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SN74ACT72221L-50RJ

Texas Instruments

SN74ACT72221L-50RJ by Texas Instruments

SN74ACT72221L-50RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 20MHz clock frequency and 50ns cycle time. It has a memory density of 9216 bits and can operate in synchronous mode. This chip is commonly used in applications requiring fast data storage and retrieval in parallel processing systems.

Median Price

$13.963

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,244 parts In-Stock

1+ parts

-

100+ parts

$11.170

1k+ parts

$10.000

10k+ parts

$9.410

3,244

-

$11.170

$10.000

$9.410

DigiKey

USA . 3,244 parts In-Stock

1+ parts

-

100+ parts

$14.700

1k+ parts

-

10k+ parts

-

3,244

-

$14.700

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-

Verical

USA . 3,244 parts In-Stock

1+ parts

-

100+ parts

$13.963

1k+ parts

$12.500

10k+ parts

$11.762

3,244

-

$13.963

$12.500

$11.762

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,915 parts In-Stock

1+ parts

$11.799

100+ parts

-

1k+ parts

-

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-

4,915

$11.799

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Vyrian

USA . 2,201 parts In-Stock

1+ parts

$12.420

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-

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2,201

$12.420

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DigiKey Marketplace

USA . 3,244 parts In-Stock

1+ parts

-

100+ parts

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3,244

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Extreme Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 756 parts In-Stock

1+ parts

$4.227

100+ parts

-

1k+ parts

$4.663

10k+ parts

-

756

$4.227

-

$4.663

-

DigiPath Technology Company

USA . 2,143 parts In-Stock

1+ parts

$4.654

100+ parts

$4.282

1k+ parts

-

10k+ parts

-

2,143

$4.654

$4.282

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-

ChromeModa Solutions

Germany . 413 parts In-Stock

1+ parts

$4.749

100+ parts

$3.894

1k+ parts

-

10k+ parts

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413

$4.749

$3.894

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$4.749

100+ parts

-

1k+ parts

$4.274

10k+ parts

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194

$4.749

-

$4.274

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Ampacity Inc.

Singapore . 3,103 parts In-Stock

1+ parts

$10.560

100+ parts

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3,103

$10.560

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Corphita

USA . 983 parts In-Stock

1+ parts

$11.178

100+ parts

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983

$11.178

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Overview

Unlock seamless data transfer and enhanced performance with the SN74ACT72221L-50RJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This FIFO device is designed for synchronous operation and boasts a cycle time of just 50 ns. Ideal for a wide range of applications, this chip carrier package offers 1KX9 organization with 3-STATE output characteristics. Experience faster clock frequencies up to 20 MHz and maximize your efficiency with this high-quality product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components, making this FIFO product reliable and long-lasting.

Cycle Time: 50 ns

The fast cycle time of 50 ns ensures efficient data transfer and processing, making this FIFO suitable for high-speed applications.

Operational Mode: SYNCHRONOUS

The synchronous operation mode ensures synchronized data transfer, reducing the risk of data loss or corruption, making this FIFO ideal for synchronous data processing systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power supply systems, making this FIFO easy to integrate into existing setups.

Maximum Clock Frequency (fCLK): 20 MHz

The high maximum clock frequency of 20 MHz allows for fast data processing and throughput, making this FIFO suitable for time-sensitive applications.

Technical Specifications

FIFO SN74ACT72221L-50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

20 MHz

Cycle Time:

50 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72221L-50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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