operation and parallel data transfer.

Median Price

$0.688

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,370 parts In-Stock

1+ parts

-

100+ parts

$0.675

1k+ parts

$0.561

10k+ parts

$0.500

7,370

-

$0.675

$0.561

$0.500

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.701

10k+ parts

$0.625

4,000

-

-

$0.701

$0.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,417 parts In-Stock

1+ parts

$0.524

100+ parts

-

1k+ parts

-

10k+ parts

-

4,417

$0.524

-

-

-

Vyrian

USA . 8,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,590

-

-

-

-

DigiKey Marketplace

USA . 7,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,370

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,912 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

-

10k+ parts

-

4,912

$0.497

-

-

-

Parana Technologies

USA . 508 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

$3.854

10k+ parts

-

508

$3.330

-

$3.854

-

DigiPath Technology Company

USA . 1,508 parts In-Stock

1+ parts

$3.667

100+ parts

$3.374

1k+ parts

-

10k+ parts

-

1,508

$3.667

$3.374

-

-

ChromeModa Solutions

Germany . 1,207 parts In-Stock

1+ parts

$3.742

100+ parts

$3.068

1k+ parts

-

10k+ parts

-

1,207

$3.742

$3.068

-

-

IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$3.742

100+ parts

-

1k+ parts

$3.368

10k+ parts

-

822

$3.742

-

$3.368

-

AZTECH Wire

Italy . 1,207 parts In-Stock

1+ parts

$13.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,207

$13.900

-

-

-

Native Components

USA . 731 parts In-Stock

1+ parts

$44.689

100+ parts

-

1k+ parts

-

10k+ parts

$42.901

731

$44.689

-

-

$42.901

Northwest PG Solutions

USA . 991 parts In-Stock

1+ parts

$49.158

100+ parts

-

1k+ parts

-

10k+ parts

-

991

$49.158

-

-

-

Microchip USA

USA . 4,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,707

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,790

-

-

-

-

Overview

Experience seamless data transfer and efficient storage management with the CD74HCT40105MT by Texas Instruments. As a leader in innovative electronic solutions, Texas Instruments delivers top-notch quality and reliability. This FIFO device is perfect for applications requiring fast and synchronized operation, making it ideal for a wide range of industries. With its compact design and high performance capabilities, this product offers exceptional value and convenience to customers looking for a reliable solution to their data handling needs. Trust Texas Instruments to provide you with cutting-edge technology that simplifies your workflow and enhances your productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making the product suitable for a variety of applications.

Cycle Time: 100 ns

The fast cycle time of 100 ns ensures quick data access and processing, making this FIFO product efficient for high-speed operations.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures data is processed at a consistent pace, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable power to the product, ensuring reliable operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to function in a wide range of environments.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C makes the product compatible with standard soldering processes, simplifying manufacturing.

Memory Density: 64 bit

With a memory density of 64 bits, this FIFO product can store a significant amount of data efficiently.

Technical Specifications

FIFO CD74HCT40105MT attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

2250 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

100 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.16 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT40105MT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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